TWI430048B - Exposure method and exposure device - Google Patents

Description

Exposure method and exposure device

The present invention is an exposure method and an exposure apparatus in which a mask on which a pattern is drawn and a substrate on which a photosensitive layer is formed are superposed, and the substrate is irradiated with light by a mask to thereby replicate the pattern on the substrate.

Conventionally, in order to form a conductive pattern or the like on a surface of a printed circuit board or the like, an exposure method is widely used, in which a substrate on which a photosensitive layer is formed on a surface and a mask on which a pattern is drawn are placed, and the substrate is irradiated with light by a mask. Thereby, the pattern is reproduced on the photosensitive layer on the surface of the substrate.

In the exposure method, it is necessary to perform alignment of a plurality of conductive holes which are preset to the substrate and a pattern drawn on the photomask. In terms of alignment, alignment marks that are plurally set at positions corresponding to each other of the reticle and the substrate are utilized.

The alignment marks provided on the respective substrates and the reticle are read by a photo sensor such as a CCD camera in a state of being overlapped with each other, and the alignment mark between the substrate and the reticle is calculated based on the data. Offset. According to the calculation result, one of the substrate or the photomask is moved in the X-axis direction, the Y-axis direction, and the θ direction included in the plane of the substrate or the mask so that the positions of the alignment marks can match each other. And the alignment of the substrate and the reticle is performed.

After the alignment of the substrate and the reticle, the substrate is irradiated with light through the reticle, whereby the pattern drawn on the reticle is copied onto the photosensitive layer on the surface of the substrate to complete the exposure process.

However, the distance between the plurality of alignment marks attached to the mask and the substrate, that is, the distance between the alignment marks may be caused by manufacturing errors, temperature, humidity changes, or heat treatment until exposure engineering. Changes such as deformation. Therefore, the spacing between the plurality of alignment marks attached to the mask and the substrate may cause an error. As a result, it is difficult to completely match the alignment marks of the photomask and the substrate.

Therefore, it is possible to illuminate the photosensitive layer of the substrate through the reticle in a state in which the reticle and the substrate are uniformly contacted with each other and the reticle and the substrate are relatively curved in a concave or convex shape, thereby being drawn on the reticle. The size of the pattern is substantially changed to replicate the exposure method on the substrate.

The principle of this exposure method will be described with reference to FIG.

Fig. 15A shows a state in which the substrate 1 of the same length L and the mask 2 are uniformly in contact with each other in a planar manner. A pattern is drawn on one main surface 2A of the photomask 2. Further, the photomask 2 may be a method in which a film on which a pattern is drawn is adhered to a glass plate. The thickness T2 of the glass mask 2 which is usually used is about 5 mm. When the substrate 1 is a printed circuit board, the thickness T1 is often 1 mm or less. Further, the center line 2C of the thickness T2 of the mask 2 and the center line 2B of the thickness T1 of the substrate 1 are respectively indicated by a single lock line.

Next, FIG. 15B shows a state in which the substrate 1 and the reticle 2 are in contact with each other, and the reticle 2 and the substrate 1 are bent together so that the substrate 1 side of the reticle 2 can be formed in a concave shape. As shown in the figure, since the mask 2 has a thickness T2, the center line 2C of the thickness T2 is used as a boundary line, and the substrate 1 side is shortened, and the opposite side is elongated. The substrate 1 is the center line of the thickness T1 2B as the boundary line, the side of the mask 2 will stretch, and the opposite side will shorten. However, since the thickness T1 of the substrate 1 is considerably thinner than that of the photomask, the amount of expansion and contraction of the front and back surfaces of the substrate 1 is small.

As a result, in the portion where the substrate 1 and the photomask 2 are connected to each other, the length of the photomask 2 to the substrate 1 is only the reduction amount S1 of the surface of the mask 2 on the substrate 1 side and the surface of the substrate 1 on the photomask 2 side. The sum of the elongations S2 is substantially reduced. Therefore, when exposed in this state, the pattern drawn on the main surface 2A of the mask 2 is substantially reduced in proportion to this value and reproduced on the substrate 1.

Further, Fig. 15C shows a state in which the substrate 1 and the mask 2 are bent in the opposite direction to that in Fig. 15B. In this case, in the portion where the substrate 1 and the photomask 2 are connected to each other, the length of the photomask 2 to the substrate 1 is only the amount of elongation S1 of the surface of the substrate 2 on the side of the mask 2 and the surface of the mask 2 on the side of the substrate 1. The sum of the reduced amount S2' is substantially elongated.

When exposed in this state, the pattern drawn on the main surface 2A of the mask is substantially enlarged in proportion to the value and reproduced on the substrate 1.

According to this exposure method, even if the size of the pitch between the alignment marks of the substrate varies with each substrate, the size of the pitch between the alignment marks of one mask can be substantially changed to approach the alignment mark of the substrate. The size of the spacing. As a result, the pattern drawn on the photomask can be accurately reproduced at a predetermined position on the substrate without impairing the productivity and increasing the pressing cost.

The conventional exposure method and the conventional exposure apparatus used in the same will be described with reference to FIGS. 11 to 14 .

FIG. 12 is a schematic side cross-sectional view showing a conventional exposure apparatus, and FIG. 11 is a plan view showing the reticle and the reticle support member omitted.

The conventional exposure apparatus includes a substrate supporting member 4 for supporting the substrate 1 , a base member 5 for supporting the substrate supporting member 4 , and a mask supporting member 12 for supporting the outer edge portion of the mask 2 .

