TWI438991B - Semiconductor laser device - Google Patents

Semiconductor laser device Download PDF

Info

Publication number
TWI438991B
TWI438991B TW099147226A TW99147226A TWI438991B TW I438991 B TWI438991 B TW I438991B TW 099147226 A TW099147226 A TW 099147226A TW 99147226 A TW99147226 A TW 99147226A TW I438991 B TWI438991 B TW I438991B
Authority
TW
Taiwan
Prior art keywords
solder
semiconductor laser
layer
frame
laser device
Prior art date
Application number
TW099147226A
Other languages
English (en)
Chinese (zh)
Other versions
TW201140971A (en
Inventor
久義浩
田中秀幸
八代正和
幸長則善
Original Assignee
三菱電機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機股份有限公司 filed Critical 三菱電機股份有限公司
Publication of TW201140971A publication Critical patent/TW201140971A/zh
Application granted granted Critical
Publication of TWI438991B publication Critical patent/TWI438991B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Lasers (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW099147226A 2010-04-06 2010-12-31 Semiconductor laser device TWI438991B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010087925A JP5644160B2 (ja) 2010-04-06 2010-04-06 半導体レーザ装置

Publications (2)

Publication Number Publication Date
TW201140971A TW201140971A (en) 2011-11-16
TWI438991B true TWI438991B (zh) 2014-05-21

Family

ID=44746071

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099147226A TWI438991B (zh) 2010-04-06 2010-12-31 Semiconductor laser device

Country Status (3)

Country Link
JP (1) JP5644160B2 (https=)
CN (1) CN102214894B (https=)
TW (1) TWI438991B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8867582B2 (en) 2012-04-04 2014-10-21 Osram Opto Semiconductors Gmbh Laser diode assembly
DE102012102305B4 (de) * 2012-03-19 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserdiodenvorrichtung
CN104067387B (zh) * 2012-03-22 2016-12-14 三菱电机株式会社 半导体装置及其制造方法
DE102012103160A1 (de) 2012-04-12 2013-10-17 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
US9008138B2 (en) 2012-04-12 2015-04-14 Osram Opto Semiconductors Gmbh Laser diode device
JP2014209508A (ja) * 2013-04-16 2014-11-06 住友電気工業株式会社 はんだ付半導体デバイス、実装はんだ付半導体デバイス、はんだ付半導体デバイスの製造方法および実装方法
JP6572803B2 (ja) * 2016-03-09 2019-09-11 三菱電機株式会社 半導体レーザ装置
CN119327352A (zh) * 2024-10-17 2025-01-21 河南黄河旋风股份有限公司 合成中间带孔复合片所用组合件及其合成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559817A (en) * 1994-11-23 1996-09-24 Lucent Technologies Inc. Complaint layer metallization
JP3607220B2 (ja) * 2001-06-06 2005-01-05 松下電器産業株式会社 半導体レーザ装置
JP3882712B2 (ja) * 2002-08-09 2007-02-21 住友電気工業株式会社 サブマウントおよび半導体装置
JP2004327982A (ja) * 2003-04-11 2004-11-18 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005190520A (ja) * 2003-12-24 2005-07-14 Sankyo Seiki Mfg Co Ltd 光ヘッド装置
JP2005303169A (ja) * 2004-04-15 2005-10-27 Renesas Technology Corp 半導体装置およびその製造方法
JP2006024812A (ja) * 2004-07-09 2006-01-26 Sony Corp 半導体素子搭載のリードフレームとそれを用いた半導体装置
JP4513513B2 (ja) * 2004-11-09 2010-07-28 株式会社村田製作所 電子部品の製造方法
JP2006319109A (ja) * 2005-05-12 2006-11-24 Matsushita Electric Ind Co Ltd 半導体装置用リードフレームおよびそれを用いた半導体装置用パッケージとその製造方法
JP5095091B2 (ja) * 2005-06-08 2012-12-12 シャープ株式会社 レーザ装置の製造方法
JP4740030B2 (ja) * 2005-06-08 2011-08-03 シャープ株式会社 レーザ装置の製造方法
CN100592585C (zh) * 2006-03-28 2010-02-24 三菱电机株式会社 光学元件用组件及使用该组件的光学半导体器件

Also Published As

Publication number Publication date
JP2011222627A (ja) 2011-11-04
CN102214894A (zh) 2011-10-12
CN102214894B (zh) 2013-07-24
TW201140971A (en) 2011-11-16
JP5644160B2 (ja) 2014-12-24

Similar Documents

Publication Publication Date Title
TWI438991B (zh) Semiconductor laser device
US20200219848A1 (en) Method of forming a chip assembly and chip assembly
EP3257072B1 (en) Repairing method and manufacturing method of micro-led device
CN101916746B (zh) 副安装座及其制造方法
CN102272907B (zh) 形成倒装芯片互连的原位熔化和回流处理及其系统
JP6345347B2 (ja) 半導体装置、半導体装置の製造方法、及び接合材料
CN101194359B (zh) 副安装座及其制造方法
JP2016155173A (ja) 無フラックス接合用ソルダボール、その製造方法及びソルダバンプ形成方法
JP5092168B2 (ja) ペルチェ素子熱電変換モジュール、ペルチェ素子熱電変換モジュールの製造方法および光通信モジュール
EP1894239B1 (en) Flip chip die assembly using thin flexible substrates
JP2016051743A (ja) 金属層間のはんだ接合の形成方法
US8227271B1 (en) Packaging method of wafer level chips
CN103828066A (zh) 模制引线框架上的太阳能电池模块和制造方法
US11756916B2 (en) Method for the manufacture of integrated devices including a die fixed to a leadframe
CN102248240B (zh) 用加强冷却方法在晶粒-基板焊接过程降低精密半导体装置的金属堆栈中的机械应力
US8900926B2 (en) Chip package method
CN115566013A (zh) 一种多载体多芯片不同键合丝的塑封封装件及其制备方法
JP7223772B2 (ja) 電子部品の接合方法および接合構造体
KR20100093857A (ko) 가열부를 갖는 다이 본딩 장치 및 이를 이용한 다이 본딩 방법
TWI654779B (zh) 發光二極體結構及其製造方法
TWI531087B (zh) 發光二極體結構
JP6179287B2 (ja) 半導体装置の製造方法
TWI529819B (zh) 用於半導體封裝之滾裝式囊封方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees