TWI456023B - 太陽電池組件之製造方法 - Google Patents

太陽電池組件之製造方法 Download PDF

Info

Publication number
TWI456023B
TWI456023B TW100134797A TW100134797A TWI456023B TW I456023 B TWI456023 B TW I456023B TW 100134797 A TW100134797 A TW 100134797A TW 100134797 A TW100134797 A TW 100134797A TW I456023 B TWI456023 B TW I456023B
Authority
TW
Taiwan
Prior art keywords
solar cell
cell module
module according
manufacturing
adhesive film
Prior art date
Application number
TW100134797A
Other languages
English (en)
Other versions
TW201209131A (en
Inventor
Takehiro Shimizu
Kaoru Okaniwa
Naoki Fukushima
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006232381A external-priority patent/JP2007214533A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201209131A publication Critical patent/TW201209131A/zh
Application granted granted Critical
Publication of TWI456023B publication Critical patent/TWI456023B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Photovoltaic Devices (AREA)

Claims (9)

  1. 一種太陽電池組件之製造方法，其特徵為，其係具有具表面電極之複數太陽電池單元，藉由電連接於該表面電極上之配線構件連接的構造之太陽電池組件之製造方法：使該表面電極與該配線構件透過含有絕緣性黏著劑與導電性粒子的導電性黏著薄膜連接，該導電性黏著薄膜為以該導電性粒子之平均粒徑為r(μm)，該導電性黏著薄膜之厚度為t(μm)時，(t/r)之值為2.0~9.0的範圍內、且該導電性粒子之含量，以該導電性黏著薄膜之全體積為基準，係1.7~15.6體積%的導電性黏著薄膜。
  2. 如申請專利範圍第1項之太陽電池組件之製造方法，其中該導電性粒子之平均粒徑r為10~20μm。
  3. 如申請專利範圍第1或2項之太陽電池組件之製造方法，其中該導電性粒子之平均粒徑r在該表面電極的十點平均表面粗糙度Rz以上。
  4. 如申請專利範圍第1或2項之太陽電池組件之製造方法，其中該絕緣性黏著劑，以該絕緣性黏著劑全量為基準，係含有9~34質量%之橡膠成份者。
  5. 如申請專利範圍第1或2項之太陽電池組件之製造方法，其中該導電性黏著薄膜之彈性模數為0.5~4.0GPa。
  6. 如申請專利範圍第1或2項之太陽電池組件之製造方法，其中該導電性粒子之形狀為帶刺殼栗狀或球狀。
  7. 如申請專利範圍第1或2項之太陽電池組件之製造方法，其中該表面電極係母線電極。
  8. 如申請專利範圍第7項之太陽電池組件之製造方法，其係在該母線電極上配置該導電性黏著薄膜。
  9. 如申請專利範圍第1或2項之太陽電池組件之製造方法，其中該表面電極係以含有銀之玻璃糊料所形成的電極。
TW100134797A 2006-08-29 2007-06-13 太陽電池組件之製造方法 TWI456023B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006232381A JP2007214533A (ja) 2006-01-16 2006-08-29 導電性接着フィルム及び太陽電池モジュール

Publications (2)

Publication Number Publication Date
TW201209131A TW201209131A (en) 2012-03-01
TWI456023B true TWI456023B (zh) 2014-10-11

Family

ID=39135643

Family Applications (3)

Application Number Title Priority Date Filing Date
TW100134797A TWI456023B (zh) 2006-08-29 2007-06-13 太陽電池組件之製造方法
TW096121384A TWI456022B (zh) 2006-08-29 2007-06-13 導電性黏著薄膜及太陽電池組件（ｍｏｄｕｌｅ）
TW100134798A TW201209130A (en) 2006-08-29 2007-06-13 Conductive bonding film and solar cell module

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW096121384A TWI456022B (zh) 2006-08-29 2007-06-13 導電性黏著薄膜及太陽電池組件（ｍｏｄｕｌｅ）
TW100134798A TW201209130A (en) 2006-08-29 2007-06-13 Conductive bonding film and solar cell module

Country Status (7)

Country Link
US (1) US9173302B2 (zh)
EP (1) EP2058868A4 (zh)
KR (2) KR101040002B1 (zh)
CN (2) CN101512781B (zh)
CA (1) CA2662202C (zh)
TW (3) TWI456023B (zh)
WO (1) WO2008026356A1 (zh)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI442583B (zh) * 2006-11-28 2014-06-21 Sanyo Electric Co 太陽電池模組
CN101483203B (zh) * 2007-12-27 2013-01-23 三洋电机株式会社 太阳能电池模块及其制造方法
WO2009124194A1 (en) * 2008-04-02 2009-10-08 Adco Products, Inc. System and method for attaching a solar module to a substrate
US20110048513A1 (en) * 2008-04-02 2011-03-03 Adco Products, Inc. Adhesive composition and method for attaching a component to a substrate
JP5436901B2 (ja) * 2009-03-23 2014-03-05 三洋電機株式会社 太陽電池モジュールの製造方法
JP5377019B2 (ja) 2009-03-23 2013-12-25 三洋電機株式会社 太陽電池モジュールの製造方法
WO2010122875A1 (ja) 2009-04-21 2010-10-28 三洋電機株式会社 太陽電池モジュール
JP5446420B2 (ja) * 2009-04-21 2014-03-19 デクセリアルズ株式会社 太陽電池モジュール及びその製造方法
NO333507B1 (no) * 2009-06-22 2013-06-24 Condalign As Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand
JP5602498B2 (ja) 2009-07-30 2014-10-08 三洋電機株式会社 太陽電池モジュール
US20120152340A1 (en) * 2009-08-27 2012-06-21 Mitsubishi Heavy Industries, Ltd. Multi-junction photovoltaic device, integrated multi-junction photovoltaic device, and processes for producing same
US9390829B2 (en) 2010-01-25 2016-07-12 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US20110180138A1 (en) * 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US20110180139A1 (en) * 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
CN102714244A (zh) * 2010-01-26 2012-10-03 三洋电机株式会社 太阳能电池模块及其制造方法
RU2553774C2 (ru) * 2010-02-17 2015-06-20 Басф Се Способ создания электропроводных скреплений между солнечными элементами
JP5377409B2 (ja) * 2010-05-28 2013-12-25 三洋電機株式会社 太陽電池モジュール及びその製造方法
KR101110826B1 (ko) * 2010-08-17 2012-02-24 엘지전자 주식회사 태양전지 패널
KR101642152B1 (ko) 2010-08-20 2016-07-22 엘지전자 주식회사 태양전지 모듈
US8338698B2 (en) * 2010-08-27 2012-12-25 Primestar Solar, Inc. Anisotropic conductive layer as a back contact in thin film photovoltaic devices
EP2634818B1 (en) * 2010-10-26 2017-02-08 Panasonic Intellectual Property Management Co., Ltd. Method for producing solar cell module
KR20120044541A (ko) * 2010-10-28 2012-05-08 엘지전자 주식회사 도전성 접착 필름, 상기 필름을 구비한 태양전지 패널 및 상기 패널의 제조 방법
JP2012119441A (ja) * 2010-11-30 2012-06-21 Sony Chemical & Information Device Corp 太陽電池モジュール及びその製造方法
US9224517B2 (en) 2011-04-07 2015-12-29 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
US20120260981A1 (en) * 2011-04-14 2012-10-18 Hitachi Chemical Company, Ltd. Paste composition for electrode, photovoltaic cell element, and photovoltaic cell
US20120260982A1 (en) * 2011-04-14 2012-10-18 Hitachi Chemical Company, Ltd. Paste composition for electrode, photovoltaic cell element, and photovoltaic cell
KR101732633B1 (ko) * 2011-05-26 2017-05-04 엘지전자 주식회사 태양전지 모듈
JP2012253062A (ja) 2011-05-31 2012-12-20 Sanyo Electric Co Ltd 太陽電池モジュール及びその製造方法
KR101816163B1 (ko) * 2011-06-14 2018-01-08 엘지전자 주식회사 태양전지 모듈