The mask supporting member 12 is configured to be guided by a guiding mechanism (not shown) by a driving mechanism (not shown) to approach and deviate from the substrate supporting member 4.

Further, the reticle support member 12 is provided with a frame 15, a position regulating pin 19 for regulating the position in the support surface of the reticle 2, and a coil spring 18 for allowing the reticle 2 to approach and deviate from the substrate supporting member 4 The direction of the platen spring 16 and the spacer 17 between the connecting frame 15 and the platen spring 16 are moved in the direction, and the structure supporting the reticle 2 is formed by these.

The sealing member 9 is provided on the substrate supporting member 4 so as to be able to surround the substrate 1. The surface opposite to the exposure surface 1a of the substrate 1 is in contact with the substrate supporting member 4. The substrate supporting member 4 adsorbs and holds the substrate 1 by a negative pressure acting through the vacuum suction hole 10, and the adsorption holding of the substrate 1 can be released by releasing the negative pressure.

The base member 5 is provided with an actuator 6 for applying a pressing force or a tensile force to the substrate supporting member 4. Between the substrate supporting member 4 and the base member 5, a plurality of connecting members 7 that restrict the operation other than the inclination of the substrate supporting member 4 are uniformly disposed so as to surround the actuator 6.

First, the alignment mark of the substrate 1 and the alignment mark of the reticle 2 are read by a photo sensor such as the CCD camera 3, and the alignment mark between the substrate 1 and the reticle 2 is calculated based on the read data. Offset (Figure 12). press As a result of this calculation, the actuator 6 is actuated to bend the substrate supporting member 4 together with the substrate 1 into a desired spherical shape (Fig. 13). Then, the reticle support member 15 is lowered toward the substrate supporting member 4 by a driving mechanism (not shown), and the reticle 2 is brought into contact with the sealing member 9. Thereby, the space area surrounded by the substrate 1, the substrate supporting member 4, and the photomask 2 is sealed by the sealing member 9. Next, the space region is decompressed by means such as a vacuum pump (not shown). By the differential pressure, the photomask 2 is uniformly contacted with the substrate 1 while being bent while being patterned in the manner of the substrate 1. The distance between the alignment marks drawn on the surface of the mask facing the substrate 1 is changed in such a manner that the mask 2 can be bent in a manner that can be modeled on the substrate 1.

In this state, the alignment mark of the substrate 1 and the alignment mark of the reticle 2 are read again by the CCD camera 3, and the offset between the alignment marks of the substrate 1 and the reticle 2 is calculated based on the read data. the amount. When the calculated value is equal to or smaller than the predetermined offset amount, the light 8 is irradiated onto the substrate 1 through the mask 2 to be exposed (FIG. 14).

However, the above conventional exposure method and exposure apparatus are not sufficient. In the conventional exposure method and exposure apparatus, in order to bend the substrate into a single spherical shape, it is effective only when the substrate is deformed once. The change in the size of the actual substrate is such that one of the X-axis direction and the Y-axis direction changes more than the other. Also, sometimes the resulting dimensional change will vary along the X or Y axis. Since the deformation of the substrate is not uniform, in the conventional exposure method and exposure apparatus, the alignment mark of the mask and the alignment mark pitch of the substrate cannot be matched, and the pattern drawn on the mask and the conductive hole of the substrate cannot be formed. Equal.

Further, in the substrate supporting method of the conventional exposure apparatus, the supporting force of the substrate is insufficient, and when the substrate supporting member is bent, a relative positional shift occurs between the substrate supporting member and the substrate. Therefore, the substantial change in the size of the pattern is less than the amount practically necessary.

Accordingly, the present invention provides an exposure method and an exposure apparatus which can perform exposure by aligning the scale of the substrate and the scale of the mask in the entire area even when the deformation of the substrate is not uniform, and ensuring practical use. The amount of dimensional change is a problem.

In order to solve the above problems, according to the present invention, an exposure method can be provided in which a mask having a pattern is disposed at a position of a photosensitive layer covering a substrate on which a photosensitive layer is formed, and the mask and the substrate are uniformly formed with each other. After the contact, the photosensitive layer of the substrate is irradiated with light by the photomask, thereby exposing the pattern to the substrate. The method of preparing is: the whole is a square shape, and has a first pair facing each other. a plate-shaped substrate supporting member having a side edge portion and a second pair of side edge portions facing each other, wherein the photosensitive layer is opposed to the surface on which the pattern is drawn on the mask, and the substrate is supported on the substrate The main surface of the member does not have a relative offset under the fixed support, so that the substrate supporting member extends in a first axis in the same direction as the side edge portion of the first pair, or extends to the above Two pairs of side edges The substrate support member and the substrate are deformed together into a desired curved shape while the second axis is centered, and the amount of bending is individually controlled, and the mask and the substrate are uniformly contacted with each other, and In a state where the substrate supporting member and the substrate are deformed into the desired curved shape, the photosensitive layer is irradiated with light by the photomask, whereby the size of the pattern is substantially changed and reproduced on the substrate.

Preferably, when the substrate supporting member is bent about the first axis or centered on the second axis, the bending of the substrate supporting member is individually controlled at a plurality of positions along the first and second axes, respectively. the amount.

The bending of the substrate supporting member centered on the first axis may be performed by applying a force or a moment to the side edges of the first pair, and the bending centered on the second axis may be caused by a force or a moment Acting on the side edges of the second pair described above.

A plurality of alignment marks may be respectively disposed at positions corresponding to the masks and the substrates, and the alignment marks are detected by the mark detecting means, and the alignment of the masks is calculated according to the detected data. The amount of deviation between the mark and the pitch mark of the substrate is controlled, and the amount of warpage of the substrate supporting member is controlled in accordance with the calculation result.

The above-described mark detecting means may be a CCD camera.

The pattern is slightly formed on the mask, and the substrate supporting member and the substrate are bent in a convex shape together with the substrate during exposure, whereby the surface of the substrate on which the photosensitive layer is formed is substantially enlarged. Forming a predetermined size, and making the photomask follow the substrate, thereby The size of the pattern is substantially reduced to form a predetermined size, and then the pattern can be reproduced on the substrate.

According to the present invention, it is possible to provide an exposure apparatus for uniformly illuminating a photosensitive layer of the substrate by the photomask after the mask having the pattern and the substrate on which the photosensitive layer is formed are uniformly contacted with each other. An exposure apparatus for embedding the pattern in the exposure method of the substrate, characterized in that the substrate supporting member is configured to fix and support the substrate on the entire surface of the substrate opposite to the surface on which the photosensitive layer is formed. The substrate supporting member has: a side edge portion of the first pair facing each other, and a side edge portion of the second pair facing each other, and a fixing support for preventing the relative displacement of the substrate a fixing support mechanism; the reticle supporting member is configured to support the reticle by a surface of the reticle in which the pattern is drawn to be opposite to the photosensitive layer; and the driving mechanism is capable of aligning the reticle The substrate is uniformly contacted in a manner to move the substrate supporting member and the reticle supporting member relative to each other; a plurality of first acting points are along Providing a side edge portion of the first pair of the substrate supporting members; the first deforming mechanism is configured to apply a force or a moment to the plurality of first acting points, thereby extending the substrate supporting member with the substrate a first axis that is in the same direction as the side edge portion of the first pair is curved; a plurality of second action points are disposed along a side edge portion of the second pair of the substrate supporting member; a second deformation mechanism that applies a force or a moment to the second plurality of points of action, whereby the substrate supporting member and the substrate extend along a second axis extending in the same direction as the side edges of the second pair a centrally bent; a guiding mechanism for guiding relative movement of the substrate supporting member and the reticle supporting member when the driving mechanism is actuated; and a light illuminating device for aligning the substrate by the reticle The above photosensitive layer illuminates light.

The first deformation mechanism may control the magnitude of the force or moment acting on the plurality of first action points to a predetermined amount, and the second deformation mechanism may respectively force the second action point acting on the plurality Or the magnitude of the moment is controlled to a predetermined amount.

The first deformation mechanism or the second deformation mechanism may include a motor. Further, the first deformation mechanism or the second deformation mechanism may have a mechanism that is driven by air pressure.

Moreover, the method may be: a mark detecting means for detecting a plurality of alignment marks respectively disposed at positions corresponding to the masks and the substrates; and an operation means for using the mark detecting means The detected data calculates an amount of shift between the alignment mark of the photomask and the alignment mark of the substrate, and at least one of the first deformation mechanism and the second deformation mechanism is as described above. As a result of the calculation by the calculation means, the amount of force or moment acting on at least one of the first action point and the second action point is adjusted to control the amount of bending of the substrate supporting member.

The reticle support member may have a configuration that allows the photomask to move in a direction in which the reticle is moved toward and away from the substrate.

The reticle support member may have a position regulating mechanism for regulating a position within the support surface of the reticle support member of the reticle.

The fixing support mechanism may include a plurality of grooves or peaks formed on a surface of the substrate supporting member that is fixed to support the substrate.

The fixing support mechanism may include a plurality of grooves formed in a surface of the substrate supporting member fixedly supporting the substrate, and a vacuum suction hole provided at at least one of the bottom of the groove and connected to at least one of the negative pressure sources.

The at least one vacuum suction hole provided at the bottom of the plurality of grooves may be connected to each groove or a negative pressure source of each group including a plurality of grooves.

The substrate supporting member may have a thickness of 5 mm or more.

The first deformation mechanism and the second deformation mechanism may be placed on a base member for supporting the substrate supporting member.

As described above, according to the present invention, it is practically possible to secure a sufficient amount of dimensional change, and even if the substrate is deformed in various forms, the substrate and the mask can be bent correspondingly, so that the scale of the substrate and the scale of the mask can be made. Exposure is consistent across the region.

The contents of the present invention described above will be described with reference to the drawings. 9A to 9C are cross-sectional views illustrating the principle of the present invention. FIG. 9A shows a state in which the substrate 1 and the photomask 2 which are in close contact with each other without causing a relative displacement with the substrate supporting member 11 are uniformly overlapped in a planar shape.

A pattern is drawn on one main surface 2A of the photomask 2. Further, the photomask 2 can be used by adhering a film on which a pattern is drawn to a glass plate. Generally, the thickness T2 of the glass mask 2 to be used is about 5 mm, and when the substrate 1 is a printed circuit board, the thickness T1 of the substrate 1 is often 1 mm or less. Further, the center line 2C of the thickness T2 of the photomask 2 and the center line 2D of the thickness which combines the thickness T1 of the substrate 1 and the thickness T3 of the substrate supporting member 4 are indicated by a single lock line.

Next, FIG. 9B shows a state in which the substrate 1 and the reticle 2 are in contact with each other, and the reticle 2 and the substrate 1 and the substrate supporting member 11 are bent together so that the substrate 1 side of the reticle 2 can be formed in a concave shape. As shown in the figure, the photomask 2 has a center line 2C of a thickness T2 as a boundary line, and the substrate 1 side is shortened, and the opposite side is elongated.

On the other hand, the substrate 1 is bent in a state in which it is tightly attached to the substrate supporting member 11 so as not to be in a positional relationship with the substrate supporting member 11, so that the substrate supporting member 11 is added with the thickness T1 of the substrate 1. The center line 2D of the thickness of the thickness T3 is a boundary line, and the whole is located on the extension side. As a result, the surface of the substrate 1 facing the mask 2 side is only elongated by S3.

As compared with the substrate 1 of the single body of FIG. 15 and the substrate 1 of FIG. 9 integrated with the substrate supporting member 11, it is conceivable that only the thickness T3 portion of the substrate supporting member 11 becomes thick. Therefore, the elongation S3 of the substrate 1 of Fig. 9B is made larger as compared with the elongation S2 of the substrate 1 of Fig. 15B. As a result, the length of the mask 2 of the portion where the substrate 1 and the mask 2 are connected to each other is the length S1 of only the surface of the substrate 2 on the side of the mask 2 and the surface of the mask 2 on the side of the mask 2 The sum of the quantities S3 is substantially reduced. If exposed in this state Then, the pattern drawn on the main surface 2A of the mask 2 is substantially reduced in proportion to the value and reproduced on the substrate.

Moreover, FIG. 9C shows a state in which the substrate 1 and the photomask 2 are bent in the opposite direction to the case of FIG. 9B. In this case, the length of the photomask 2 of the portion where the substrate 1 and the photomask 2 are connected to each other is the length of the substrate 1, and the length of the substrate 1 is only the elongation S1' of the surface of the substrate 1 on the side of the photomask 2 and the substrate 1 The sum of the reduction amounts S3' of the faces on the side of the mask 2 is substantially elongated.

In either case, S3>S2 and S3'>S2' are formed, so that a larger dimensional change amount can be secured than in the past.

As apparent from the above description, it is advantageous that the thickness T3 of the substrate supporting member 11 is thicker as long as there is no obstacle when bending. This is because the thickness T3 of the substrate supporting member 11 is thicker as the amount of bending is the same, and the dimensional change amount of the substrate 1 is formed larger. Therefore, the thickness of the substrate supporting member 11 is preferably 5 mm or more.

1 to 3 show an exposure apparatus according to an embodiment of the present invention. The exposure apparatus includes a substrate supporting member 11 for supporting the substrate 1, a mask supporting member 12 for supporting the mask 2, and a substrate supporting member 11 in such a manner that the substrate 2 can be uniformly contacted with the mask 2 a driving mechanism (not shown) that moves relative to the reticle support member 12, and a guiding mechanism (not shown) for guiding relative movement of the substrate supporting member 11 and the reticle supporting member 12 when the driving mechanism is actuated, and A light irradiation device (not shown) for irradiating the photosensitive layer of the substrate 1 with light through the mask 2.

A plurality of grooves are provided on the upper surface of the substrate supporting member 11 (here is only Display groove 38). At least one vacuum suction hole (here, only the vacuum suction hole 38a is shown) connected to the negative pressure source is provided at the bottom of the groove. These grooves and vacuum suction holes constitute a fixing support mechanism for fixing the substrate 1 to the main surface of the substrate supporting member 11. The substrate supporting member 11 can adsorb and hold the substrate 1 thereon by vacuum suction from the vacuum suction holes 38a and the like. Conventionally, only a vacuum suction hole is present on the surface of the substrate supporting member, and the groove is not provided (see FIG. 12). However, in the present invention, a groove associated with the vacuum suction hole is provided. Thereby, a larger area can be utilized to adsorb and hold the substrate. Therefore, the holding substrate can be fixed more reliably than in the related art, and the relative positional deviation between the substrate and the substrate supporting member can be prevented from occurring. The fixed support mechanism will be detailed later in accordance with Figure 10.

The substrate supporting member 11 is supported by the base member 14 via the pillars 13. The pillar 13 is connected to the center lower surface of the substrate supporting member 11 via a leaf spring (not shown) or the like, and does not prevent the substrate supporting member 11 from being bent.

The mask supporting member 12 is provided with an elastic element such as the frame 15 and the plate spring 16 , a spacer 17 connecting the frame 15 and the plate spring 16 , a biasing element such as the coil spring 18 , and a position regulating pin 19 . The platen spring 16 is a quantitative amount that allows the mask 2 to move toward and away from the substrate 1 when the mask 2 approaches and deviates from the substrate 1. The coil spring 18 and the position regulating pin 19 are positions that regulate the support surface of the reticle 2 to the reticle support member of the reticle support member 12.

The substrate supporting member 11 has a quadrangular shape as a whole, and has a first pair of side edge portions 20 opposed to each other and a second pair of side edge portions 21 opposed to each other. Each of the side edges 20 of the first pair is provided with a plurality of extending to the lower side Rod 22 . At the same time, a plurality of rods 23 extending to the lower side are provided along the side edges 21 of the second pair, respectively. Where the rod 22 is attached to the side edge portion 20 is a first point of action that forms a plurality of forces or moments for bending the substrate supporting member 11. At the same time, where the rod 23 is attached to the side edge portion 21, a second action point is formed which forms a plurality of forces or moments for bending the substrate supporting member 11.

