DE69401195T2 - Laminare Platte für die Herstellung von gedruckten Schaltungen, daraus hergestellte gedruckte Schaltung und Verfahren zu ihrer Herstellung - Google Patents
Laminare Platte für die Herstellung von gedruckten Schaltungen, daraus hergestellte gedruckte Schaltung und Verfahren zu ihrer HerstellungInfo
- Publication number
- DE69401195T2 DE69401195T2 DE69401195T DE69401195T DE69401195T2 DE 69401195 T2 DE69401195 T2 DE 69401195T2 DE 69401195 T DE69401195 T DE 69401195T DE 69401195 T DE69401195 T DE 69401195T DE 69401195 T2 DE69401195 T2 DE 69401195T2
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- manufacture
- projection
- board
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94830005A EP0667736B1 (de) | 1994-01-12 | 1994-01-12 | Laminare Platte für die Herstellung von gedruckten Schaltungen, daraus hergestellte gedruckte Schaltung und Verfahren zu ihrer Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69401195D1 DE69401195D1 (de) | 1997-01-30 |
DE69401195T2 true DE69401195T2 (de) | 1997-07-03 |
Family
ID=8218363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69401195T Expired - Fee Related DE69401195T2 (de) | 1994-01-12 | 1994-01-12 | Laminare Platte für die Herstellung von gedruckten Schaltungen, daraus hergestellte gedruckte Schaltung und Verfahren zu ihrer Herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5523919A (de) |
EP (1) | EP0667736B1 (de) |
AT (1) | ATE146644T1 (de) |
CA (1) | CA2139824A1 (de) |
DE (1) | DE69401195T2 (de) |
ES (1) | ES2095733T3 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10048243A1 (de) * | 2000-09-29 | 2002-04-18 | Bosch Gmbh Robert | Substrat mit geglätteter Oberfläche und Verfahren zu seiner Herstellung |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2742294B1 (fr) * | 1995-12-11 | 1998-02-27 | Valeo Electronique | Assemblage electronique a drain thermique, notamment pour transformateur haute tension de lampe a decharge de projecteur de vehicule automobile |
US5812375A (en) * | 1996-05-06 | 1998-09-22 | Cummins Engine Company, Inc. | Electronic assembly for selective heat sinking and two-sided component attachment |
DE19750306A1 (de) * | 1997-11-13 | 1999-05-20 | Bosch Gmbh Robert | Elektronisches Steuergerät |
DE19805492C2 (de) * | 1998-02-11 | 1999-12-02 | Siemens Ag | Leiterplatte |
FR2801763B1 (fr) * | 1999-11-30 | 2002-02-15 | Sagem | Module electronique de puissance et procede de fabrication d'un tel module |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
US8068346B2 (en) * | 2004-05-04 | 2011-11-29 | Hamilton Sundstrand Corporation | Circuit board with high density power semiconductors |
US20080158821A1 (en) * | 2004-11-30 | 2008-07-03 | Telefonaktiebolaget Lm Ericsson (Publ) | Printed Board Assembly with Improved Heat Dissipation |
DE102009051632A1 (de) * | 2009-11-02 | 2011-05-05 | Beru Ag | Leiterplatte mit Kühlkörper |
US20110272179A1 (en) * | 2010-05-06 | 2011-11-10 | Vasoya Kalu K | Printed Circuit Board with Embossed Hollow Heatsink Pad |
TWI435666B (zh) * | 2010-07-20 | 2014-04-21 | Lg Innotek Co Ltd | 輻散熱電路板及其製造方法 |
DE102013000169A1 (de) * | 2013-01-09 | 2014-07-10 | Carl Freudenberg Kg | Anordnung mit einer flexiblen Leiterplatte |
US9883580B1 (en) | 2014-04-11 | 2018-01-30 | Adura Led Solutions, Llc | Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly |
TWI544868B (zh) * | 2014-07-11 | 2016-08-01 | 台達電子工業股份有限公司 | 散熱模組及其結合方法 |
JP6287659B2 (ja) * | 2014-07-22 | 2018-03-07 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP2016025229A (ja) * | 2014-07-22 | 2016-02-08 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6287815B2 (ja) * | 2014-12-24 | 2018-03-07 | 株式会社オートネットワーク技術研究所 | 回路構成体の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3165672A (en) * | 1959-06-15 | 1965-01-12 | Burroughs Corp | Printed circuit baseboard |
GB1217148A (en) * | 1967-07-13 | 1970-12-31 | Nat Res Dev | Improvements in or relating to substrates for microelectronic components |
FR2615347B1 (fr) * | 1987-05-15 | 1993-07-23 | Neiman Sa | Module de puissance pour equipements automobiles |
DE3829117A1 (de) * | 1988-08-27 | 1990-03-08 | Standard Elektrik Lorenz Ag | Metallkern-leiterplatte |
JPH03273465A (ja) * | 1990-03-23 | 1991-12-04 | Yokogawa Electric Corp | 料金前納方式の無線型料金支払い装置及び携帯可能媒体 |
JPH0451597A (ja) * | 1990-06-20 | 1992-02-20 | Hitachi Ltd | 放熱型高密度プリント配線板 |
US5220487A (en) * | 1992-01-27 | 1993-06-15 | International Business Machines Corporation | Electronic package with enhanced heat sinking |
DE4232575A1 (de) * | 1992-09-29 | 1994-03-31 | Bosch Gmbh Robert | Anordnung mit einer Leiterplatte, mindestens einem Leistungsbauelement und einem Kühlkörper |
-
1994
- 1994-01-12 ES ES94830005T patent/ES2095733T3/es not_active Expired - Lifetime
- 1994-01-12 AT AT94830005T patent/ATE146644T1/de not_active IP Right Cessation
- 1994-01-12 EP EP94830005A patent/EP0667736B1/de not_active Expired - Lifetime
- 1994-01-12 DE DE69401195T patent/DE69401195T2/de not_active Expired - Fee Related
-
1995
- 1995-01-09 CA CA002139824A patent/CA2139824A1/en not_active Abandoned
- 1995-01-10 US US08/371,009 patent/US5523919A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10048243A1 (de) * | 2000-09-29 | 2002-04-18 | Bosch Gmbh Robert | Substrat mit geglätteter Oberfläche und Verfahren zu seiner Herstellung |
Also Published As
Publication number | Publication date |
---|---|
DE69401195D1 (de) | 1997-01-30 |
EP0667736A1 (de) | 1995-08-16 |
CA2139824A1 (en) | 1995-07-13 |
ES2095733T3 (es) | 1997-02-16 |
ATE146644T1 (de) | 1997-01-15 |
US5523919A (en) | 1996-06-04 |
EP0667736B1 (de) | 1996-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |