TWI435666B - 輻散熱電路板及其製造方法 - Google Patents
輻散熱電路板及其製造方法 Download PDFInfo
- Publication number
- TWI435666B TWI435666B TW100124564A TW100124564A TWI435666B TW I435666 B TWI435666 B TW I435666B TW 100124564 A TW100124564 A TW 100124564A TW 100124564 A TW100124564 A TW 100124564A TW I435666 B TWI435666 B TW I435666B
- Authority
- TW
- Taiwan
- Prior art keywords
- insulating layer
- metal
- circuit board
- heat dissipation
- dissipation circuit
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 305
- 239000002184 metal Substances 0.000 claims description 305
- 230000017525 heat dissipation Effects 0.000 claims description 91
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 85
- 229910000679 solder Inorganic materials 0.000 claims description 70
- 239000010949 copper Substances 0.000 claims description 57
- 239000011889 copper foil Substances 0.000 claims description 54
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 48
- 230000005855 radiation Effects 0.000 claims description 45
- 229920005989 resin Polymers 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 229910045601 alloy Inorganic materials 0.000 claims description 28
- 239000000956 alloy Substances 0.000 claims description 28
- 239000007787 solid Substances 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 238000009413 insulation Methods 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 230000001747 exhibiting effect Effects 0.000 claims description 13
- 238000007731 hot pressing Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 239000005341 toughened glass Substances 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 250
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 15
- 239000010931 gold Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000010297 mechanical methods and process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000005226 mechanical processes and functions Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polythioimino group Polymers 0.000 description 1
- 229920002578 polythiourethane polymer Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100070187A KR101172168B1 (ko) | 2010-07-20 | 2010-07-20 | 방열회로기판 및 그의 제조 방법 |
| KR1020100094630A KR101154644B1 (ko) | 2010-09-29 | 2010-09-29 | 방열회로기판 및 그의 제조 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201220979A TW201220979A (en) | 2012-05-16 |
| TWI435666B true TWI435666B (zh) | 2014-04-21 |
Family
ID=45497272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100124564A TWI435666B (zh) | 2010-07-20 | 2011-07-12 | 輻散熱電路板及其製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9844142B2 (enExample) |
| EP (1) | EP2596691B1 (enExample) |
| JP (1) | JP6027001B2 (enExample) |
| CN (1) | CN103120041B (enExample) |
| TW (1) | TWI435666B (enExample) |
| WO (1) | WO2012011701A2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI505765B (zh) * | 2010-12-14 | 2015-10-21 | 欣興電子股份有限公司 | 線路板及其製造方法 |
| WO2014060381A1 (de) | 2012-10-18 | 2014-04-24 | Bayer Cropscience Ag | Heterocyclische verbindungen als schädlingsbekämpfungsmittel |
| TWI451601B (zh) * | 2012-10-26 | 2014-09-01 | Lighten Corp | 發光模組 |
| TW201545619A (zh) * | 2014-05-22 | 2015-12-01 | Lighten Corp | 導熱基板的製作方法 |
| TWI544868B (zh) * | 2014-07-11 | 2016-08-01 | 台達電子工業股份有限公司 | 散熱模組及其結合方法 |
| KR101652904B1 (ko) | 2016-01-14 | 2016-08-31 | 주식회사 엠디엠 | 전력반도체 모듈 패키지와 pcb의 방열을 위한 대전력 다층 pcb 및 그 제조 방법 |
| US10381322B1 (en) | 2018-04-23 | 2019-08-13 | Sandisk Technologies Llc | Three-dimensional memory device containing self-aligned interlocking bonded structure and method of making the same |
| KR102662861B1 (ko) | 2018-07-13 | 2024-05-03 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 배터리 모듈 |
| US10879260B2 (en) | 2019-02-28 | 2020-12-29 | Sandisk Technologies Llc | Bonded assembly of a support die and plural memory dies containing laterally shifted vertical interconnections and methods for making the same |
| CN116941334A (zh) * | 2021-04-26 | 2023-10-24 | Lg 伊诺特有限公司 | 电路板 |
| CN113727515A (zh) * | 2021-08-27 | 2021-11-30 | 江门市华锐铝基板股份公司 | 一种金属覆铜板 |
| JP7518395B2 (ja) * | 2021-12-20 | 2024-07-18 | 日亜化学工業株式会社 | 回路基板、発光装置及びそれらの製造方法 |
| WO2024219471A1 (ja) * | 2023-04-18 | 2024-10-24 | 京セラ株式会社 | 配線基板 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5050040A (en) * | 1988-10-21 | 1991-09-17 | Texas Instruments Incorporated | Composite material, a heat-dissipating member using the material in a circuit system, the circuit system |
| DE69401195T2 (de) * | 1994-01-12 | 1997-07-03 | Magnetek Spa | Laminare Platte für die Herstellung von gedruckten Schaltungen, daraus hergestellte gedruckte Schaltung und Verfahren zu ihrer Herstellung |
| JP3540471B2 (ja) * | 1995-11-30 | 2004-07-07 | 三菱電機株式会社 | 半導体モジュール |
| JPH1140901A (ja) * | 1997-07-23 | 1999-02-12 | Sharp Corp | 回路基板 |
| EP0926729A3 (en) * | 1997-12-10 | 1999-12-08 | Mitsubishi Gas Chemical Company, Inc. | Semiconductor plastic package and process for the production thereof |
| JP3556922B2 (ja) | 2001-05-07 | 2004-08-25 | 富士通株式会社 | バンプ形成方法 |
| JP4045781B2 (ja) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
| TWI255001B (en) | 2001-12-13 | 2006-05-11 | Matsushita Electric Industrial Co Ltd | Metal wiring substrate, semiconductor device and the manufacturing method thereof |
| JP4148932B2 (ja) | 2004-08-31 | 2008-09-10 | シャープ株式会社 | 半導体装置、半導体モジュール及び半導体装置の製造方法 |
| JP2006165114A (ja) | 2004-12-03 | 2006-06-22 | Nec Corp | 半導体素子の実装方法及び実装構造、装置 |
| JP2006318986A (ja) | 2005-05-10 | 2006-11-24 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント回路板およびその製造方法 |
| KR100629521B1 (ko) | 2005-07-29 | 2006-09-28 | 삼성전자주식회사 | Ｌｅｄ 패키지 및 그 제조방법과 이를 이용한 ｌｅｄ어레이 모듈 |
| TWM295795U (en) | 2005-12-26 | 2006-08-11 | Everlight Electronics Co Ltd | Enhance power light-emitting diode |
| KR20080053048A (ko) | 2006-12-08 | 2008-06-12 | 엘지마이크론 주식회사 | 방열회로기판 및 그 제조방법 |
| TWI339883B (en) | 2007-02-02 | 2011-04-01 | Unimicron Technology Corp | Substrate structure for semiconductor package and manufacturing method thereof |
| WO2008143076A1 (ja) | 2007-05-18 | 2008-11-27 | Denki Kagaku Kogyo Kabushiki Kaisha | 金属ベース回路基板 |
| TWM339772U (en) | 2007-05-25 | 2008-09-01 | Kai-Jie Huang | Heat conducting substrate of light emitting diode |
| CN101252157A (zh) | 2007-11-30 | 2008-08-27 | 和谐光电科技（泉州）有限公司 | 一种发光二极管(led)光源的封装结构 |
| US8148747B2 (en) * | 2008-03-25 | 2012-04-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/cap heat spreader |
| US7948076B2 (en) * | 2008-03-25 | 2011-05-24 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and vertical signal routing |
| US20100072511A1 (en) * | 2008-03-25 | 2010-03-25 | Lin Charles W C | Semiconductor chip assembly with copper/aluminum post/base heat spreader |
| TWI385824B (zh) | 2008-04-25 | 2013-02-11 | Advanced Optoelectronic Tech | 光源裝置 |
| KR101036388B1 (ko) * | 2008-08-19 | 2011-05-23 | 삼성전기주식회사 | 인쇄회로기판 및 이의 제조 방법 |
-
2011
- 2011-07-12 TW TW100124564A patent/TWI435666B/zh active
- 2011-07-15 CN CN201180045286.XA patent/CN103120041B/zh active Active
- 2011-07-15 WO PCT/KR2011/005218 patent/WO2012011701A2/en not_active Ceased
- 2011-07-15 US US13/811,365 patent/US9844142B2/en active Active
- 2011-07-15 EP EP11809828.4A patent/EP2596691B1/en active Active
- 2011-07-15 JP JP2013520642A patent/JP6027001B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9844142B2 (en) | 2017-12-12 |
| JP2013532901A (ja) | 2013-08-19 |
| EP2596691A2 (en) | 2013-05-29 |
| JP6027001B2 (ja) | 2016-11-16 |
| WO2012011701A3 (en) | 2012-05-10 |
| EP2596691A4 (en) | 2015-02-11 |
| EP2596691B1 (en) | 2018-11-07 |
| CN103120041B (zh) | 2016-06-29 |
| TW201220979A (en) | 2012-05-16 |
| WO2012011701A9 (en) | 2012-03-22 |
| US20130118782A1 (en) | 2013-05-16 |
| WO2012011701A2 (en) | 2012-01-26 |
| CN103120041A (zh) | 2013-05-22 |
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