The exposure apparatus includes a first deformation mechanism 24 for bending one pair of the substrate supporting members 11, and a pair of second deformation mechanisms 25. The first deformation mechanism 24 includes a plurality of actuators 26 that are placed on the base member 14, and a force transmission rod 27 that is attached to the distal end of the rod of the plurality of actuators 26, and is provided in plural along the rod 27. The force conveys the roller 28. Each of the rollers 28 is positioned to impart a pressing force to the lower end of the rod 22. The second deformation mechanism 25 is also configured to have the same structure, and has a plurality of actuators 29, a force transmission bar 30, and a force transmission roller 31.

The actuators 26, 29 can be those utilizing a motor. Alternatively, the actuators 26, 29 may also be pistons that utilize air pressure. Cylinder type.

When the actuator 26 of the first deforming mechanism 24 is actuated, the pressing force is applied to the lower end of the rod 22 via the force transmitting rod 27 and the force transmitting roller 28, and the side edge portion 20 of the first pair of the substrate supporting member 11 is applied. The installation of the rod 22, that is, the plurality of first points of application, applies a bending moment. By this bending moment, the substrate supporting member 11 is bent to extend around the first shaft 32 in the same direction as the side edge portion 20. In the same manner, when the actuator 29 of the second deforming mechanism 25 is actuated, the substrate supporting member 11 is bent to extend around the second shaft 33 in the same direction as the side edge portion 21.

The substrate 1 is bent together with the substrate supporting member 11. After the substrate 1 is bent, if the photomask 2 is moved so as to be in uniform contact with the substrate 1, the photomask 2 is bent in accordance with the substrate 1.

The pattern drawn on the surface of the reticle 2 facing the substrate 1 is slightly formed, and the substrate 1 is bent into a convex shape so that the reticle 2 can be bent in a manner that can be substantially reduced in size. It is preferable to perform exposure in a state in which the substrate 1 is bent.

Since the mask 2 is slowly curved from the center of the substrate 1 to the periphery, the possibility that air is trapped between the both sides becomes small.

Alternatively, after the substrate 1 and the photomask 2 are uniformly contacted, the substrate 1 and the substrate supporting member 11 are bent, and the photomask 2 is patterned, whereby both of them are bent.

In the present invention, the first deforming mechanism 24 and the second deforming mechanism 25 are individually operated, whereby the amount of bending around the first shaft 32 of the substrate supporting member 11 and the amount of bending around the second shaft 33 can be individually controlled. .

Further, by making the respective actuator amounts of the plurality of actuators 26 of the first deforming mechanism 24 different, the force acting on each of the rods 22 and even the magnitude of the moment acting on the plurality of first acting points can be controlled to Adjust to the amount quantified. In the second deformation mechanism 25, the same operation can be performed. Thereby, when the substrate supporting member 11 is bent, the amount of bending of the substrate supporting member 11 can be individually controlled at a plurality of positions along the first axis 32 or the second axis 33.

By using the force transmitting bars 27, 30, the number of actuators 26, 29 used can be less than the number of points of action of the moment. The number of points of action can be arbitrarily changed by the amount of the force-increasing force transmitting rollers 28, 31. If the force transmission bar for one is two actuators, it can be continuously changed along the axis 32. The amount of bending of the substrate supporting member 11 at the plural position of 33. Thus, the force transmitting bars 27, 30 can be simplified in construction and easy to control.

The advantages brought about by the individual control using the bending amount of the present invention will be described with reference to Figs. 4 to 6 .

4 to 6 show a state in which the substrate 1 and the photomask 2 are overlapped with each other.

A plurality of alignment marks 34, 35 (four in the illustrated example) are respectively provided at positions corresponding to the mask 2 and the substrate 1.

In the case of the registration substrate 1 and the photomask 2, the alignment marks 34, 35 are detected by a mark detecting means such as a CCD camera, and the pitch of the alignment marks 34, 35 is calculated based on the detected data. The amount of shift is controlled according to the result of this operation. The exposure apparatus of the present invention may be provided with a mark detecting means and an arithmetic means for this purpose.

4 is a schematic view showing a state in which alignment marks are used to match each other by a bending method of a conventional exposure method.

In the conventional bending method, since the substrate 1 is bent into a spherical shape, if the reticle 2 is patterned, the alignment mark 34 of the reticle 2 can only be in the vertical direction and the horizontal direction in the figure. The ratios are determined separately to vary the spacing.

Therefore, even if the alignment marks 34a to 34d of the mask 2 are aligned with the alignment marks 35a to 35d of the substrate 1, the positions of the alignment marks 34a' to 34d' can be practically obtained.

As a result, the alignment mark 34 of the photomask 2 cannot be made coincident with the alignment mark 35 of the substrate 1.

Figure 5 is a view showing one form of the exposure method by the present invention, even if The position of the bit mark is the case shown in FIG. 4, and the alignment mark 34 of the reticle 2 can be made coincident with the alignment mark 35 of the substrate 1.

In the present invention, a predetermined force f1, f2 (or moment) of equal magnitude to each other is applied to the side edges of the first pair by the first deforming mechanism, respectively, by the second deforming mechanism. The side edges of the pair are applied with forces f3, f4 (or moments) equal to each other but different from f1, f2, so that the amount of bending of the substrate supporting member around the lateral axis in the drawing and the circumference of the longitudinal axis can be individually controlled. The amount of bending of the substrate support member.

