TWI435332B - 單次可程式化記憶體及其操作方法 - Google Patents

單次可程式化記憶體及其操作方法 Download PDF

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Publication number
TWI435332B
TWI435332B TW095128581A TW95128581A TWI435332B TW I435332 B TWI435332 B TW I435332B TW 095128581 A TW095128581 A TW 095128581A TW 95128581 A TW95128581 A TW 95128581A TW I435332 B TWI435332 B TW I435332B
Authority
TW
Taiwan
Prior art keywords
programmable
transistor
current
electrode
control electrode
Prior art date
Application number
TW095128581A
Other languages
English (en)
Chinese (zh)
Other versions
TW200713289A (en
Inventor
Alexander B Hoefler
Gowrishankar L Chindalore
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of TW200713289A publication Critical patent/TW200713289A/zh
Application granted granted Critical
Publication of TWI435332B publication Critical patent/TWI435332B/zh

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/18—Auxiliary circuits, e.g. for writing into memory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices

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  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
TW095128581A 2005-08-05 2006-08-04 單次可程式化記憶體及其操作方法 TWI435332B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/197,814 US7206214B2 (en) 2005-08-05 2005-08-05 One time programmable memory and method of operation

Publications (2)

Publication Number Publication Date
TW200713289A TW200713289A (en) 2007-04-01
TWI435332B true TWI435332B (zh) 2014-04-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128581A TWI435332B (zh) 2005-08-05 2006-08-04 單次可程式化記憶體及其操作方法

Country Status (6)

Country Link
US (1) US7206214B2 (cg-RX-API-DMAC7.html)
JP (1) JP5124456B2 (cg-RX-API-DMAC7.html)
KR (1) KR101236582B1 (cg-RX-API-DMAC7.html)
CN (1) CN101361139B (cg-RX-API-DMAC7.html)
TW (1) TWI435332B (cg-RX-API-DMAC7.html)
WO (1) WO2007019109A2 (cg-RX-API-DMAC7.html)

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US8866121B2 (en) 2011-07-29 2014-10-21 Sandisk 3D Llc Current-limiting layer and a current-reducing layer in a memory device
US8659001B2 (en) 2011-09-01 2014-02-25 Sandisk 3D Llc Defect gradient to boost nonvolatile memory performance
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US8637413B2 (en) 2011-12-02 2014-01-28 Sandisk 3D Llc Nonvolatile resistive memory element with a passivated switching layer
US8698119B2 (en) 2012-01-19 2014-04-15 Sandisk 3D Llc Nonvolatile memory device using a tunnel oxide as a current limiter element
US8686386B2 (en) 2012-02-17 2014-04-01 Sandisk 3D Llc Nonvolatile memory device using a varistor as a current limiter element
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US20140198583A1 (en) * 2013-01-17 2014-07-17 Infineon Technologies Ag Method and System for Reducing the Size of Nonvolatile Memories
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US8942034B2 (en) * 2013-02-05 2015-01-27 Qualcomm Incorporated System and method of programming a memory cell
US20140241031A1 (en) 2013-02-28 2014-08-28 Sandisk 3D Llc Dielectric-based memory cells having multi-level one-time programmable and bi-level rewriteable operating modes and methods of forming the same
JP2015076556A (ja) * 2013-10-10 2015-04-20 ソニー株式会社 メモリ装置、書込方法、読出方法
TWI543302B (zh) * 2014-03-14 2016-07-21 林崇榮 一次編程記憶體及其相關記憶胞結構
KR102169197B1 (ko) * 2014-09-16 2020-10-22 에스케이하이닉스 주식회사 향상된 프로그램 효율을 갖는 안티퓨즈 오티피 메모리 셀 및 셀 어레이
CN105513642B (zh) * 2014-09-24 2019-11-05 珠海创飞芯科技有限公司 Otp存储器
KR102258112B1 (ko) * 2015-04-01 2021-05-31 삼성전자주식회사 반도체 소자 및 이의 제조 방법
US9799662B2 (en) * 2015-08-18 2017-10-24 Ememory Technology Inc. Antifuse-type one time programming memory cell and array structure with same
TWI578325B (zh) * 2015-08-18 2017-04-11 力旺電子股份有限公司 反熔絲型一次編程的記憶胞及其相關的陣列結構
US10181357B2 (en) 2015-08-18 2019-01-15 Ememory Technology Inc. Code generating apparatus and one time programming block
US9634015B2 (en) * 2015-08-18 2017-04-25 Ememory Technology Inc. Antifuse-type one time programming memory cell and array structure with same
CN105243342B (zh) * 2015-10-08 2019-02-19 浪潮(北京)电子信息产业有限公司 一种基于一次可编程查找表的标准单元逻辑电路
US10109364B2 (en) * 2015-10-21 2018-10-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Non-volatile memory cell having multiple signal pathways to provide access to an antifuse of the memory cell
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US10103732B1 (en) 2017-10-04 2018-10-16 Synopsys, Inc. Low power voltage level shifter circuit
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CN108511024A (zh) * 2018-04-11 2018-09-07 珠海创飞芯科技有限公司 一种反熔丝编程方法、系统及反熔丝器件
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CN113540045A (zh) * 2020-04-15 2021-10-22 合肥晶合集成电路股份有限公司 一种反熔丝电路
CN111881638B (zh) * 2020-07-31 2024-04-26 上海华力微电子有限公司 可编程电路及其编程方法、读取方法
US11763875B2 (en) * 2021-05-26 2023-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Second word line combined with Y-MUX signal in high voltage memory program
CN113707207B (zh) * 2021-10-20 2022-02-15 成都凯路威电子有限公司 Otp存储器阵列和读写方法
TWI867695B (zh) * 2022-08-24 2024-12-21 振生半導體股份有限公司 多狀態的一次性可程式化記憶體電路

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Also Published As

Publication number Publication date
CN101361139A (zh) 2009-02-04
CN101361139B (zh) 2011-12-14
WO2007019109A2 (en) 2007-02-15
US7206214B2 (en) 2007-04-17
JP5124456B2 (ja) 2013-01-23
TW200713289A (en) 2007-04-01
JP2009503901A (ja) 2009-01-29
KR101236582B1 (ko) 2013-02-22
US20070030719A1 (en) 2007-02-08
WO2007019109A3 (en) 2007-11-22
KR20080041189A (ko) 2008-05-09

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