TWI460199B - 難燃性含磷環氧樹脂組成物及其硬化物 - Google Patents

難燃性含磷環氧樹脂組成物及其硬化物 Download PDF

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Publication number
TWI460199B
TWI460199B TW099107407A TW99107407A TWI460199B TW I460199 B TWI460199 B TW I460199B TW 099107407 A TW099107407 A TW 099107407A TW 99107407 A TW99107407 A TW 99107407A TW I460199 B TWI460199 B TW I460199B
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TW
Taiwan
Prior art keywords
epoxy resin
phosphorus
weight
containing epoxy
flame
Prior art date
Application number
TW099107407A
Other languages
English (en)
Chinese (zh)
Other versions
TW201041928A (en
Inventor
Masao Gunji
Yukiyoshi Iyama
Ryuji Kadota
Atsuko Kaitou
Original Assignee
Nippon Steel & Sumikin Chem Co
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Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW201041928A publication Critical patent/TW201041928A/zh
Application granted granted Critical
Publication of TWI460199B publication Critical patent/TWI460199B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/14—Macromolecular materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Fireproofing Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Reinforced Plastic Materials (AREA)
TW099107407A 2009-04-01 2010-03-15 難燃性含磷環氧樹脂組成物及其硬化物 TWI460199B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009089483A JP5441477B2 (ja) 2009-04-01 2009-04-01 難燃性リン含有エポキシ樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
TW201041928A TW201041928A (en) 2010-12-01
TWI460199B true TWI460199B (zh) 2014-11-11

Family

ID=42828446

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099107407A TWI460199B (zh) 2009-04-01 2010-03-15 難燃性含磷環氧樹脂組成物及其硬化物

Country Status (5)

Country Link
JP (1) JP5441477B2 (ko)
KR (1) KR20120022730A (ko)
CN (1) CN102369229B (ko)
TW (1) TWI460199B (ko)
WO (1) WO2010114166A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5579008B2 (ja) * 2010-09-29 2014-08-27 新日鉄住金化学株式会社 リン含有エポキシ樹脂
SG11201408343TA (en) * 2012-06-15 2015-01-29 Nippon Steel & Sumikin Chem Co Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product
JP7037314B2 (ja) * 2017-09-26 2022-03-16 日鉄ケミカル＆マテリアル株式会社 リン含有エポキシ樹脂の製造方法
CN110643289A (zh) * 2019-10-10 2020-01-03 常州斯威克光伏新材料有限公司 一种耐高温阻燃胶膜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW438833B (en) * 1999-04-16 2001-06-07 Nat Science Council Phosphorus containing flame retardant advanced epoxy resins, preparation and cured epoxy resins thereof
TW555809B (en) * 2000-04-06 2003-10-01 Matsushita Electric Works Ltd Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6291627B1 (en) * 1999-03-03 2001-09-18 National Science Council Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
JP2001123049A (ja) * 1999-10-28 2001-05-08 Dainippon Ink & Chem Inc 難燃性エポキシ樹脂組成物
JP2002188066A (ja) * 2000-10-10 2002-07-05 Toray Ind Inc 半導体装置用接着剤組成物及びそれを用いた半導体装置用接着剤シート並びにカバーレイフィルム
WO2006006592A1 (ja) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW438833B (en) * 1999-04-16 2001-06-07 Nat Science Council Phosphorus containing flame retardant advanced epoxy resins, preparation and cured epoxy resins thereof
TW555809B (en) * 2000-04-06 2003-10-01 Matsushita Electric Works Ltd Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multilayer board

Also Published As

Publication number Publication date
CN102369229A (zh) 2012-03-07
KR20120022730A (ko) 2012-03-12
CN102369229B (zh) 2014-03-26
TW201041928A (en) 2010-12-01
JP5441477B2 (ja) 2014-03-12
JP2010241870A (ja) 2010-10-28
WO2010114166A1 (ja) 2010-10-07

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