Accordingly, the amount of bending of the substrate 1 is also controlled in the same manner. Therefore, the change in the pitch of the alignment mark 34 of the mask 2 which is produced by the mask 2 in accordance with the substrate 1 is different in the lateral direction and the longitudinal direction in the drawing. the amount.

Therefore, as shown in FIG. 5, the alignment mark 34 of the reticle 2 can be aligned with the alignment mark 35 of the substrate 1 by selecting the predetermined force f1, f2 (or moment) and the force f3, f4 (or moment). .

FIG. 6 is a view for explaining that the alignment mark 34 of the photomask 2 can be aligned with the alignment mark 35 of the substrate 1 even when the substrate 1 is more complicatedly deformed.

In this case, in order to make the alignment mark 34 of the reticle 2 coincide with the alignment mark 35 of the substrate 1, it is necessary to change the pitch of the alignment mark 34 of the reticle 2 in the lateral direction and the longitudinal direction, respectively. The plural position becomes variable.

According to the present invention, the forces f1, f2, f3, f4 (or moments) acting on the respective side edge portions of the substrate supporting member can be adjusted to be able to be in the lateral direction along the figure by the first and second deforming mechanisms. The positions of the complex axes of the axis and the longitudinal axis respectively form a predetermined value, and thus can be individually controlled at the positions of the plural The amount of bending of the substrate supporting member.

Accordingly, the amount of bending of the substrate 1 supported by the substrate supporting member is also controlled in the same manner. Therefore, the amount of change in the pitch of the alignment mark 34 of the mask 2 generated by the mask 2 in accordance with the substrate 1 can be illustrated along the figure. The complex positions in the horizontal direction and the vertical direction in the middle form different values.

Therefore, as shown in FIG. 6, by applying the forces f1, f2, f3, and f4 (or moments) at predetermined positions at a plurality of positions, the alignment mark 34 of the reticle 2 can be aligned with the pair of the substrate 1. Bit mark 35.

7 and 8 show another embodiment of the exposure apparatus of the present invention. The point different from the embodiment shown in FIGS. 1 to 3 is that the driving device 36 as the first and second deforming mechanisms applies a force rather than a moment to each side edge portion of the substrate supporting member 11. The drive unit 36 is provided in plural along each of the side edge portions 20 and 21 of the substrate supporting member 11. The driving device 36 is placed on the base member 14, and the front end of the actuating lever 37 of the driving device 36 is connected to the lower surface of the side edge portions 20, 21 of the substrate supporting member 11 by a universal joint or the like.

Each of the driving devices 36 can be individually actuated, and a tensile force and a pressing force can be applied to a plurality of positions along the side edge portions 20, 21 of the substrate supporting member 11. Therefore, the alignment shown in FIGS. 5 and 6 can be performed in the exposure apparatus shown in FIGS. 7 and 8.

Fig. 10 is a view showing a specific configuration of a fixing support mechanism for fixing the substrate 1 on the main surface of the substrate supporting member 11 without causing a relative offset. The fixing support mechanism includes a plurality of grooves 38 formed on the upper surface of the substrate supporting member 11, that is, the surface of the support substrate 1. 39,40. It is also possible to replace the groove and set a peak (not shown). The grooves 38, 39, 40 or peaks are the tasks for holding the substrate 1 on the substrate supporting member 11.

The fixed support mechanism may include: the grooves 38, 39, 40, and the bottoms of the grooves 38, 39, 40 provided at the bottom, connected to at least one vacuum suction hole 38a, 39a, 40a of the negative pressure source. Composition. The respective vacuum suction holes 38a, 39a, 40a are connected to a source of negative pressure. FIG. 10B shows a configuration in which the vacuum suction hole 38a in the groove 38 is connected to the negative pressure source 41. The substrate 1 is adsorbed and fixed to the substrate supporting member 11 by a negative pressure from a negative pressure source.

As shown in Figure 10A, the grooves 38, 39, 40 can be formed to be isolated from each other. In this case, each negative pressure source can also be set for each groove. Alternatively, the two grooves 38 shown in FIG. 10A may be the grooves of the first group, the two grooves 39 may be the grooves of the second group, and the one groove 40 may be the groove of the third group. Set each negative pressure source according to each group. In either case, even if air leakage occurs in a part of the area, the negative pressure such that the substrate 1 can be sufficiently fixed and supported on the substrate supporting member 11 can be applied to the substrate 1.

The groove 42 is formed in the substrate supporting member 11 so as to surround the grooves 38, 39, and 40. The groove 42 is provided at a position on the outer circumference of the mating substrate 1. As shown in FIG. 10C, since the outer peripheral edge of the substrate 1 is located in the groove 42, the mechanical "hing" of the outer peripheral edge and the groove 42 is an aid for forming the holding substrate 1. Therefore, the groove 42 can also be included in the fixed support mechanism. Moreover, by the presence of the groove 42, when the substrate 1 is in close contact with the reticle 2, the outside of the substrate 1 The periphery can be hidden in the groove 42, so that the outer periphery of the substrate 1 can be prevented from being damaged or broken.

In Fig. 10C, although a groove having a quadrangular cross section is shown, as shown in Fig. 10D, the grooves 38, 39, 40, 42 may have a V-shaped cross section.

Further, in the modification of the exposure apparatus shown in FIGS. 1 to 3, the first deformation mechanism 24 and the second deformation mechanism 25 are disposed inside the rods 22, 23, and the lower ends of the rods 22, 23 are given. It is also within the scope of the invention to expose the stretching force to the side edge portions 20, 21 of the substrate supporting member 11.

In still another modification of the exposure apparatus shown in FIGS. 1 to 3, both the pressing force and the tensile force can be applied to the lower ends of the rods 22, 23, and the side edge portions 20, 21 of the substrate supporting member 11 can be selected. Exposure devices that impart positive and negative moments are also within the scope of the invention.

1‧‧‧Substrate

1a‧‧‧Exposure

2‧‧‧Photomask

2A‧‧‧Main face

2B, 2C, 2D‧‧‧ center line

3‧‧‧CCD camera

4‧‧‧Substrate support member

5‧‧‧Base member

6‧‧‧Actuator

7‧‧‧Connected components

8‧‧‧Light

9‧‧‧ Sealing members

10‧‧‧Vacuum suction hole

11‧‧‧Substrate support member

12‧‧‧Photomask support member

13‧‧‧ pillar

14‧‧‧Base member

15‧‧‧Frame

16‧‧‧ plate spring

17‧‧‧ spacers

18‧‧‧ coil spring

19‧‧‧Location regulation

20‧‧‧lateral edge

21‧‧‧ side

22‧‧‧ pole

23‧‧‧ rod

24‧‧‧First deformation agency

25‧‧‧Second deformation agency

26‧‧‧Actuator

27‧‧‧Power communication stick

28‧‧‧Power transmission wheel

29‧‧‧Actuator

30‧‧‧Power communication stick

31‧‧‧Power transmission wheel

32‧‧‧First axis

33‧‧‧second axis

34,35‧‧‧ mark

34a~34d‧‧‧ alignment mark

34a’~34d’‧‧‧ alignment mark

36‧‧‧ drive

37‧‧‧Action rod

38, 39, 40, 42‧ ‧ ditch

38a, 39a, 40a‧‧‧ vacuum suction holes

F1, f2, f3, f4‧‧‧ force

1 is a schematic side cross-sectional view showing an exposure apparatus according to an embodiment of the present invention, in a state before a substrate is deformed together with a substrate supporting member.

2 is a schematic side cross-sectional view showing an exposure apparatus according to an embodiment of the present invention, in a state in which the substrate is deformed together with the substrate supporting member.

Fig. 3 is a schematic cross-sectional view showing an exposure apparatus according to an embodiment of the present invention, and corresponds to the A-A arrow view of Fig. 1 .

4 is a view showing a positional relationship between the alignment marks provided on both the substrate and the mask when the conventional method is bent.

Figure 5 is a view showing the form of the method of the present invention, the substrate and the mask bend The positional relationship diagram of the alignment mark set on both sides of the song.

Fig. 6 is a view showing the positional relationship between the substrate and the alignment mark provided when the substrate and the mask are bent in another embodiment of the method of the present invention.

Fig. 7 is a schematic longitudinal cross-sectional view showing an exposure apparatus according to another embodiment of the present invention, in a state before the substrate is deformed together with the substrate supporting member.

Fig. 8 is a schematic cross-sectional view showing an exposure apparatus according to another embodiment of the present invention, and corresponds to the arrow B-B of Fig. 7.

Fig. 9 is a schematic view showing the principle of exposure of the present invention.

Fig. 10 is a view showing a fixing support mechanism of the substrate supporting member, A is a plan view, B is a cross-sectional view cut by a groove surface, C is a cross-sectional shape showing a groove of the fixing support mechanism, and D is a groove indicating The shape of the section.

FIG. 11 is a schematic plan view of a conventional exposure apparatus in a state in which a photomask and a mask supporting member are omitted.

FIG. 12 is a schematic side cross-sectional view showing a conventional exposure apparatus, and a state before the substrate is deformed.

FIG. 13 is a schematic side cross-sectional view showing a conventional exposure apparatus, and a state after the substrate is deformed.

FIG. 14 is a schematic side cross-sectional view showing a conventional exposure apparatus, in which a mask is deformed to perform an exposure operation.

Fig. 15 is a schematic view showing a principle of exposure by bending a substrate and a mask.

1‧‧‧Substrate

2‧‧‧Photomask

11‧‧‧Substrate support member

13‧‧‧ pillar

14‧‧‧Base member

22‧‧‧ pole

26‧‧‧Actuator

38‧‧‧ditch

38a‧‧‧Vacuum suction hole

Claims (18)

An exposure method is characterized in that a mask having a pattern is disposed at a position of a photosensitive layer covering a substrate on which a photosensitive layer is formed, and the reticle and the substrate are uniformly contacted with each other, and then the sensitization of the substrate is performed by the reticle. An exposure method in which the layer is irradiated with light to replicate the pattern on the substrate, and is characterized in that: the whole is a square shape, and has a side edge portion of the first pair facing each other and a second pair side opposite to each other a plate-shaped substrate supporting member having an edge portion, wherein the photosensitive layer is opposed to a surface on which the pattern is drawn on the mask, so that the substrate does not have a relative orientation on a main surface of the substrate supporting member Fixedly supporting, while individually controlling: a bending amount of the substrate supporting member centered on a first axis extending in the same direction as a side edge portion of the first pair, and extending to and from the second pair a bending amount of the substrate supporting member centering on a second axis in the same direction of the side edge portion, and bending the substrate supporting member, thereby causing the substrate supporting member and the substrate together Forming a desired curved shape, wherein the photomask and the substrate are in uniform contact with each other, and the substrate supporting member and the substrate are deformed into the desired curved shape, and the photosensitive layer is irradiated with light by the photomask. The size of the above pattern is substantially changed to be replicated on the substrate. The exposure method of claim 1, wherein the substrate supporting member is centered on the first axis or centered on the second axis When bending, the amount of bending of the substrate supporting member is individually controlled at a plurality of positions along the first and second axes, respectively. The exposure method of claim 1 or 2, wherein the bending of the substrate supporting member centered on the first axis is performed by applying a force or a moment to the side edges of the first pair, The bending centering on the second axis is performed by applying a force or a moment to the side edges of the second pair. The exposure method of claim 1 or 2, wherein a plurality of alignment marks are respectively disposed at positions corresponding to the masks and the substrates, and the alignment marks are detected by the mark detecting means, according to The detected data is used to calculate a shift amount of the pitch between the alignment mark of the photomask and the alignment mark of the substrate, and the amount of warpage of the substrate supporting member is controlled in accordance with the calculation result. The exposure method of claim 4, wherein the mark detecting means is a CCD camera. The exposure method according to claim 1 or 2, wherein the pattern is slightly formed on the mask, and the substrate supporting member and the substrate are bent together in a convex shape during exposure. The size of the surface of the substrate on which the photosensitive layer is formed is substantially enlarged to form a predetermined size, and the mask is patterned in accordance with the substrate, whereby the size of the pattern is substantially reduced to form a predetermined size, and then the above-mentioned pattern is formed. The pattern is reproduced on the above substrate. An exposure apparatus for: uniformly contacting a mask on which a pattern is drawn and a substrate on which a photosensitive layer is formed, and then passing through the mask An exposure apparatus for exposing the photosensitive layer of the substrate to light, thereby replicating the pattern on the substrate, and characterized in that the substrate supporting member is provided on a side opposite to a surface on which the photosensitive layer is formed. The substrate support member for supporting the substrate is entirely fixed to the substrate, and has a first pair of side edge portions facing each other and a second pair of side edge portions facing each other, and for preventing the substrate from being generated a fixed support mechanism fixedly supported by a relative offset; a reticle supporting member for supporting the reticle in such a manner that a surface of the reticle having the above-mentioned pattern can be opposite to the photosensitive layer; The substrate holder supporting member and the reticle supporting member are relatively moved relative to each other by the reticle capable of uniformly contacting the substrate; the plurality of first acting points are along the substrate supporting member Providing a side edge portion of the first pair; the first deformation mechanism is configured to cause a force or a moment to act on the first plurality of points of action, thereby supporting the substrate And the substrate is bent along a first axis extending in the same direction as the side edge portion of the first pair; the second plurality of points of action are along the side edges of the second pair of the substrate supporting member Providing a second deformation mechanism that applies a force or a moment to the second plurality of points of action, whereby the substrate supporting member and the substrate extend in the same direction as the side edges of the second pair The second axis is center-curved; and a guiding mechanism is configured to guide relative movement of the substrate supporting member and the reticle supporting member when the driving mechanism is actuated; and A light irradiation device for irradiating light to the photosensitive layer of the substrate by the photomask. The exposure apparatus of claim 7, wherein the first deformation mechanism can control a magnitude of a force or a moment acting on the plurality of first action points to a predetermined amount, and the second deformation mechanism can The magnitude of the force or moment acting on the second point of action of the plural is controlled to a predetermined amount, respectively. The exposure apparatus of claim 7 or 8, wherein the first deformation mechanism or the second deformation mechanism includes a motor. The exposure apparatus of claim 7 or 8, wherein the first deformation mechanism or the second deformation mechanism has a mechanism driven by air pressure. The exposure apparatus of claim 7 or 8, further comprising: a mark detecting means for detecting a plurality of alignment marks respectively disposed at positions corresponding to the masks and the substrates; And a method for calculating a shift amount of a pitch between the alignment mark of the photomask and the alignment mark of the substrate based on data detected by the mark detecting means, the first deformation mechanism and At least one of the second deformation means adjusts a force or a moment acting on at least one of the first action point and the second action point in accordance with a calculation result of the calculation means, thereby enabling control of the substrate support The amount of bending of the member. Such as the exposure apparatus of claim 7 or 8, wherein The reticle support member has a structure that allows the reticle to move in a direction in which the reticle is moved toward and away from the substrate. The exposure apparatus of claim 7 or 8, wherein the reticle support member has a position regulating mechanism for regulating a position in a support surface of the reticle support member of the reticle. The exposure apparatus according to claim 7 or 8, wherein the fixing support mechanism includes a plurality of grooves or peaks formed on a surface of the substrate supporting member that is fixed to support the substrate. The exposure apparatus according to claim 7 or 8, wherein the fixing support mechanism includes: a plurality of grooves formed on a surface of the substrate supporting member fixedly supporting the substrate; and a bottom portion provided on the bottom of the groove, connected to At least one vacuum suction hole of the negative pressure source. The exposure apparatus of claim 15, wherein the at least one vacuum suction hole provided at the bottom of the plurality of grooves is connected to each of the grooves or a group of negative pressure sources each including a plurality of grooves . The exposure apparatus of claim 7 or 8, wherein the substrate supporting member has a thickness of 5 mm or more. The exposure apparatus of claim 7 or 8, wherein the first deformation mechanism and the second deformation mechanism are placed on a base member for supporting the substrate supporting member.