TWI272457B - Full-contact type exposure device - Google Patents

Full-contact type exposure device Download PDF

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Publication number
TWI272457B
TWI272457B TW092114666A TW92114666A TWI272457B TW I272457 B TWI272457 B TW I272457B TW 092114666 A TW092114666 A TW 092114666A TW 92114666 A TW92114666 A TW 92114666A TW I272457 B TWI272457 B TW I272457B
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TW
Taiwan
Prior art keywords
mask
exposed
close
contact
type exposure
Prior art date
Application number
TW092114666A
Other languages
Chinese (zh)
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TW200400423A (en
Inventor
Tsunesou Tajima
Momii Isao
Original Assignee
Adtec Eng Co Ltd
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Publication date
Application filed by Adtec Eng Co Ltd filed Critical Adtec Eng Co Ltd
Publication of TW200400423A publication Critical patent/TW200400423A/en
Application granted granted Critical
Publication of TWI272457B publication Critical patent/TWI272457B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control

Abstract

The invention provides a full-contact type exposure device that allows high adherence of a photo mask with a board. Upon completion of prescribed processing such as positioning, a controller 99 controls a moving mechanism 21 to move a platen 20 upward, thereby moving the photo mask 1 and a board 2 closer, and to stop at a position where a sealed space is formed between the two. At the same time a controller 99 starts vacuuming by controlling a vacuum pump 51. By this vacuum the pressure in the space between the photo mask 1 and board 2 becomes negative, and the photo mask 1 bends downward with its center area sagging and contacting the board 2. The controller 99 controls a cam drive mechanism 31 to rotate cams 30 while vacuuming, allowing the photo mask 1 to gradually make contact with the board 2 from the center area to its periphery while pushing out the air gradually from the center to the periphery, thereby completing full contact with the board 2.

Description

1272457 五、發明說明（1) 【發：：屬之技術領域】 【先1T關於密接型曝光裝置。 L无刖技術】 通來已知利用 光阻劑等之感光二光裝置將預定圖案感光燒印在塗布有 板上形成圖·案的^的基板表面，然後藉由蝕刻步驟在基 也在印刷電路基板：=二用二2應用在各種領域中， 此曝光裝置在曝生一吊利用曝先裝置。 基板的密接性提高/為了使描繪有圖案原畫的光罩與 態而使其密接的真空用一種將兩者之間抽成真空狀 置稱為密接型曝光裝。 /，亚將利用此方法的曝光裝 【發明内容】 ° (發明所欲解決之課題） 然而，密接型曝 勻地密接，以致微量ft有不易使光罩與基板完全均 一旦在光罩與基板之二殘，在基板中央部的問題。 與基板的完全密接，而暖=空氣殘留，即無法獲得光罩 射在基板上，因此解析^合二線在通過光罩後會擴散而照 因此，過去曾開發;二^ i而使曝光精度降低。 罩撓曲而使其密接於攸〃罩背後施加壓力，藉此使光 時’儘管中央部的密：：：：法等。但是，使用此方法、 缺點。 鈇局，卻有周邊部之密接性差的 另外，雖然也曾有_ 罩以提高周邊部之密 案，藉由相對於基板加大光 、技術’但卻有光罩之大型化所1272457 V. INSTRUCTIONS (1) [Fa:: Technical field of genus] [First 1T on the contact type exposure device. L-free technology] It is known that a predetermined pattern is photosensitively printed on a surface of a substrate coated with a pattern by a photosensitive two-light device such as a photoresist, and then printed on the substrate by an etching step. The circuit substrate: = two uses two 2 is used in various fields, and the exposure device utilizes an exposure device in an exposure and a suspension. The adhesion of the substrate is improved. In order to make the vacuum in which the mask of the original pattern is drawn, the vacuum is used to form a vacuum. /, Ya will use this method of exposure installation [invention content] ° (the problem to be solved by the invention) However, the close-contact type is closely adhered, so that the micro ft is difficult to make the reticle and the substrate completely once in the reticle and the substrate The second is the problem at the center of the substrate. Completely close to the substrate, and warm = air residual, that is, the reticle cannot be obtained on the substrate, so the analysis and the second line will diffuse after passing through the reticle, so that it has been developed in the past; reduce. The cover is flexed so that it is intimately attached to the back of the hood to apply pressure, thereby making the light light, although the central portion is dense:::: or the like. However, use this method, disadvantages. In addition, there is a difference in the adhesion between the peripheral parts. In addition, there is a hood to increase the density of the peripheral parts, and the light and technology are increased relative to the substrate, but there is a large size of the mask.

314695. ptd 第6頁 1272457 五、發明說明（3) 第1圖表示用來製造印刷配線基板的密接型曝光裝 置，曝光對象物之塗布有光阻劑的基板2是載置於平台2 0 上，而可藉由移動機構21朝ΧΥΖΛ 0方向移動。 描繪有電路圖案的光罩1是在基板2上方由光罩支持裝 置1 0支持而與基板2相對向，使基板2接近光罩i，並吸引 光罩1與基板2之間而使其密接，並利用來自曝光光源9 〇的 曝光將光罩1的電路圖案燒印在基板2上。 光罩1在此實施形態是玻璃光罩，且直接描繪有電路 圖案或貼有描繪電路圖案的薄膜光罩。 此外’ CCD相機9丨是用來進行光罩1與基板2的位置對 準。 而控制裝置9 9係用以控制整個裝置。 此外亦可作成使光罩支持裝置1 0移動而非使平台2 〇 移動的架：，或是使兩者移動的架構。 非使十口 在平台20上用來载置基板2之部分的周圍安裝有密封 密Λ件4是由概塾40所形成，且是將此襯藝40配置 二土，2的狀恶，以密封光罩i與基板2之間的空間。 引f ΐ 封的空間是由具有吸引路徑51及吸引泵51的吸 Ν裒置5吸引而構成。 的空=:徑Γ是形成於平台20，並朝向由襯墊40所密封 幵 並與吸引泵5 1連通而可吸引該空間。 置3抵在接基Λϋ卜側周®又設有複數個保持m保持裝 者保持在来置以5周整光罩1與基板2的位置，且可將兩 、、 一基板2部分接觸的第1位置，然後使光罩工314695. ptd Page 6 1272457 V. Description of the Invention (3) Fig. 1 shows a close-contact type exposure apparatus for manufacturing a printed wiring board, and the substrate 2 coated with the photoresist on the exposure target is placed on the stage 20 It can be moved in the direction of ΧΥΖΛ 0 by the moving mechanism 21. The photomask 1 on which the circuit pattern is drawn is supported by the reticle support device 10 above the substrate 2 so as to face the substrate 2, and the substrate 2 is brought close to the reticle i, and is attracted between the reticle 1 and the substrate 2 to be adhered thereto. And the circuit pattern of the reticle 1 is burned on the substrate 2 by exposure from the exposure light source 9 。. In this embodiment, the mask 1 is a glass mask, and a circuit pattern or a film mask to which a circuit pattern is drawn is directly drawn. Further, the CCD camera 9 is used to align the position of the mask 1 and the substrate 2. The control device 9 is used to control the entire device. In addition, it is also possible to make a frame that moves the reticle support device 10 instead of moving the platform 2 :: or an architecture that moves both. The seal member 4 is not attached to the periphery of the portion of the platform 20 on which the substrate 2 is placed. The seal member 4 is formed by the outline 40, and the lining 40 is disposed of two soils, 2 The space between the reticle i and the substrate 2 is sealed. The space enclosed by the suction pump is constituted by the suction device 5 having the suction path 51 and the suction pump 51. The void =: the bore is formed on the platform 20 and is sealed toward the pad 40 and communicates with the suction pump 51 to attract the space. 3 is placed on the side of the substrate, and a plurality of holdings are held to hold the holder for 5 weeks to position the entire mask 1 and the substrate 2, and the two substrates can be partially contacted. 1st position, then make the reticle

