TWI435666B - 輻散熱電路板及其製造方法 - Google Patents

輻散熱電路板及其製造方法 Download PDF

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Publication number
TWI435666B
TWI435666B TW100124564A TW100124564A TWI435666B TW I435666 B TWI435666 B TW I435666B TW 100124564 A TW100124564 A TW 100124564A TW 100124564 A TW100124564 A TW 100124564A TW I435666 B TWI435666 B TW I435666B
Authority
TW
Taiwan
Prior art keywords
insulating layer
metal
circuit board
heat dissipation
dissipation circuit
Prior art date
Application number
TW100124564A
Other languages
English (en)
Chinese (zh)
Other versions
TW201220979A (en
Inventor
安允鎬
金恩真
李赫洙
朴宰萬
趙寅熙
朴眩奎
金海燕
Original Assignee
Ｌｇ伊諾特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100070187A external-priority patent/KR101172168B1/ko
Priority claimed from KR1020100094630A external-priority patent/KR101154644B1/ko
Application filed by Ｌｇ伊諾特股份有限公司 filed Critical Ｌｇ伊諾特股份有限公司
Publication of TW201220979A publication Critical patent/TW201220979A/zh
Application granted granted Critical
Publication of TWI435666B publication Critical patent/TWI435666B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW100124564A 2010-07-20 2011-07-12 輻散熱電路板及其製造方法 TWI435666B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100070187A KR101172168B1 (ko) 2010-07-20 2010-07-20 방열회로기판 및 그의 제조 방법
KR1020100094630A KR101154644B1 (ko) 2010-09-29 2010-09-29 방열회로기판 및 그의 제조 방법

Publications (2)

Publication Number Publication Date
TW201220979A TW201220979A (en) 2012-05-16
TWI435666B true TWI435666B (zh) 2014-04-21

Family

ID=45497272

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100124564A TWI435666B (zh) 2010-07-20 2011-07-12 輻散熱電路板及其製造方法

Country Status (6)

Country Link
US (1) US9844142B2 (enExample)
EP (1) EP2596691B1 (enExample)
JP (1) JP6027001B2 (enExample)
CN (1) CN103120041B (enExample)
TW (1) TWI435666B (enExample)
WO (1) WO2012011701A2 (enExample)

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TWI505765B (zh) * 2010-12-14 2015-10-21 欣興電子股份有限公司 線路板及其製造方法
WO2014060381A1 (de) 2012-10-18 2014-04-24 Bayer Cropscience Ag Heterocyclische verbindungen als schädlingsbekämpfungsmittel
TWI451601B (zh) * 2012-10-26 2014-09-01 Lighten Corp 發光模組
TW201545619A (zh) * 2014-05-22 2015-12-01 Lighten Corp 導熱基板的製作方法
TWI544868B (zh) * 2014-07-11 2016-08-01 台達電子工業股份有限公司 散熱模組及其結合方法
KR101652904B1 (ko) 2016-01-14 2016-08-31 주식회사 엠디엠 전력반도체 모듈 패키지와 pcb의 방열을 위한 대전력 다층 pcb 및 그 제조 방법
US10381322B1 (en) 2018-04-23 2019-08-13 Sandisk Technologies Llc Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same
KR102662861B1 (ko) 2018-07-13 2024-05-03 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 배터리 모듈
US10879260B2 (en) 2019-02-28 2020-12-29 Sandisk Technologies Llc Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same
CN116941334A (zh) * 2021-04-26 2023-10-24 Lg 伊诺特有限公司 电路板
CN113727515A (zh) * 2021-08-27 2021-11-30 江门市华锐铝基板股份公司 一种金属覆铜板
JP7518395B2 (ja) * 2021-12-20 2024-07-18 日亜化学工業株式会社 回路基板、発光装置及びそれらの製造方法
WO2024219471A1 (ja) * 2023-04-18 2024-10-24 京セラ株式会社 配線基板

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JPH1140901A (ja) * 1997-07-23 1999-02-12 Sharp Corp 回路基板
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Also Published As

Publication number Publication date
JP2013532901A (ja) 2013-08-19
EP2596691B1 (en) 2018-11-07
TW201220979A (en) 2012-05-16
EP2596691A2 (en) 2013-05-29
US20130118782A1 (en) 2013-05-16
CN103120041A (zh) 2013-05-22
CN103120041B (zh) 2016-06-29
JP6027001B2 (ja) 2016-11-16
WO2012011701A3 (en) 2012-05-10
EP2596691A4 (en) 2015-02-11
WO2012011701A9 (en) 2012-03-22
US9844142B2 (en) 2017-12-12
WO2012011701A2 (en) 2012-01-26

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