JP5909667B2 (ja) * 2011-06-30 2016-04-27 パナソニックＩｐマネジメント株式会社 太陽電池モジュール及びその製造方法
JP2013038168A (ja) * 2011-08-05 2013-02-21 Three M Innovative Properties Co 太陽電池モジュールの製造方法
JP5840418B2 (ja) * 2011-08-23 2016-01-06 デクセリアルズ株式会社 導電性接着剤及び太陽電池モジュール
JP2013045994A (ja) * 2011-08-26 2013-03-04 Dexerials Corp 太陽電池用導電性接着剤及びこれを用いた接続方法、太陽電池モジュール、太陽電池モジュールの製造方法
CN103890970B (zh) * 2011-09-29 2016-01-20 陶氏环球技术有限责任公司 光伏电池互连
US20130118573A1 (en) * 2011-11-14 2013-05-16 Hitachi Chemical Company, Ltd. Paste composition for electrode, photovoltaic cell element, and photovoltaic cell
EP2791977A2 (en) * 2011-12-14 2014-10-22 Dow Corning Corporation A photovoltaic cell and an article including an isotropic or anisotropic electrically conductive layer
JP6039905B2 (ja) * 2012-02-14 2016-12-07 デクセリアルズ株式会社 導電性接着剤、太陽電池モジュール及び太陽電池モジュールの製造方法
US20140305486A1 (en) * 2012-02-23 2014-10-16 National Institute Of Advanced Industrial Science And Technology Intergrated multi-junction photovoltaic device
KR20130096823A (ko) 2012-02-23 2013-09-02 엘지전자 주식회사 태양 전지 모듈
WO2014041650A1 (ja) 2012-09-13 2014-03-20 三洋電機株式会社 太陽電池モジュール
JP2014146699A (ja) * 2013-01-29 2014-08-14 Sanyo Electric Co Ltd 太陽電池モジュール
US9536632B2 (en) * 2013-09-27 2017-01-03 Sunpower Corporation Mechanically deformed metal particles
KR101419035B1 (ko) * 2013-10-25 2014-07-16 주식회사 에스에너지 후면 전극형 태양전지 모듈 및 그 제조 방법
JP5692347B2 (ja) * 2013-12-17 2015-04-01 デクセリアルズ株式会社 導電接着剤
TWI634668B (zh) * 2013-12-19 2018-09-01 日商日立化成股份有限公司 太陽電池以及太陽電池模組
CN104733546A (zh) * 2013-12-19 2015-06-24 日立化成株式会社 太阳能电池和太阳能电池模块
KR102271055B1 (ko) * 2014-06-26 2021-07-01 엘지전자 주식회사 태양 전지 모듈
US20160035907A1 (en) * 2014-08-04 2016-02-04 Lg Electronics Inc. Solar cell module
KR20160045502A (ko) * 2014-10-17 2016-04-27 주식회사 에스에너지 후면 전극형 태양전지 모듈 및 그 제조방법
ES2663623T3 (es) * 2015-01-12 2018-04-16 Heraeus Deutschland GmbH & Co. KG Uso de una composición eléctricamente conductora como adhesivo eléctricamente conductor para conectar mecánica y eléctricamente conductores eléctricos con los contactos eléctricos de células solares
JP6870943B2 (ja) * 2015-09-30 2021-05-12 日東電工株式会社 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート
JP6431998B1 (ja) * 2018-03-20 2018-11-28 タツタ電線株式会社 導電性接着剤層
CN109659402A (zh) * 2019-01-24 2019-04-19 常州时创能源科技有限公司 太阳能电池片的串连工艺
CN110336576B (zh) * 2019-06-26 2021-06-15 维沃移动通信有限公司 导电装置及终端设备
DE102019129832A1 (de) * 2019-11-05 2021-05-06 Heliatek Gmbh Optoelektronisches Bauelement, sowie Verfahren zur Kontaktierung eines optoelektronischen Bauelements
WO2022023830A1 (en) * 2020-07-29 2022-02-03 3M Innovative Properties Company Electrically conductive adhesive film
WO2023243621A1 (ja) * 2022-06-14 2023-12-21 株式会社スリーボンド 導電性樹脂組成物およびその硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5951786A (en) * 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
TWI235759B (en) * 1996-07-15 2005-07-11 Hitachi Chemical Co Ltd Multi-layered adhesive for connecting circuit and circuit board
JP2006206843A (ja) * 2005-01-31 2006-08-10 Hitachi Chem Co Ltd 接着フィルム及びこれを備える積層体

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565348A (ja) 1991-09-05 1993-03-19 Sumitomo Bakelite Co Ltd 異方導電フイルム
JPH06103819A (ja) 1992-09-21 1994-04-15 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP3448924B2 (ja) * 1993-11-25 2003-09-22 富士電機株式会社 薄膜太陽電池モジュールの製造方法
JP3487562B2 (ja) 1994-01-31 2004-01-19 三井金属鉱業株式会社 プリント配線基板およびその製造方法
JP2992464B2 (ja) 1994-11-04 1999-12-20 キヤノン株式会社 集電電極用被覆ワイヤ、該集電電極用被覆ワイヤを用いた光起電力素子及びその製造方法
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
ES2185728T3 (es) 1996-07-22 2003-05-01 Siemens Building Tech Ag Detector de humo.
JPH10162646A (ja) 1996-11-28 1998-06-19 Asahi Chem Ind Co Ltd 導電性樹脂組成物
JPH10298525A (ja) 1997-04-23 1998-11-10 Matsushita Electric Works Ltd 異方導電性接着剤樹脂組成物及び異方導電性接着フィルム
JPH10313126A (ja) 1997-05-13 1998-11-24 Sharp Corp 太陽電池素子及びその電極の表面処理方法及び太陽電池モジュール
JPH11120820A (ja) 1997-10-20 1999-04-30 Asahi Chem Ind Co Ltd 異方導電フィルム
JP2000286436A (ja) 1999-03-31 2000-10-13 Sanyo Electric Co Ltd 太陽電池出力領域の製造方法
JP2001127103A (ja) * 1999-10-25 2001-05-11 Kyocera Corp 半導体装置
JP4746732B2 (ja) 2000-05-31 2011-08-10 キヤノン株式会社 画像表示装置の製造方法
US6586270B2 (en) * 2000-06-01 2003-07-01 Canon Kabushiki Kaisha Process for producing a photovoltaic element
JP4585652B2 (ja) 2000-06-01 2010-11-24 キヤノン株式会社 光起電力素子及び光起電力素子の製造方法
JP2001357897A (ja) 2000-06-14 2001-12-26 Fuji Xerox Co Ltd 光電変換モジュール
US6770820B2 (en) 2000-07-12 2004-08-03 Kabushiki Kaisha Bridgestone Shielded flat cable
JP2002204052A (ja) 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続方法、接続構造
JP2002226808A (ja) 2001-01-31 2002-08-14 Hitachi Chem Co Ltd 回路接続用接着剤
JP2003082318A (ja) 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
JP2003234020A (ja) 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子
JP3800108B2 (ja) 2002-02-27 2006-07-26 株式会社村田製作所 導電性ペースト
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP3879666B2 (ja) 2002-12-24 2007-02-14 日立電線株式会社 太陽電池接続用リード線
JP4329532B2 (ja) 2003-07-15 2009-09-09 日立電線株式会社 平角導体及びその製造方法並びにリード線
JP2005101519A (ja) * 2003-09-05 2005-04-14 Hitachi Chem Co Ltd 太陽電池ユニット及び太陽電池モジュール
AU2004294031B2 (en) * 2003-11-27 2009-09-17 Kyocera Corporation Solar cell module
US20050115602A1 (en) * 2003-11-28 2005-06-02 Kyocera Corporation Photo-electric conversion cell and array, and photo-electric generation system
JP4325379B2 (ja) 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP4464708B2 (ja) 2004-02-26 2010-05-19 信越半導体株式会社 太陽電池モジュール及び太陽電池モジュールの製造方法
JP2005252062A (ja) 2004-03-05 2005-09-15 Sanyo Electric Co Ltd 太陽電池装置
JP4789426B2 (ja) * 2004-04-26 2011-10-12 太陽ホールディングス株式会社 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン
KR100601341B1 (ko) 2004-06-23 2006-07-14 엘에스전선 주식회사 이방 도전성 접착제 및 이를 이용한 접착필름
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI235759B (en) * 1996-07-15 2005-07-11 Hitachi Chemical Co Ltd Multi-layered adhesive for connecting circuit and circuit board
US5951786A (en) * 1997-12-19 1999-09-14 Sandia Corporation Laminated photovoltaic modules using back-contact solar cells
JP2006206843A (ja) * 2005-01-31 2006-08-10 Hitachi Chem Co Ltd 接着フィルム及びこれを備える積層体