第8頁 1272457 五、發明說明（4) 與基板2位於光罩1與基板2全面接觸的第2位置。 第2圖表示保持裝置3的詳細構造。 保持裝置3是由凸輪3 0及凸輪驅動機構3 1所構成，且 可藉由凸輪3 0的轉動，使光罩1位於第1位置及第2位置。 凸輪驅動機構3 1係由控制裝置9 9所控制，而可使凸輪3 0在 第2圖所示的第1位置及第3圖所示的第2位置轉動。 第2圖是光罩1的中央部接觸於基板2的狀態，凸輪3 0 是以此狀態支持著光罩1。 此時，光罩1與基板2之間是由襯墊4 0所密封，並形成 一密閉空間。 以下說明其動作。 結束位置對準等之預定處理後，由控制裝置9 9控制移 動機構2 1，使平台2 0朝上方移動，藉此使光罩1與基板2接 近，並停在兩者密接的位置。 此狀態為第2圖的狀態，此時，保持裝置3是設定在第 1位置，也就是將凸輪3 0設定在上方的位置。 停止移動機構2 1的移動之後，由控制裝置9 9控制吸引 泵5 1而開始吸引。藉由此吸引，光罩1與基板2之間的空間 即形成負壓狀態，而光罩1乃朝下‘方撓曲而使中央部鼓 出，並使此中央部接觸於基板2。 控制裝置9 9同時控制凸輪驅動機構3 1，並在吸引的同 時使凸輪3 0轉動而逐漸變成第3圖所示的位置。 從第2圖逐漸變成第3圖的過程中，光罩1係從中央部 到周邊部逐漸與基板2接觸，並在此過程中從中央部朝向Page 8 1272457 V. DESCRIPTION OF THE INVENTION (4) The substrate 2 is located at the second position where the photomask 1 and the substrate 2 are in full contact. Fig. 2 shows the detailed structure of the holding device 3. The holding device 3 is composed of a cam 30 and a cam driving mechanism 31, and the shutter 1 can be positioned at the first position and the second position by the rotation of the cam 30. The cam drive mechanism 31 is controlled by the control unit 909, and the cam 30 can be rotated in the first position shown in Fig. 2 and the second position shown in Fig. 3. Fig. 2 is a view showing a state in which the central portion of the mask 1 is in contact with the substrate 2, and the cam 30 supports the mask 1 in this state. At this time, the reticle 1 and the substrate 2 are sealed by the gasket 40, and a sealed space is formed. The operation will be described below. After the predetermined processing such as the alignment of the position is finished, the control unit 197 controls the moving mechanism 2 to move the stage 20 upward, whereby the mask 1 and the substrate 2 are brought close to each other and stopped at the positions where they are in close contact with each other. This state is the state of Fig. 2, and at this time, the holding device 3 is set at the first position, that is, the cam 30 is set at the upper position. After the movement of the moving mechanism 21 is stopped, the suction pump 51 is controlled by the control unit 9 to start the suction. By this attraction, the space between the photomask 1 and the substrate 2 is in a negative pressure state, and the photomask 1 is bent downward toward the lower side to bulge the central portion, and the central portion is brought into contact with the substrate 2. The control unit 902 simultaneously controls the cam driving mechanism 31, and simultaneously rotates the cam 30 to become the position shown in Fig. 3 while being sucked. In the process of gradually changing from Fig. 2 to Fig. 3, the photomask 1 gradually comes into contact with the substrate 2 from the central portion to the peripheral portion, and is oriented from the central portion in the process.

314695. ptd 第9頁 1272457 五、發明說明（5) 周邊部慢慢擠出空氣，同時密接於基板2。因此，空氣不 會殘留在光罩1與基板2之間。當凸輪3 0結束轉動時，光罩 1即完全密接於基板2。 當光罩1與基板2密接之後，從曝光光源9 0照射曝光光 線，藉此將光罩1的電路圖案燒在基板2上，然後結束曝光 並進入下一個步驟。 如以上所述，光罩1與基板2並非藉由移動機構2 1的移 動而以原狀直接密接，而是藉由保持裝置3保持在只有光 罩1的中央部接觸於基板2的狀態，而由此狀態利用吸引裝 置5吸引光罩1與基板2之間的空間，同時轉動凸輪3 0而使 密接位置從中央廣及周邊，因此可排除光罩1與基板2之間 的空氣，同時進行密接。因此空氣不會殘留在光罩1與基 板2之間，而可獲得良好的密接，並提高曝光精度。 第4圖表示其他實施形態。此實施形態中，保持裝置 3 ’是由滾珠螺絲桿3 6及脈衝馬達3 7所構成，且是藉由使脈 衝馬達3 7轉動，將光罩1保持在第1位置及第2位置。 在此架構的情形下，具有可藉由脈衝馬達3 7的轉動量 來簡單進行第1位置及第2位置之位置調整的優點。 第5圖是使襯墊4 0 ’具有保持裝置3之功能的實施形 態。襯墊4 0 ’是如圖所示具有内部中空的構造，且設有與 此内部空間連通的吸引路徑5 0 ’及吸引泵5 Γ。利用此吸引 泵5 Γ控制襯墊4 0 ’之内部空間的壓力，使襯墊4 0 ’鼓出或 縮小，藉此將光罩1保持在第1位置及第2位置。 如以上所說明，根據本發明的密接型曝光裝置，由於314695. ptd Page 9 1272457 V. INSTRUCTIONS (5) The peripheral portion slowly squeezes out air while being in close contact with the substrate 2. Therefore, air does not remain between the reticle 1 and the substrate 2. When the cam 30 ends the rotation, the photomask 1 is completely adhered to the substrate 2. After the photomask 1 is in close contact with the substrate 2, the exposure light is irradiated from the exposure light source 90, whereby the circuit pattern of the photomask 1 is burned on the substrate 2, and then the exposure is ended and the next step is performed. As described above, the photomask 1 and the substrate 2 are not directly adhered to each other by the movement of the moving mechanism 21, but are held by the holding device 3 in a state where only the central portion of the photomask 1 is in contact with the substrate 2, and In this state, the space between the reticle 1 and the substrate 2 is sucked by the suction device 5, and the cam 30 is rotated to make the adhesion position wide and the periphery from the center, so that the air between the reticle 1 and the substrate 2 can be eliminated while performing the same. Close contact. Therefore, air does not remain between the reticle 1 and the substrate 2, and good adhesion can be obtained, and the exposure accuracy can be improved. Fig. 4 shows another embodiment. In this embodiment, the holding device 3' is constituted by the ball screw lever 36 and the pulse motor 37, and the diaphragm 1 is held at the first position and the second position by rotating the pulse motor 37. In the case of this configuration, there is an advantage that the positional adjustment of the first position and the second position can be easily performed by the amount of rotation of the pulse motor 37. Fig. 5 is an embodiment in which the spacer 40' has the function of the holding device 3. The spacer 40' has a hollow interior structure as shown in the drawing, and is provided with a suction path 50' and a suction pump 5'' that communicate with the internal space. The suction pump 5 is used to control the pressure in the internal space of the gasket 40' to swell or reduce the gasket 40', thereby holding the mask 1 in the first position and the second position. As explained above, the close contact type exposure apparatus according to the present invention

314695.ptd 第10頁 1272457314695.ptd Page 10 1272457

314695.ptd 第11頁 1272457314695.ptd Page 11 1272457

圖式簡單說明 【圖 式 簡單說明】 第 1圖是本 發 明 一 實 施 形 態的概 略 圖 0 第 2圖是本 發 明 一 實 施 形 態之動 作 的 說 明 圖 第 3圖是本 發 明 - 實 施 形 態之動 作 的 說 明 圖 第 4圖是本 發 明 其 他 實 施 形態的 部 分 放 大 圖 第 5圖是本 發 明 又 其 他 實 施形態 的 部 分 放 大 1 光 罩 2 基 板 3 保 持裝置 4 密 封 件 5 吸 引裝置 10 光 罩 支 持 裝 置 20 平 台 21 移 動 機 構 30 凸 輪 31 凸 輪 驅 動 機 構 35 阻 擋件 36 滾 珠 螺 絲 桿 37 脈 衝馬達 50 吸 引 路 徑 51 吸 引泵 90 曝 光 光 源 91 CCD相機 99 控 制 裝 置 314695. ptd 第12頁BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an embodiment of the present invention. FIG. 2 is an explanatory view showing an operation of an embodiment of the present invention. FIG. 3 is a view showing an operation of the present invention - an embodiment. Figure 4 is a partially enlarged view of another embodiment of the present invention. Fig. 5 is a partial enlarged view of another embodiment of the present invention. 1 Photomask 2 Substrate 3 Holding device 4 Sealing member 5 Suction device 10 Photomask support device 20 Platform 21 Movement Mechanism 30 Cam 31 Cam drive mechanism 35 Stopper 36 Ball screw lever 37 Pulse motor 50 Suction path 51 Suction pump 90 Exposure light source 91 CCD camera 99 Control device 314695. ptd Page 12

Claims (1)

12724571272457 日 ι —種密接型曝光裝置，其特徵 描繪有要曝光的圖案， 受曝光的光罩； ” 使前述光罩與曝光對象物 機構； :修正 為具有： 且接觸於曝光對象物而接 才目對接近成可密接狀態的 將光罩保持在前述光罩盘 1位置、s ϋ e s 罩與曝光對象物部分接觸的第 保持機構； 、+九對象物完全接觸的第2位置的 用以密封前述光罩與被曝杏 及 早/、散曝先對象物之間的機構；以 2 ·如申請專 前述 3 ·如申請專 前述 4 ·如申請專 前述 封光罩與 而前 吸引光罩 5 ·如申請專 前述 而前 弟1位置， 吸引前述光罩與被曝# & 利r PI # 1 s 先對象物之間的機構。 利耗圍弟1項之密接型曝光裝置，其 第1位置為可變。 利範圍第1項之密接型曝光裝置，其 第2位置為可變。 =範圍第1項之密接型曝光裝置，其中， 岔封的機構是至少從第ΙΑ $ 瞧#斟Γ Γ ί 到第2位置之間密 曝光對象物之間， 述吸引的機構是至少從第1位置到 與曝光對象物之間。 …位置之間 利範圍第1項之密接型曝光裝置，其中， 保持機構具有可轉動的凸輪， ’ 述凸輪是以預定的轉動位置將光 以其他預定的轉動位置將光草伴’、、在則述 1示待在前述第2Day ι - a close-contact type exposure device characterized in that a pattern to be exposed is exposed, and a mask to be exposed; "the mask and the object to be exposed are: corrected to have: and contact with the object to be exposed a first holding mechanism that holds the photomask in a position close to the photomask disk 1 in a close-contact state, and the s ϋ es cover is in contact with the exposure target portion; and a second position in which the + nine objects are completely in contact with each other for sealing the aforementioned The mechanism between the mask and the exposed apricot early/disiled object; 2) If the application is specific to the above 3 · If the application is specifically for the aforementioned 4 · If applying for the aforementioned cover hood and the front suction mask 5 The first position of the former and the younger brother, attracting the above-mentioned mask and the mechanism between the first object and the exposed object. The first position of the close-contact type exposure device is variable. The second position of the close-contact type exposure apparatus of the first aspect is variable. The range of the first type of the close-contact type exposure apparatus, wherein the mechanism of the seal is at least from the first 瞧 $ 瞧 #斟Γ Γ ί Secret between the second position The mechanism for attracting between the light objects is a close-contact type exposure apparatus of the first item between the first position and the object to be exposed. The holding mechanism has a rotatable cam, ' The cam is to light the light with other predetermined rotational positions at a predetermined rotational position, and is shown in the aforementioned second 12724571272457 修正 --MM 92114666 /、、申请專利範圍 位置。 申；=利靶圍第1項之密接型曝光裝置，其中， 旋轉=2保持機構具有滾珠螺絲桿以及使該滾珠螺絲桿 動裝置，並藉由該滾珠螺絲桿 ，將光罩 保待在則述第1位置及前述第2位置 7.如申：土利範圍第6項之密接型曝光裝置，其中， 8·-種絲桿旋轉的驅動裝置為脈衝馬達。 檀在接型曝光裝置，其特徵為1有. 受曝；ΠΠ光的圖案，並且接觸於曝光對象物而接 機構使前述光罩與曝光對象物相對接近成可密接狀態的 將光罩保持在前述光罩盥暖 1位置、及前述光罩盥曝光餅W先對象物y刀接觸的第 並用以密封前述光罩盥%皮戚光完全接觸的第2位置， 用以吸引前述：罩；間的機構；以及 .如申以範圍第8項之密接型曝光裝置:中機構。 則述密封的機構具有： /、r 士身具有中空之内部的襯墊；以及 藉由調整該襯墊之内部壓力 壓力裝置， 而使該襯墊放大縮小的 而藉由放大縮小該襯墊，將 置及第2位置。 先罩保持在前述第1位 314695(修正本）.ptc 第14頁Amendment --MM 92114666 /,, the scope of the patent application. The invention relates to a close-contact type exposure apparatus of the first item, wherein the rotation=2 holding mechanism has a ball screw rod and the ball screw rod moving device The first position and the second position are as follows: 7. The contact type exposure apparatus of the sixth aspect of the invention, wherein the driving device for rotating the seed screw is a pulse motor. The tantalum-type exposure apparatus is characterized in that: the exposed mask; the pattern of the light, and the contact with the object to be exposed, the mechanism is such that the mask and the object to be exposed are relatively close to each other in a slidable state. The first position of the mask is warmed up, and the second mask of the mask 盥 exposure cake W is first contacted with the object y knife to seal the second position of the reticle 完全 戚 , , , , , , , , , , 完全 完全 完全 完全 完全 完全 完全And the same as the scope of the scope of the exposure device: the medium mechanism. The sealing mechanism has: /, the r body has a hollow inner liner; and the inner pressure and pressure device of the gasket is adjusted to enlarge and shrink the gasket by zooming in and out, The second position will be placed. The hood is held at the first position 314695 (Revised). ptc Page 14
TW092114666A 2002-06-21 2003-05-30 Full-contact type exposure device TWI272457B (en)

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TW200400423A (en) 2004-01-01
EP1376235A3 (en) 2008-11-26

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