TWI430048B - Exposure method and exposure device - Google Patents

Exposure method and exposure device Download PDF

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Publication number
TWI430048B
TWI430048B TW97116837A TW97116837A TWI430048B TW I430048 B TWI430048 B TW I430048B TW 97116837 A TW97116837 A TW 97116837A TW 97116837 A TW97116837 A TW 97116837A TW I430048 B TWI430048 B TW I430048B
Authority
TW
Taiwan
Prior art keywords
substrate
supporting member
reticle
exposure apparatus
substrate supporting
Prior art date
Application number
TW97116837A
Other languages
English (en)
Chinese (zh)
Other versions
TW200912551A (en
Inventor
Ken Miyake
Toshihiro Takagi
Original Assignee
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Publication of TW200912551A publication Critical patent/TW200912551A/zh
Application granted granted Critical
Publication of TWI430048B publication Critical patent/TWI430048B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW97116837A 2007-05-10 2008-05-07 Exposure method and exposure device TWI430048B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007125805 2007-05-10

Publications (2)

Publication Number Publication Date
TW200912551A TW200912551A (en) 2009-03-16
TWI430048B true TWI430048B (zh) 2014-03-11

Family

ID=40001872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97116837A TWI430048B (zh) 2007-05-10 2008-05-07 Exposure method and exposure device

Country Status (5)

Country Link
JP (1) JP4176819B1 (ko)
KR (1) KR101118854B1 (ko)
CN (1) CN101663619B (ko)
TW (1) TWI430048B (ko)
WO (1) WO2008139643A1 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526714B2 (ja) * 2009-11-10 2014-06-18 凸版印刷株式会社 基板露光装置
JP5685756B2 (ja) 2010-11-10 2015-03-18 株式会社ブイ・テクノロジー フィルム露光方法
KR101260221B1 (ko) * 2011-12-01 2013-05-06 주식회사 엘지화학 마스크
KR20140080772A (ko) * 2012-12-18 2014-07-01 주식회사 원익아이피에스 얼라인 장치 및 이를 이용한 얼라인 방법
CN103616803B (zh) * 2013-11-25 2015-09-09 中国科学院长春光学精密机械与物理研究所 光栅尺真空复制曝光设备
CN104749894B (zh) * 2013-12-30 2017-08-29 上海微电子装备有限公司 一种改善掩模垂向重力弯曲的掩模台
JP6308877B2 (ja) * 2014-06-06 2018-04-11 キヤノントッキ株式会社 成膜装置
JP6399093B2 (ja) * 2014-08-01 2018-10-03 株式会社村田製作所 直描型露光装置
KR102357577B1 (ko) * 2014-08-28 2022-01-28 가부시키가이샤 오크세이사쿠쇼 투영 노광 장치, 투영 노광 방법, 투영 노광 장치용 포토마스크, 및 기판의 제조 방법
CN108467008B (zh) * 2018-03-12 2020-10-23 中国科学院光电技术研究所 一种柔性薄膜基底上微纳米结构的高精度制备方法
DE102020204941A1 (de) * 2020-04-20 2020-10-29 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zum Herstellen eines mit einer aushärtbaren Vergussmasse versehenen Substrats
WO2022083111A1 (zh) * 2020-10-19 2022-04-28 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211231A (ja) * 1985-06-25 1987-01-20 Hitachi Electronics Eng Co Ltd ウエハとマスクとの密着方法
JP2690960B2 (ja) * 1988-09-07 1997-12-17 株式会社日立製作所 拡大投影露光方法及びその装置
JPH07115055A (ja) * 1993-10-15 1995-05-02 Dainippon Screen Mfg Co Ltd 基板露光装置
JPH07245259A (ja) * 1994-03-03 1995-09-19 Topcon Corp 露光装置
JPH11312635A (ja) * 1998-04-28 1999-11-09 Ushio Inc コンタクト露光方法
AU1078700A (en) * 1998-11-06 2000-05-29 Nikon Corporation Exposure method and exposure apparatus
JP2002091010A (ja) * 2000-09-13 2002-03-27 Dainippon Printing Co Ltd 密着露光装置
JP2002367895A (ja) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd フォトレジストの露光方法および装置並びに基板
JP3983278B2 (ja) * 2005-06-21 2007-09-26 サンエー技研株式会社 露光方法および露光装置

Also Published As

Publication number Publication date
JP4176819B1 (ja) 2008-11-05
CN101663619B (zh) 2012-03-07
KR20100025520A (ko) 2010-03-09
WO2008139643A1 (ja) 2008-11-20
KR101118854B1 (ko) 2012-03-22
CN101663619A (zh) 2010-03-03
TW200912551A (en) 2009-03-16
JPWO2008139643A1 (ja) 2010-07-29

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