TWI455175B - Connection device and connection method, program, component manufacturing processing system, exposure apparatus and exposure method, and measurement and inspection apparatus and measurement inspection method between component manufacturing processing apparatus - Google Patents

Connection device and connection method, program, component manufacturing processing system, exposure apparatus and exposure method, and measurement and inspection apparatus and measurement inspection method between component manufacturing processing apparatus Download PDF

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Publication number
TWI455175B
TWI455175B TW095140005A TW95140005A TWI455175B TW I455175 B TWI455175 B TW I455175B TW 095140005 A TW095140005 A TW 095140005A TW 95140005 A TW95140005 A TW 95140005A TW I455175 B TWI455175 B TW I455175B
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TW
Taiwan
Prior art keywords
component manufacturing
conversion
information
manufacturing processing
processing device
Prior art date
Application number
TW095140005A
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English (en)
Chinese (zh)
Other versions
TW200721259A (en
Inventor
沖田晉一
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW200721259A publication Critical patent/TW200721259A/zh
Application granted granted Critical
Publication of TWI455175B publication Critical patent/TWI455175B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
TW095140005A 2005-10-28 2006-10-30 Connection device and connection method, program, component manufacturing processing system, exposure apparatus and exposure method, and measurement and inspection apparatus and measurement inspection method between component manufacturing processing apparatus TWI455175B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005314759 2005-10-28

Publications (2)

Publication Number Publication Date
TW200721259A TW200721259A (en) 2007-06-01
TWI455175B true TWI455175B (zh) 2014-10-01

Family

ID=37967814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140005A TWI455175B (zh) 2005-10-28 2006-10-30 Connection device and connection method, program, component manufacturing processing system, exposure apparatus and exposure method, and measurement and inspection apparatus and measurement inspection method between component manufacturing processing apparatus

Country Status (3)

Country Link
JP (1) JP5061904B2 (ja)
TW (1) TWI455175B (ja)
WO (1) WO2007049704A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120059630A (ko) * 2007-06-21 2012-06-08 에이에스엠엘 네델란즈 비.브이. 기판 테이블 상에 기판을 적재하는 방법, 디바이스 제조 방법, 컴퓨터 프로그램물, 데이터 캐리어 및 장치
JP5300431B2 (ja) * 2008-11-17 2013-09-25 株式会社日本マイクロニクス 被検査基板のアライメント装置
KR102072200B1 (ko) * 2011-04-22 2020-01-31 에이에스엠엘 네델란즈 비.브이. 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜
JP2014026041A (ja) * 2012-07-25 2014-02-06 Ulvac Japan Ltd 露光装置及び露光方法
JP5945211B2 (ja) * 2012-10-26 2016-07-05 株式会社アルバック 露光装置
JP6719729B2 (ja) * 2015-02-23 2020-07-08 株式会社ニコン 基板処理システム及び基板処理方法、並びにデバイス製造方法
EP3309818B1 (en) * 2015-06-12 2019-07-24 FUJI Corporation Relay device and manufacturing system
KR102625369B1 (ko) 2016-09-30 2024-01-15 가부시키가이샤 니콘 계측 시스템 및 기판 처리 시스템, 그리고 디바이스 제조 방법
DE102017202360A1 (de) * 2017-02-14 2018-08-16 Deckel Maho Pfronten Gmbh Datenschnittstellenvorrichtung zum einsatz an einer numerisch gesteuerten werkzeugmaschine

Citations (6)

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TW423094B (en) * 1998-03-19 2001-02-21 Mitsubishi Electric Corp Semiconductor device testing apparatus and testing method thereof
TW439166B (en) * 1998-11-05 2001-06-07 Hitachi Ltd Connecting apparatus, method of fabricating wiring film with holder, inspection system and method of fabricating semiconductor element
TW479013B (en) * 1999-11-08 2002-03-11 Towa Corp Method of fabricating an electronic component and apparatus used therefor
US6421733B1 (en) * 1997-03-25 2002-07-16 Intel Corporation System for dynamically transcoding data transmitted between computers
TWI227515B (en) * 2002-04-30 2005-02-01 Canon Kk Management system and apparatus, method therefor, and device manufacturing method
US20050091311A1 (en) * 2003-07-29 2005-04-28 Lund Christopher D. Method and apparatus for distributing multimedia to remote clients

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JP3174863B2 (ja) * 1991-07-15 2001-06-11 株式会社ニコン 露光方法及びリソグラフィシステム
JP3275968B2 (ja) * 1991-08-05 2002-04-22 日本電信電話株式会社 製造ラインにおける装置制御方式
JPH0766096A (ja) * 1993-08-26 1995-03-10 Toshiba Corp 半導体製造装置の管理装置
JP3367201B2 (ja) * 1994-05-06 2003-01-14 株式会社日立製作所 電子回路装置の製造方法
TW406507B (en) * 1998-10-30 2000-09-21 Kim Man Ki SECS-I and HSMS converting method
JP2001184324A (ja) * 1999-12-22 2001-07-06 Toshiba Eng Co Ltd 通信支援装置および通信支援方法および通信支援をするためのプログラムを記憶した記録媒体
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
JP4414690B2 (ja) * 2003-07-14 2010-02-10 株式会社日立ハイテクノロジーズ 半導体製造システム

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Publication number Priority date Publication date Assignee Title
US6421733B1 (en) * 1997-03-25 2002-07-16 Intel Corporation System for dynamically transcoding data transmitted between computers
TW423094B (en) * 1998-03-19 2001-02-21 Mitsubishi Electric Corp Semiconductor device testing apparatus and testing method thereof
TW439166B (en) * 1998-11-05 2001-06-07 Hitachi Ltd Connecting apparatus, method of fabricating wiring film with holder, inspection system and method of fabricating semiconductor element
TW479013B (en) * 1999-11-08 2002-03-11 Towa Corp Method of fabricating an electronic component and apparatus used therefor
TWI227515B (en) * 2002-04-30 2005-02-01 Canon Kk Management system and apparatus, method therefor, and device manufacturing method
US20050091311A1 (en) * 2003-07-29 2005-04-28 Lund Christopher D. Method and apparatus for distributing multimedia to remote clients

Also Published As

Publication number Publication date
JP5061904B2 (ja) 2012-10-31
TW200721259A (en) 2007-06-01
JPWO2007049704A1 (ja) 2009-04-30
WO2007049704A1 (ja) 2007-05-03

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