KR101210413B1 - 기판재의 표면 처리 장치 - Google Patents

기판재의 표면 처리 장치 Download PDF

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Publication number
KR101210413B1
KR101210413B1 KR1020100045193A KR20100045193A KR101210413B1 KR 101210413 B1 KR101210413 B1 KR 101210413B1 KR 1020100045193 A KR1020100045193 A KR 1020100045193A KR 20100045193 A KR20100045193 A KR 20100045193A KR 101210413 B1 KR101210413 B1 KR 101210413B1
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KR
South Korea
Prior art keywords
substrate material
air
surface treatment
spray nozzle
board
Prior art date
Application number
KR1020100045193A
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English (en)
Korean (ko)
Other versions
KR20100123638A (ko
Inventor
히로아키 이토
Original Assignee
도쿄 가코키 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도쿄 가코키 컴퍼니 리미티드 filed Critical 도쿄 가코키 컴퍼니 리미티드
Publication of KR20100123638A publication Critical patent/KR20100123638A/ko
Application granted granted Critical
Publication of KR101210413B1 publication Critical patent/KR101210413B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)
  • Spray Control Apparatus (AREA)
KR1020100045193A 2009-05-14 2010-05-14 기판재의 표면 처리 장치 KR101210413B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009117247 2009-05-14
JPJP-P-2009-117247 2009-05-14

Publications (2)

Publication Number Publication Date
KR20100123638A KR20100123638A (ko) 2010-11-24
KR101210413B1 true KR101210413B1 (ko) 2012-12-10

Family

ID=43074395

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100045193A KR101210413B1 (ko) 2009-05-14 2010-05-14 기판재의 표면 처리 장치

Country Status (4)

Country Link
JP (1) JP4644303B2 (zh)
KR (1) KR101210413B1 (zh)
CN (1) CN101888744A (zh)
TW (1) TWI455764B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5762915B2 (ja) * 2011-10-11 2015-08-12 株式会社ケミトロン エッチング方法及びエッチング装置
CN103157614B (zh) * 2011-12-14 2016-03-30 深南电路有限公司 洗网机
JP5945178B2 (ja) * 2012-07-04 2016-07-05 東京エレクトロン株式会社 ガスクラスター照射機構およびそれを用いた基板処理装置、ならびにガスクラスター照射方法
KR101386677B1 (ko) * 2012-10-30 2014-04-29 삼성전기주식회사 미세회로 제조방법
CN103172476A (zh) * 2013-04-08 2013-06-26 中国工程物理研究院化工材料研究所 一种亚微米颗粒1-氧-二氨基-3，5-二硝基吡嗪炸药的制备方法
KR101622211B1 (ko) * 2013-04-11 2016-05-18 가부시키가이샤 케미토론 에칭방법 및 에칭장치
CN103406216A (zh) * 2013-05-31 2013-11-27 中国商用飞机有限责任公司 一种阵列式的水雾喷射装置
JP2015017315A (ja) * 2013-07-15 2015-01-29 イビデン株式会社 表面処理装置および表面処理基板の製造方法
CN103752552B (zh) * 2014-01-17 2016-09-14 杨秀英 适用于线路板生产线的产品净化系统
CN104014500B (zh) * 2014-06-09 2016-04-27 福州宝井钢材有限公司 一种电镀锌材料的清洗装置
CN104624542B (zh) * 2014-12-31 2016-09-14 广州兴森快捷电路科技有限公司 清洗装置
DE102015112659A1 (de) * 2015-07-31 2017-02-02 Lindauer Dornier Gesellschaft Mit Beschränkter Haftung Vorrichtung zum beidseitigen Beschichten mindestens einer laufenden Flachmaterialbahn
TWI546002B (zh) * 2015-08-13 2016-08-11 馗鼎奈米科技股份有限公司 金屬線路之製造方法
CN105728382A (zh) * 2016-04-22 2016-07-06 苏州工业园区中法环境技术有限公司 格栅自动清洗装置
KR101966648B1 (ko) * 2016-09-05 2019-08-14 주식회사 디엠에스 기판세정장치
CN107008598A (zh) * 2017-06-16 2017-08-04 蚌埠抒阳自动化设备制造有限公司 一种全方位板材喷漆设备
JP6865402B2 (ja) * 2017-07-10 2021-04-28 パナソニックＩｐマネジメント株式会社 洗浄方法及び洗浄装置
JP6684262B2 (ja) * 2017-12-06 2020-04-22 株式会社中西製作所 洗浄装置
CN110152904B (zh) * 2019-06-12 2024-07-09 薛德刚 一种喷射气凝胶、纤维与粘结剂混合料的系统装置及方法
CN110868811B (zh) * 2019-11-20 2021-04-06 江苏上达电子有限公司 一种cof基板成品的清洗方式
CN114114859A (zh) * 2021-12-14 2022-03-01 上海展华电子(南通)有限公司 显影方法以及显影装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10156229A (ja) 1996-12-02 1998-06-16 Mitsubishi Electric Corp 洗浄用２流体ジェットノズル及び洗浄装置
JP2003322976A (ja) 2002-05-07 2003-11-14 Fuji Photo Film Co Ltd 液噴霧方法及びこれを用いた基板現像処理方法及び装置
JP2004204329A (ja) 2002-12-26 2004-07-22 Sumitomo Metal Mining Co Ltd エッチング装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108359U (zh) * 1984-12-22 1986-07-09
CN100451843C (zh) * 2000-01-21 2009-01-14 友达光电股份有限公司 液体喷洒装置
JP4626068B2 (ja) * 2001-02-28 2011-02-02 ソニー株式会社 エッチング方法およびエッチング装置
US20030217762A1 (en) * 2002-02-18 2003-11-27 Lam Research Corporation Water supply apparatus and method thereof
JP4091357B2 (ja) * 2002-06-28 2008-05-28 大日本スクリーン製造株式会社 基板処理装置および基板洗浄方法
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP2007109987A (ja) * 2005-10-17 2007-04-26 Tokyo Kakoki Kk 基板のエッチング装置
JP2009206393A (ja) * 2008-02-29 2009-09-10 Seiko Epson Corp 表面処理装置、表面処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10156229A (ja) 1996-12-02 1998-06-16 Mitsubishi Electric Corp 洗浄用２流体ジェットノズル及び洗浄装置
JP2003322976A (ja) 2002-05-07 2003-11-14 Fuji Photo Film Co Ltd 液噴霧方法及びこれを用いた基板現像処理方法及び装置
JP2004204329A (ja) 2002-12-26 2004-07-22 Sumitomo Metal Mining Co Ltd エッチング装置

Also Published As

Publication number Publication date
TWI455764B (zh) 2014-10-11
TW201103646A (en) 2011-02-01
CN101888744A (zh) 2010-11-17
KR20100123638A (ko) 2010-11-24
JP4644303B2 (ja) 2011-03-02
JP2010287881A (ja) 2010-12-24

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