TWI443737B - 具有介電罩蓋之邊緣電極 - Google Patents

具有介電罩蓋之邊緣電極 Download PDF

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Publication number
TWI443737B
TWI443737B TW097107517A TW97107517A TWI443737B TW I443737 B TWI443737 B TW I443737B TW 097107517 A TW097107517 A TW 097107517A TW 97107517 A TW97107517 A TW 97107517A TW I443737 B TWI443737 B TW I443737B
Authority
TW
Taiwan
Prior art keywords
edge electrode
substrate
cleaning
processing chamber
electrode
Prior art date
Application number
TW097107517A
Other languages
English (en)
Chinese (zh)
Other versions
TW200901311A (en
Inventor
薩克士頓 葛瑞格里Ｓ
貝利三世 安祖Ｄ
庫提 安卓斯
金允聖
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39738668&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI443737(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW200901311A publication Critical patent/TW200901311A/zh
Application granted granted Critical
Publication of TWI443737B publication Critical patent/TWI443737B/zh

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Classifications

    • H10P50/242—
    • H10P70/54—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H10P50/267—
    • H10P50/283—
    • H10P50/287—
    • H10P70/20—
    • H10P72/50—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Plasma Technology (AREA)
TW097107517A 2007-03-05 2008-03-04 具有介電罩蓋之邊緣電極 TWI443737B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US89307407P 2007-03-05 2007-03-05
US89306907P 2007-03-05 2007-03-05
US11/758,584 US9184043B2 (en) 2006-05-24 2007-06-05 Edge electrodes with dielectric covers

Publications (2)

Publication Number Publication Date
TW200901311A TW200901311A (en) 2009-01-01
TWI443737B true TWI443737B (zh) 2014-07-01

Family

ID=39738668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107517A TWI443737B (zh) 2007-03-05 2008-03-04 具有介電罩蓋之邊緣電極

Country Status (6)

Country Link
US (2) US9184043B2 (enExample)
JP (1) JP4975113B2 (enExample)
KR (1) KR101441720B1 (enExample)
SG (1) SG179482A1 (enExample)
TW (1) TWI443737B (enExample)
WO (1) WO2008109240A1 (enExample)

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US10163610B2 (en) * 2015-07-13 2018-12-25 Lam Research Corporation Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
KR101722382B1 (ko) * 2016-01-08 2017-04-03 주식회사 윈텔 플라즈마 처리 장치
US11251019B2 (en) * 2016-12-15 2022-02-15 Toyota Jidosha Kabushiki Kaisha Plasma device
JP6863199B2 (ja) 2017-09-25 2021-04-21 トヨタ自動車株式会社 プラズマ処理装置
WO2019143473A1 (en) * 2018-01-22 2019-07-25 Applied Materials, Inc. Processing with powered edge ring
JP7502039B2 (ja) * 2019-03-28 2024-06-18 エーエスエム・アイピー・ホールディング・ベー・フェー 基板処理装置
JP7462383B2 (ja) * 2019-04-15 2024-04-05 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置
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JP2021197524A (ja) 2020-06-18 2021-12-27 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
TWI888680B (zh) * 2020-12-18 2025-07-01 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置
KR102767880B1 (ko) 2021-11-02 2025-02-17 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
KR20240154309A (ko) * 2023-04-18 2024-10-25 피에스케이 주식회사 기판 처리 장치
JP2025068434A (ja) * 2023-10-16 2025-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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Also Published As

Publication number Publication date
TW200901311A (en) 2009-01-01
WO2008109240A1 (en) 2008-09-12
JP4975113B2 (ja) 2012-07-11
SG179482A1 (en) 2012-04-27
US20160064215A1 (en) 2016-03-03
US9564308B2 (en) 2017-02-07
KR101441720B1 (ko) 2014-09-17
US9184043B2 (en) 2015-11-10
JP2010520646A (ja) 2010-06-10
US20090166326A1 (en) 2009-07-02
KR20090129417A (ko) 2009-12-16
KR101441720B9 (ko) 2024-03-25

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