CN102214894B - 半导体激光器装置及其制造方法 - Google Patents

半导体激光器装置及其制造方法 Download PDF

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Publication number
CN102214894B
CN102214894B CN201110083417.5A CN201110083417A CN102214894B CN 102214894 B CN102214894 B CN 102214894B CN 201110083417 A CN201110083417 A CN 201110083417A CN 102214894 B CN102214894 B CN 102214894B
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CN
China
Prior art keywords
semiconductor laser
solder
frame
layer
laser device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110083417.5A
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English (en)
Chinese (zh)
Other versions
CN102214894A (zh
Inventor
久义浩
田中秀幸
八代正和
幸长则善
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of CN102214894A publication Critical patent/CN102214894A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Semiconductor Lasers (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201110083417.5A 2010-04-06 2011-04-02 半导体激光器装置及其制造方法 Expired - Fee Related CN102214894B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-087925 2010-04-06
JP2010087925A JP5644160B2 (ja) 2010-04-06 2010-04-06 半導体レーザ装置

Publications (2)

Publication Number Publication Date
CN102214894A CN102214894A (zh) 2011-10-12
CN102214894B true CN102214894B (zh) 2013-07-24

Family

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CN201110083417.5A Expired - Fee Related CN102214894B (zh) 2010-04-06 2011-04-02 半导体激光器装置及其制造方法

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Country Link
JP (1) JP5644160B2 (https=)
CN (1) CN102214894B (https=)
TW (1) TWI438991B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8867582B2 (en) 2012-04-04 2014-10-21 Osram Opto Semiconductors Gmbh Laser diode assembly
DE102012102305B4 (de) * 2012-03-19 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserdiodenvorrichtung
CN104067387B (zh) * 2012-03-22 2016-12-14 三菱电机株式会社 半导体装置及其制造方法
DE102012103160A1 (de) 2012-04-12 2013-10-17 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
US9008138B2 (en) 2012-04-12 2015-04-14 Osram Opto Semiconductors Gmbh Laser diode device
JP2014209508A (ja) * 2013-04-16 2014-11-06 住友電気工業株式会社 はんだ付半導体デバイス、実装はんだ付半導体デバイス、はんだ付半導体デバイスの製造方法および実装方法
JP6572803B2 (ja) * 2016-03-09 2019-09-11 三菱電機株式会社 半導体レーザ装置
CN119327352A (zh) * 2024-10-17 2025-01-21 河南黄河旋风股份有限公司 合成中间带孔复合片所用组合件及其合成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1719676A (zh) * 2004-07-09 2006-01-11 索尼株式会社 搭载半导体元件的引线框架和使用该引线框架的半导体器件
CN101068064A (zh) * 2006-03-28 2007-11-07 三菱电机株式会社 光学元件用组件及使用该组件的光学半导体器件
CN101242077A (zh) * 2005-06-08 2008-08-13 夏普株式会社 制造激光器件的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559817A (en) * 1994-11-23 1996-09-24 Lucent Technologies Inc. Complaint layer metallization
JP3607220B2 (ja) * 2001-06-06 2005-01-05 松下電器産業株式会社 半導体レーザ装置
JP3882712B2 (ja) * 2002-08-09 2007-02-21 住友電気工業株式会社 サブマウントおよび半導体装置
JP2004327982A (ja) * 2003-04-11 2004-11-18 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005190520A (ja) * 2003-12-24 2005-07-14 Sankyo Seiki Mfg Co Ltd 光ヘッド装置
JP2005303169A (ja) * 2004-04-15 2005-10-27 Renesas Technology Corp 半導体装置およびその製造方法
JP4513513B2 (ja) * 2004-11-09 2010-07-28 株式会社村田製作所 電子部品の製造方法
JP2006319109A (ja) * 2005-05-12 2006-11-24 Matsushita Electric Ind Co Ltd 半導体装置用リードフレームおよびそれを用いた半導体装置用パッケージとその製造方法
JP4740030B2 (ja) * 2005-06-08 2011-08-03 シャープ株式会社 レーザ装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1719676A (zh) * 2004-07-09 2006-01-11 索尼株式会社 搭载半导体元件的引线框架和使用该引线框架的半导体器件
CN101242077A (zh) * 2005-06-08 2008-08-13 夏普株式会社 制造激光器件的方法
CN101068064A (zh) * 2006-03-28 2007-11-07 三菱电机株式会社 光学元件用组件及使用该组件的光学半导体器件

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2002-368323A 2002.12.20

Also Published As

Publication number Publication date
JP2011222627A (ja) 2011-11-04
CN102214894A (zh) 2011-10-12
TW201140971A (en) 2011-11-16
TWI438991B (zh) 2014-05-21
JP5644160B2 (ja) 2014-12-24

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