TWI458927B - heat sink - Google Patents

heat sink Download PDF

Info

Publication number
TWI458927B
TWI458927B TW100106203A TW100106203A TWI458927B TW I458927 B TWI458927 B TW I458927B TW 100106203 A TW100106203 A TW 100106203A TW 100106203 A TW100106203 A TW 100106203A TW I458927 B TWI458927 B TW I458927B
Authority
TW
Taiwan
Prior art keywords
heat
heat transfer
pipes
plate
heat sink
Prior art date
Application number
TW100106203A
Other languages
English (en)
Chinese (zh)
Other versions
TW201144737A (en
Inventor
Shinichi Ito
Kenya Kawabata
Shinichi Furumoto
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of TW201144737A publication Critical patent/TW201144737A/zh
Application granted granted Critical
Publication of TWI458927B publication Critical patent/TWI458927B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW100106203A 2010-02-26 2011-02-24 heat sink TWI458927B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010041467 2010-02-26

Publications (2)

Publication Number Publication Date
TW201144737A TW201144737A (en) 2011-12-16
TWI458927B true TWI458927B (zh) 2014-11-01

Family

ID=44506770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100106203A TWI458927B (zh) 2010-02-26 2011-02-24 heat sink

Country Status (5)

Country Link
US (1) US20120247735A1 (ja)
JP (1) JP5684228B2 (ja)
CN (1) CN102484105A (ja)
TW (1) TWI458927B (ja)
WO (1) WO2011105364A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9157585B2 (en) 2012-03-28 2015-10-13 Milwaukee Electric Tool Corporation Area light
US9091402B2 (en) 2012-03-28 2015-07-28 Milwaukee Electric Tool Corporation Area light
US20150219400A1 (en) * 2012-12-06 2015-08-06 Furukawa Electric Co., Ltd. Heat sink
USD779694S1 (en) 2013-08-27 2017-02-21 Milwaukee Electric Tool Corporation Portable light
CN106134305B (zh) * 2014-06-24 2018-11-16 三菱电机株式会社 冷却装置
EP3604894A1 (en) 2015-02-04 2020-02-05 Milwaukee Electric Tool Corporation Light
JP5970581B1 (ja) * 2015-03-30 2016-08-17 株式会社フジクラ 携帯型電子機器用熱拡散板
US10378739B2 (en) 2015-04-24 2019-08-13 Milwaukee Electric Tool Corporation Stand light
US10775032B2 (en) 2015-07-01 2020-09-15 Milwaukee Electric Tool Corporation Area light
CN105258539B (zh) * 2015-10-09 2018-07-31 东莞汉旭五金塑胶科技有限公司 散热器
US10323831B2 (en) 2015-11-13 2019-06-18 Milwaukee Electric Tool Corporation Utility mount light
USD816252S1 (en) 2016-05-16 2018-04-24 Milwaukee Electric Tool Corporation Light
JP6749293B2 (ja) 2017-08-09 2020-09-02 ダイキン工業株式会社 冷凍装置の室外ユニット
US10433461B2 (en) 2017-10-30 2019-10-01 Google Llc High-performance electronics cooling system
CN116917685A (zh) * 2021-02-25 2023-10-20 尼得科株式会社 冷却装置
JP7261848B1 (ja) 2021-10-12 2023-04-20 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005114341A (ja) * 2003-09-12 2005-04-28 Furukawa Electric Co Ltd:The ヒートパイプを備えたヒートシンクおよびその製造方法
TWM309147U (en) * 2006-11-01 2007-04-01 Shine Huan Entpr Co Heat-sink device of CPU
TW200736888A (en) * 2006-03-17 2007-10-01 Foxconn Tech Co Ltd Heat dissipating device and base thereof
TWM325536U (en) * 2007-07-06 2008-01-11 Hon Hai Prec Ind Co Ltd Heat dissipater
TW200842559A (en) * 2007-04-27 2008-11-01 Foxconn Tech Co Ltd Heat dissipation device with heat pipe
TW200951688A (en) * 2008-06-06 2009-12-16 Foxconn Tech Co Ltd Heat dissipation device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
JP2000124374A (ja) * 1998-10-21 2000-04-28 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
US6807058B2 (en) * 2002-11-20 2004-10-19 International Business Machines Corporation Heat sink and combinations
JP4495021B2 (ja) * 2005-03-30 2010-06-30 古河電気工業株式会社 車両搭載用ヒートシンク
JP2007134472A (ja) * 2005-11-10 2007-05-31 Shinko Electric Ind Co Ltd 放熱板および半導体装置
US20080055855A1 (en) * 2006-09-06 2008-03-06 Vinod Kamath Heat sink for electronic components
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US20090159252A1 (en) * 2007-12-20 2009-06-25 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink having bumps for positioning heat pipes therein
CN101528018A (zh) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 散热装置及其制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005114341A (ja) * 2003-09-12 2005-04-28 Furukawa Electric Co Ltd:The ヒートパイプを備えたヒートシンクおよびその製造方法
TW200736888A (en) * 2006-03-17 2007-10-01 Foxconn Tech Co Ltd Heat dissipating device and base thereof
TWM309147U (en) * 2006-11-01 2007-04-01 Shine Huan Entpr Co Heat-sink device of CPU
TW200842559A (en) * 2007-04-27 2008-11-01 Foxconn Tech Co Ltd Heat dissipation device with heat pipe
TWM325536U (en) * 2007-07-06 2008-01-11 Hon Hai Prec Ind Co Ltd Heat dissipater
TW200951688A (en) * 2008-06-06 2009-12-16 Foxconn Tech Co Ltd Heat dissipation device

Also Published As

Publication number Publication date
JP5684228B2 (ja) 2015-03-11
WO2011105364A1 (ja) 2011-09-01
CN102484105A (zh) 2012-05-30
JPWO2011105364A1 (ja) 2013-06-20
US20120247735A1 (en) 2012-10-04
TW201144737A (en) 2011-12-16

Similar Documents

Publication Publication Date Title
TWI458927B (zh) heat sink
KR100993754B1 (ko) 반도체 디바이스
US20110232877A1 (en) Compact vapor chamber and heat-dissipating module having the same
TWI465885B (zh) heat sink
JP4466644B2 (ja) ヒートシンク
US10281220B1 (en) Heat sink with vapor chamber
TWI619430B (zh) heat sink
US20130206367A1 (en) Heat dissipating module
JP2011159662A (ja) 半導体装置
TWI498519B (zh) 散熱模組
TW201326719A (zh) 散熱裝置
JP2011091088A (ja) 発熱体の放熱構造、および該放熱構造を用いた半導体装置
JP6595531B2 (ja) ヒートシンクアッセンブリ
JP6003109B2 (ja) パワーモジュール
JP5546280B2 (ja) ヒートパイプ受熱部の接続部およびヒートパイプ受熱部の接続方法
JP4529703B2 (ja) 放熱構造および放熱部品
JP6178981B2 (ja) 冷却システム
KR20160036470A (ko) 외부 핀을 포함하는 소결 평판 방열 소자
JP2010016295A (ja) 半導体装置
JP4969979B2 (ja) ヒートシンク
KR200421435Y1 (ko) 다채널 평판형 히트파이프가 구비된 히트싱크
JP5227681B2 (ja) 半導体装置
JP2010034364A (ja) 冷却装置
TWM586460U (zh) 散熱裝置
TWI432131B (zh) 散熱裝置