Also Published As

Publication number Publication date
KR20110003596A (ko) 2011-01-12
TWI456022B (zh) 2014-10-11
CN101512781B (zh) 2013-01-23
CN101512781A (zh) 2009-08-19
US9173302B2 (en) 2015-10-27
TW200811265A (en) 2008-03-01
WO2008026356A1 (en) 2008-03-06
CN103068182B (zh) 2015-10-28
KR101039889B1 (ko) 2011-06-09
KR20090057293A (ko) 2009-06-04
CA2662202C (en) 2013-04-30
TW201209130A (en) 2012-03-01
CN103068182A (zh) 2013-04-24
EP2058868A4 (en) 2010-01-27
KR101040002B1 (ko) 2011-06-09
US20090288697A1 (en) 2009-11-26
EP2058868A1 (en) 2009-05-13
TW201209131A (en) 2012-03-01
CA2662202A1 (en) 2008-03-06

Similar Documents

Publication Publication Date Title
TWI456023B (zh) 太陽電池組件之製造方法
Luo et al. Healable transparent electronic devices
Cheng et al. Stretchable thin‐film electrodes for flexible electronics with high deformability and stretchability
EP1713093A3 (en) Electroconductive thick film composition, electrode, and solar cell formed therefrom
JP2010532586A5 (zh)
JP2013521207A5 (zh)
JP2007241999A5 (zh)
WO2009078409A1 (ja) 回路接続材料及び回路部材の接続構造
WO2012074783A3 (en) Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
US20120091863A1 (en) Structure for bonding metal plate and piezoelectric body and bonding method
EP2073316A4 (en) ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT ELEMENT CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING COATED PARTICLES
TW200833503A (en) Adhesive layer for resin and a method of producing a laminate including the adhesive layer
JP2011501866A5 (zh)
WO2009063827A1 (ja) 回路接続材料、及び回路部材の接続構造
Jang et al. A high aspect ratio serpentine structure for use as a strain‐insensitive, stretchable transparent conductor
WO2009057332A1 (ja) 回路接続方法
BR112012012507A2 (pt) produção de eletrodos nanorganizados em substrato poroso
TW200739612A (en) Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
EP2175457A3 (en) Ceramic chip assembly
CN102118918A (zh) 一种可弯折柔性透明电子电路及其制备方法
JP2007035574A5 (zh)
JP2008085227A5 (zh)
JP5973015B2 (ja) 導電粒子および導電粒子を含む導電材料
JP2011504636A5 (zh)
TW201029285A (en) Over-current protection device and manufacturing method thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees