TWI456022B - 導電性黏著薄膜及太陽電池組件(module) - Google Patents

導電性黏著薄膜及太陽電池組件(module) Download PDF

Info

Publication number
TWI456022B
TWI456022B TW096121384A TW96121384A TWI456022B TW I456022 B TWI456022 B TW I456022B TW 096121384 A TW096121384 A TW 096121384A TW 96121384 A TW96121384 A TW 96121384A TW I456022 B TWI456022 B TW I456022B
Authority
TW
Taiwan
Prior art keywords
adhesive film
conductive adhesive
conductive
solar cell
electrode
Prior art date
Application number
TW096121384A
Other languages
English (en)
Other versions
TW200811265A (en
Inventor
Takehiro Shimizu
Kaoru Okaniwa
Naoki Fukushima
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006232381A external-priority patent/JP2007214533A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200811265A publication Critical patent/TW200811265A/zh
Application granted granted Critical
Publication of TWI456022B publication Critical patent/TWI456022B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Photovoltaic Devices (AREA)

Claims (12)

  1. 一種導電性黏著薄膜,其係將太陽電池單元之表面電極、與配線構件以電連接用之導電性黏著薄膜;其特徵為:含有絕緣性黏著劑與導電性粒子,以該導電性粒子之平均粒徑為r(μm),該導電性黏著薄膜之厚度為t(μm)時,(t/r)之值為2.0~9.0的範圍內,該導電性粒子之平均粒徑r為12~20μm,該導電性粒子之含量,以該導電性黏著薄膜之全體積為基準,係1.7~15.6體積%。
  2. 如申請專利範圍第1項之導電性黏著薄膜,其中該導電性粒子之平均粒徑r在該表面電極的十點平均表面粗度Rz以上。
  3. 如申請專利範圍第1或2項之導電性黏著薄膜,其中該絕緣性黏著劑,以該絕緣性黏著劑全量為基準,係含有9~34質量%之橡膠成份者。
  4. 如申請專利範圍第1或2項之導電性黏著薄膜,其中彈性模數為0.5~4.0GPa。
  5. 如申請專利範圍第1或2項之導電性黏著薄膜,其中該導電性粒子之形狀為帶刺殼栗狀或球狀。
  6. 如申請專利範圍第1或2項之導電性黏著薄膜,其中該表面電極係母線電極。
  7. 如申請專利範圍第6項之導電性黏著薄膜,其係配置在該母線電極上。
  8. 如申請專利範圍第1或2項之導電性黏著薄膜,其中該表面電極係以含有銀之玻璃糊料所形成的電極。
  9. 一種太陽電池組件,其特徵為,其係具有具表面電極之複數太陽電池單元,藉由電連接於該表面電極上之配線構件串聯及/或並聯連接的構造之太陽電池組件;構成該太陽電池單元的晶圓為單結晶、多結晶或非結晶矽晶圓、或者化合物半導體晶圓,該表面電極與該配線構件,係藉由如申請專利範圍第1~8項中任一項之導電性黏著薄膜所連接。
  10. 如申請專利範圍第9項之太陽電池組件,其中該表面電極係母線電極。
  11. 如申請專利範圍第10項之太陽電池組件,其中,在該母線電極上配置該導電性黏著薄膜。
  12. 如申請專利範圍第9項之太陽電池組件,其中該表面電極係以含有銀之玻璃糊料所形成的電極。
TW096121384A 2006-08-29 2007-06-13 導電性黏著薄膜及太陽電池組件(module) TWI456022B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006232381A JP2007214533A (ja) 2006-01-16 2006-08-29 導電性接着フィルム及び太陽電池モジュール

Publications (2)

Publication Number Publication Date
TW200811265A TW200811265A (en) 2008-03-01
TWI456022B true TWI456022B (zh) 2014-10-11

Family

ID=39135643

Family Applications (3)

Application Number Title Priority Date Filing Date
TW100134798A TW201209130A (en) 2006-08-29 2007-06-13 Conductive bonding film and solar cell module
TW096121384A TWI456022B (zh) 2006-08-29 2007-06-13 導電性黏著薄膜及太陽電池組件(module)
TW100134797A TWI456023B (zh) 2006-08-29 2007-06-13 太陽電池組件之製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW100134798A TW201209130A (en) 2006-08-29 2007-06-13 Conductive bonding film and solar cell module

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100134797A TWI456023B (zh) 2006-08-29 2007-06-13 太陽電池組件之製造方法

Country Status (7)

Country Link
US (1) US9173302B2 (zh)
EP (1) EP2058868A4 (zh)
KR (2) KR101040002B1 (zh)
CN (2) CN101512781B (zh)
CA (1) CA2662202C (zh)
TW (3) TW201209130A (zh)
WO (1) WO2008026356A1 (zh)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI442583B (zh) * 2006-11-28 2014-06-21 Sanyo Electric Co 太陽電池模組
CN101483203B (zh) * 2007-12-27 2013-01-23 三洋电机株式会社 太阳能电池模块及其制造方法
CN101984764A (zh) * 2008-04-02 2011-03-09 爱多克产品股份有限公司 固定太阳能模件到基底上的体系与方法
CN101984752A (zh) * 2008-04-02 2011-03-09 爱多克产品股份有限公司 粘合剂组合物和固定组件到基底上的方法
JP5377019B2 (ja) * 2009-03-23 2013-12-25 三洋電機株式会社 太陽電池モジュールの製造方法
JP5436901B2 (ja) 2009-03-23 2014-03-05 三洋電機株式会社 太陽電池モジュールの製造方法
JP5446420B2 (ja) * 2009-04-21 2014-03-19 デクセリアルズ株式会社 太陽電池モジュール及びその製造方法
JPWO2010122875A1 (ja) 2009-04-21 2012-10-25 三洋電機株式会社 太陽電池モジュール
NO333507B1 (no) * 2009-06-22 2013-06-24 Condalign As Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand
JP5602498B2 (ja) 2009-07-30 2014-10-08 三洋電機株式会社 太陽電池モジュール
EP2790230A3 (en) * 2009-08-27 2015-01-14 National Institute of Advanced Industrial Science and Technology Integrated multi-junction photovoltaic device, and processes for producing same
US9390829B2 (en) 2010-01-25 2016-07-12 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US20110180138A1 (en) * 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US20110180139A1 (en) * 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
WO2011093321A1 (ja) * 2010-01-26 2011-08-04 三洋電機株式会社 太陽電池モジュール及びその製造方法
AU2011216964B2 (en) * 2010-02-17 2015-07-09 Basf Se Process for producing electrically conductive bonds between solar cells
JP5377409B2 (ja) * 2010-05-28 2013-12-25 三洋電機株式会社 太陽電池モジュール及びその製造方法
KR101110826B1 (ko) * 2010-08-17 2012-02-24 엘지전자 주식회사 태양전지 패널
KR101642152B1 (ko) * 2010-08-20 2016-07-22 엘지전자 주식회사 태양전지 모듈
US8338698B2 (en) * 2010-08-27 2012-12-25 Primestar Solar, Inc. Anisotropic conductive layer as a back contact in thin film photovoltaic devices
WO2012057125A1 (ja) * 2010-10-26 2012-05-03 三洋電機株式会社 太陽電池モジュールの製造方法
KR20120044541A (ko) * 2010-10-28 2012-05-08 엘지전자 주식회사 도전성 접착 필름, 상기 필름을 구비한 태양전지 패널 및 상기 패널의 제조 방법
JP2012119441A (ja) * 2010-11-30 2012-06-21 Sony Chemical & Information Device Corp 太陽電池モジュール及びその製造方法
US9224517B2 (en) 2011-04-07 2015-12-29 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US20120260981A1 (en) * 2011-04-14 2012-10-18 Hitachi Chemical Company, Ltd. Paste composition for electrode, photovoltaic cell element, and photovoltaic cell
US20120260982A1 (en) * 2011-04-14 2012-10-18 Hitachi Chemical Company, Ltd. Paste composition for electrode, photovoltaic cell element, and photovoltaic cell
