TWI455764B - 基板材料的表面處理裝置 - Google Patents

基板材料的表面處理裝置 Download PDF

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Publication number
TWI455764B
TWI455764B TW099115224A TW99115224A TWI455764B TW I455764 B TWI455764 B TW I455764B TW 099115224 A TW099115224 A TW 099115224A TW 99115224 A TW99115224 A TW 99115224A TW I455764 B TWI455764 B TW I455764B
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TW
Taiwan
Prior art keywords
nozzle
substrate material
surface treatment
air
processing liquid
Prior art date
Application number
TW099115224A
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English (en)
Other versions
TW201103646A (en
Inventor
Hiroaki Ito
Original Assignee
Tokyo Kakoki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Kakoki Co Ltd filed Critical Tokyo Kakoki Co Ltd
Publication of TW201103646A publication Critical patent/TW201103646A/zh
Application granted granted Critical
Publication of TWI455764B publication Critical patent/TWI455764B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
  • Spray Control Apparatus (AREA)

Claims (2)

  1. 一種基板材料的表面處理裝置，係被使用在電子電路基板的製造製程中，從噴嘴噴射處理液，以對被搬送之基板材料，進行表面處理，其特徴為，該噴嘴係由雙流體噴嘴構成，其將處理液和空氣混合後噴射，該基板材料和該噴嘴之間形成5mm以上~40mm以下之間隔距離；分別於各噴射管設置複數個該噴嘴；各該噴射管係朝向左右方向排列，於前後之搬送方向彼此存在有間隔，同時設有複數支，並且可在左右方向水平往復移動；與該空氣一起從該噴嘴被噴出的該處理液係成為微小粒子，而朝該基板材料噴射，且在極接近的前述間隔距離下，以最大衝擊值200mN以上的強力衝擊噴射該基板材料，並且藉由該噴射管以及該噴嘴的前述水平往復移動，對該基板材料廣泛均勻地噴射；且該空氣係從屬壓送源的鼓風機，以0.01MPa以上~0.08MPa以下的氣壓，被壓送供給至該噴嘴；從該鼓風機被壓送供給至該噴嘴之該空氣、以及從該噴嘴與該空氣混合後噴射之該處理液係以可設成適合於該基板材料的表面處理的溫度之方式進行溫度上升，據此藉由將該處理液噴射至該基板材料，從而發揮提高該基板材料的表面處理精度之功能。
  2. 如申請專利範圍第1項之表面處理裝置，其中該表面處理裝置係使用於顯影製程、蝕刻製程、剝離製程或洗淨製程，該噴嘴係將顯影液、蝕刻液、剝離液或洗淨液作為該處理液而噴射。
TW099115224A 2009-05-14 2010-05-13 基板材料的表面處理裝置 TWI455764B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009117247 2009-05-14

Publications (2)

Publication Number Publication Date
TW201103646A TW201103646A (en) 2011-02-01
TWI455764B true TWI455764B (zh) 2014-10-11

Family

ID=43074395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099115224A TWI455764B (zh) 2009-05-14 2010-05-13 基板材料的表面處理裝置

Country Status (4)

Country Link
JP (1) JP4644303B2 (zh)
KR (1) KR101210413B1 (zh)
CN (1) CN101888744A (zh)
TW (1) TWI455764B (zh)

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JP5762915B2 (ja) * 2011-10-11 2015-08-12 株式会社ケミトロン エッチング方法及びエッチング装置
CN103157614B (zh) * 2011-12-14 2016-03-30 深南电路有限公司 洗网机
JP5945178B2 (ja) * 2012-07-04 2016-07-05 東京エレクトロン株式会社 ガスクラスター照射機構およびそれを用いた基板処理装置、ならびにガスクラスター照射方法
KR101386677B1 (ko) * 2012-10-30 2014-04-29 삼성전기주식회사 미세회로 제조방법
CN103172476A (zh) * 2013-04-08 2013-06-26 中国工程物理研究院化工材料研究所 一种亚微米颗粒1-氧-二氨基-3，5-二硝基吡嗪炸药的制备方法
KR101622211B1 (ko) * 2013-04-11 2016-05-18 가부시키가이샤 케미토론 에칭방법 및 에칭장치
CN103406216A (zh) * 2013-05-31 2013-11-27 中国商用飞机有限责任公司 一种阵列式的水雾喷射装置
JP2015017315A (ja) * 2013-07-15 2015-01-29 イビデン株式会社 表面処理装置および表面処理基板の製造方法
CN103752552B (zh) * 2014-01-17 2016-09-14 杨秀英 适用于线路板生产线的产品净化系统
CN104014500B (zh) * 2014-06-09 2016-04-27 福州宝井钢材有限公司 一种电镀锌材料的清洗装置
CN104624542B (zh) * 2014-12-31 2016-09-14 广州兴森快捷电路科技有限公司 清洗装置
DE102015112659A1 (de) * 2015-07-31 2017-02-02 Lindauer Dornier Gesellschaft Mit Beschränkter Haftung Vorrichtung zum beidseitigen Beschichten mindestens einer laufenden Flachmaterialbahn
TWI546002B (zh) * 2015-08-13 2016-08-11 馗鼎奈米科技股份有限公司 金屬線路之製造方法
CN105728382A (zh) * 2016-04-22 2016-07-06 苏州工业园区中法环境技术有限公司 格栅自动清洗装置
KR101966648B1 (ko) * 2016-09-05 2019-08-14 주식회사 디엠에스 기판세정장치
CN107008598A (zh) * 2017-06-16 2017-08-04 蚌埠抒阳自动化设备制造有限公司 一种全方位板材喷漆设备
JP6865402B2 (ja) * 2017-07-10 2021-04-28 パナソニックＩｐマネジメント株式会社 洗浄方法及び洗浄装置
JP6684262B2 (ja) * 2017-12-06 2020-04-22 株式会社中西製作所 洗浄装置
CN110152904B (zh) * 2019-06-12 2024-07-09 薛德刚 一种喷射气凝胶、纤维与粘结剂混合料的系统装置及方法
CN110868811B (zh) * 2019-11-20 2021-04-06 江苏上达电子有限公司 一种cof基板成品的清洗方式
CN114114859A (zh) * 2021-12-14 2022-03-01 上海展华电子(南通)有限公司 显影方法以及显影装置

Citations (3)

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CN1382831A (zh) * 2001-02-28 2002-12-04 索尼公司 蚀刻方法与蚀刻装置
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP2007109987A (ja) * 2005-10-17 2007-04-26 Tokyo Kakoki Kk 基板のエッチング装置

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Patent Citations (3)

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CN1382831A (zh) * 2001-02-28 2002-12-04 索尼公司 蚀刻方法与蚀刻装置
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP2007109987A (ja) * 2005-10-17 2007-04-26 Tokyo Kakoki Kk 基板のエッチング装置

Also Published As

Publication number Publication date
TW201103646A (en) 2011-02-01
KR101210413B1 (ko) 2012-12-10
CN101888744A (zh) 2010-11-17
KR20100123638A (ko) 2010-11-24
JP4644303B2 (ja) 2011-03-02
JP2010287881A (ja) 2010-12-24

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