KR101732633B1 (ko) * 2011-05-26 2017-05-04 엘지전자 주식회사 태양전지 모듈
JP2012253062A (ja) 2011-05-31 2012-12-20 Sanyo Electric Co Ltd 太陽電池モジュール及びその製造方法
KR101816163B1 (ko) * 2011-06-14 2018-01-08 엘지전자 주식회사 태양전지 모듈
JP5909667B2 (ja) * 2011-06-30 2016-04-27 パナソニックIpマネジメント株式会社 太陽電池モジュール及びその製造方法
JP2013038168A (ja) * 2011-08-05 2013-02-21 Three M Innovative Properties Co 太陽電池モジュールの製造方法
JP5840418B2 (ja) * 2011-08-23 2016-01-06 デクセリアルズ株式会社 導電性接着剤及び太陽電池モジュール
JP2013045994A (ja) * 2011-08-26 2013-03-04 Dexerials Corp 太陽電池用導電性接着剤及びこれを用いた接続方法、太陽電池モジュール、太陽電池モジュールの製造方法
JP2014531774A (ja) * 2011-09-29 2014-11-27 ダウ グローバル テクノロジーズ エルエルシー 光起電力セル相互接続
US20130118573A1 (en) * 2011-11-14 2013-05-16 Hitachi Chemical Company, Ltd. Paste composition for electrode, photovoltaic cell element, and photovoltaic cell
CN104126230A (zh) * 2011-12-14 2014-10-29 道康宁公司 包括各向同性或各向异性导电层的光伏电池和制品
JP6039905B2 (ja) * 2012-02-14 2016-12-07 デクセリアルズ株式会社 導電性接着剤、太陽電池モジュール及び太陽電池モジュールの製造方法
US20140305486A1 (en) * 2012-02-23 2014-10-16 National Institute Of Advanced Industrial Science And Technology Intergrated multi-junction photovoltaic device
KR20130096823A (ko) 2012-02-23 2013-09-02 엘지전자 주식회사 태양 전지 모듈
WO2014041650A1 (ja) * 2012-09-13 2014-03-20 三洋電機株式会社 太陽電池モジュール
JP2014146699A (ja) * 2013-01-29 2014-08-14 Sanyo Electric Co Ltd 太陽電池モジュール
US9536632B2 (en) * 2013-09-27 2017-01-03 Sunpower Corporation Mechanically deformed metal particles
KR101419035B1 (ko) * 2013-10-25 2014-07-16 주식회사 에스에너지 후면 전극형 태양전지 모듈 및 그 제조 방법
JP5692347B2 (ja) * 2013-12-17 2015-04-01 デクセリアルズ株式会社 導電接着剤
CN104733546A (zh) * 2013-12-19 2015-06-24 日立化成株式会社 太阳能电池和太阳能电池模块
TWI634668B (zh) * 2013-12-19 2018-09-01 日商日立化成股份有限公司 太陽電池以及太陽電池模組
KR102271055B1 (ko) * 2014-06-26 2021-07-01 엘지전자 주식회사 태양 전지 모듈
US20160035907A1 (en) * 2014-08-04 2016-02-04 Lg Electronics Inc. Solar cell module
KR20160045502A (ko) * 2014-10-17 2016-04-27 주식회사 에스에너지 후면 전극형 태양전지 모듈 및 그 제조방법
EP3043354B1 (en) * 2015-01-12 2018-01-03 Heraeus Deutschland GmbH & Co. KG Use of an electrically conductive composition as an electrically conductive adhesive for mechanically and electrically connecting electrical conductors to electrical contacts of solar cells
JP6870943B2 (ja) * 2015-09-30 2021-05-12 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
JP6431998B1 (ja) * 2018-03-20 2018-11-28 タツタ電線株式会社 導電性接着剤層
CN109659402A (zh) * 2019-01-24 2019-04-19 常州时创能源科技有限公司 太阳能电池片的串连工艺
CN110336576B (zh) * 2019-06-26 2021-06-15 维沃移动通信有限公司 导电装置及终端设备
DE102019129832A1 (de) * 2019-11-05 2021-05-06 Heliatek Gmbh Optoelektronisches Bauelement, sowie Verfahren zur Kontaktierung eines optoelektronischen Bauelements
KR20230046292A (ko) * 2020-07-29 2023-04-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 필름
WO2023243621A1 (ja) * 2022-06-14 2023-12-21 株式会社スリーボンド 導電性樹脂組成物およびその硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5951786A (en) * 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
TWI235759B (en) * 1996-07-15 2005-07-11 Hitachi Chemical Co Ltd Multi-layered adhesive for connecting circuit and circuit board
JP2006206843A (ja) * 2005-01-31 2006-08-10 Hitachi Chem Co Ltd 接着フィルム及びこれを備える積層体

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565348A (ja) 1991-09-05 1993-03-19 Sumitomo Bakelite Co Ltd 異方導電フイルム
JPH06103819A (ja) 1992-09-21 1994-04-15 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP3448924B2 (ja) 1993-11-25 2003-09-22 富士電機株式会社 薄膜太陽電池モジュールの製造方法
JP3487562B2 (ja) 1994-01-31 2004-01-19 三井金属鉱業株式会社 プリント配線基板およびその製造方法
JP2992464B2 (ja) 1994-11-04 1999-12-20 キヤノン株式会社 集電電極用被覆ワイヤ、該集電電極用被覆ワイヤを用いた光起電力素子及びその製造方法
JP4032439B2 (ja) 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
ES2185728T3 (es) 1996-07-22 2003-05-01 Siemens Building Tech Ag Detector de humo.
JPH10162646A (ja) 1996-11-28 1998-06-19 Asahi Chem Ind Co Ltd 導電性樹脂組成物
JPH10298525A (ja) 1997-04-23 1998-11-10 Matsushita Electric Works Ltd 異方導電性接着剤樹脂組成物及び異方導電性接着フィルム
JPH10313126A (ja) 1997-05-13 1998-11-24 Sharp Corp 太陽電池素子及びその電極の表面処理方法及び太陽電池モジュール
JPH11120820A (ja) 1997-10-20 1999-04-30 Asahi Chem Ind Co Ltd 異方導電フィルム
JP2000286436A (ja) 1999-03-31 2000-10-13 Sanyo Electric Co Ltd 太陽電池出力領域の製造方法
JP2001127103A (ja) * 1999-10-25 2001-05-11 Kyocera Corp 半導体装置
JP4746732B2 (ja) 2000-05-31 2011-08-10 キヤノン株式会社 画像表示装置の製造方法
US6586270B2 (en) * 2000-06-01 2003-07-01 Canon Kabushiki Kaisha Process for producing a photovoltaic element
JP4585652B2 (ja) 2000-06-01 2010-11-24 キヤノン株式会社 光起電力素子及び光起電力素子の製造方法
JP2001357897A (ja) 2000-06-14 2001-12-26 Fuji Xerox Co Ltd 光電変換モジュール
EP1229555B1 (en) 2000-07-12 2006-10-18 Kabushiki Kaisha Bridgestone Shielded flat cable
JP2002204052A (ja) 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2002226808A (ja) 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003082318A (ja) 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2003234020A (ja) 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子
JP3800108B2 (ja) 2002-02-27 2006-07-26 株式会社村田製作所 導電性ペースト
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP3879666B2 (ja) 2002-12-24 2007-02-14 日立電線株式会社 太陽電池接続用リード線
JP4329532B2 (ja) 2003-07-15 2009-09-09 日立電線株式会社 平角導体及びその製造方法並びにリード線
JP2005101519A (ja) 2003-09-05 2005-04-14 Hitachi Chem Co Ltd 太陽電池ユニット及び太陽電池モジュール
KR101087202B1 (ko) * 2003-11-27 2011-11-29 쿄세라 코포레이션 태양 전지 모듈
US20050115602A1 (en) * 2003-11-28 2005-06-02 Kyocera Corporation Photo-electric conversion cell and array, and photo-electric generation system
JP4325379B2 (ja) 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP4464708B2 (ja) 2004-02-26 2010-05-19 信越半導体株式会社 太陽電池モジュール及び太陽電池モジュールの製造方法
JP2005252062A (ja) 2004-03-05 2005-09-15 Sanyo Electric Co Ltd 太陽電池装置
JP4789426B2 (ja) * 2004-04-26 2011-10-12 太陽ホールディングス株式会社 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン
KR100601341B1 (ko) 2004-06-23 2006-07-14 엘에스전선 주식회사 이방 도전성 접착제 및 이를 이용한 접착필름
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI235759B (en) * 1996-07-15 2005-07-11 Hitachi Chemical Co Ltd Multi-layered adhesive for connecting circuit and circuit board
US5951786A (en) * 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
JP2006206843A (ja) * 2005-01-31 2006-08-10 Hitachi Chem Co Ltd 接着フィルム及びこれを備える積層体

Also Published As

Publication number Publication date
TW201209131A (en) 2012-03-01
TW200811265A (en) 2008-03-01
US9173302B2 (en) 2015-10-27
CN103068182A (zh) 2013-04-24
CN103068182B (zh) 2015-10-28
TW201209130A (en) 2012-03-01
WO2008026356A1 (en) 2008-03-06
KR101040002B1 (ko) 2011-06-09
KR101039889B1 (ko) 2011-06-09
KR20090057293A (ko) 2009-06-04
CN101512781A (zh) 2009-08-19
CA2662202C (en) 2013-04-30
TWI456023B (zh) 2014-10-11
EP2058868A1 (en) 2009-05-13
US20090288697A1 (en) 2009-11-26
CA2662202A1 (en) 2008-03-06
KR20110003596A (ko) 2011-01-12
CN101512781B (zh) 2013-01-23
EP2058868A4 (en) 2010-01-27

Similar Documents

Publication Publication Date Title
TWI456022B (zh) 導電性黏著薄膜及太陽電池組件(module)
JP2007158302A5 (zh)
Cheng et al. Stretchable thin‐film electrodes for flexible electronics with high deformability and stretchability
Jiao et al. Kirigami patterning of MXene/bacterial cellulose composite paper for all‐solid‐state stretchable micro‐supercapacitor arrays
Luo et al. Healable transparent electronic devices
JP2007241999A5 (zh)
EP1713093A3 (en) Electroconductive thick film composition, electrode, and solar cell formed therefrom
TWI328279B (en) Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit
JP2011501866A5 (zh)
JP2009513026A5 (zh)
WO2020258459A1 (zh) 显示面板及其制备方法
JP2008011348A5 (zh)
EP1635405A3 (en) Thin film thermoelectric module
RU2012118036A (ru) Поперечное рассеивание тепла 3-d интегральной схемы
US20160109982A1 (en) Transparent composite substrate, preparation method thereof and touch panel
JP2008116502A5 (zh)
JP2011526629A5 (zh)
EP2055757A4 (en) CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE OF A CIRCUIT MEMBER AND METHOD FOR PRODUCING THE CONNECTING STRUCTURE OF A CIRCUIT MEMBER
JP2011009514A5 (zh)
TW200745308A (en) Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method
JP2011519112A5 (zh)
JP2008536295A5 (zh)
JP2011023574A5 (zh)
TW201145542A (en) Solar cell module, and production method for solar cell module
JP2010287710A5 (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees