TWI429018B - 用於微影裝置的剪切層夾盤 - Google Patents
用於微影裝置的剪切層夾盤 Download PDFInfo
- Publication number
- TWI429018B TWI429018B TW098111528A TW98111528A TWI429018B TW I429018 B TWI429018 B TW I429018B TW 098111528 A TW098111528 A TW 098111528A TW 98111528 A TW98111528 A TW 98111528A TW I429018 B TWI429018 B TW I429018B
- Authority
- TW
- Taiwan
- Prior art keywords
- chuck
- platform
- array
- stress
- elongated elements
- Prior art date
Links
- 230000005855 radiation Effects 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 54
- 238000001459 lithography Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 230000001133 acceleration Effects 0.000 claims description 14
- 238000012546 transfer Methods 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000003550 marker Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 description 36
- 230000035882 stress Effects 0.000 description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 230000033001 locomotion Effects 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000006094 Zerodur Substances 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 206010028980 Neoplasm Diseases 0.000 description 2
- -1 but not limited to Substances 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- RHDUVDHGVHBHCL-UHFFFAOYSA-N niobium tantalum Chemical compound [Nb].[Ta] RHDUVDHGVHBHCL-UHFFFAOYSA-N 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/34—Accessory or component
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7105908P | 2008-04-10 | 2008-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201001613A TW201001613A (en) | 2010-01-01 |
| TWI429018B true TWI429018B (zh) | 2014-03-01 |
Family
ID=40752516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098111528A TWI429018B (zh) | 2008-04-10 | 2009-04-07 | 用於微影裝置的剪切層夾盤 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US20110013164A1 (enExample) |
| JP (1) | JP5372136B2 (enExample) |
| KR (1) | KR101602367B1 (enExample) |
| CN (1) | CN101990652B (enExample) |
| NL (1) | NL1036735A1 (enExample) |
| TW (1) | TWI429018B (enExample) |
| WO (1) | WO2009124732A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1036735A1 (nl) | 2008-04-10 | 2009-10-13 | Asml Holding Nv | Shear-layer chuck for lithographic apparatus. |
| WO2012110144A1 (en) * | 2011-02-18 | 2012-08-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method. |
| JP5911959B2 (ja) * | 2011-09-09 | 2016-04-27 | マッパー・リソグラフィー・アイピー・ビー．ブイ． | ウェーハテーブル用支持構造体 |
| KR20170016547A (ko) | 2015-08-03 | 2017-02-14 | 삼성전자주식회사 | 척 테이블 및 그를 포함하는 기판 제조 장치 |
| US11040705B2 (en) | 2016-05-19 | 2021-06-22 | Pylon Manufacturing Corp. | Windshield wiper connector |
| US10761435B2 (en) | 2017-02-10 | 2020-09-01 | Asml Holding N.V. | Reticle clamping device |
| JP7408683B2 (ja) * | 2019-04-30 | 2024-01-05 | エーエスエムエル ネザーランズ ビー．ブイ． | 構造体に耐摩耗材料を提供するための方法、及び複合体 |
| US11650512B2 (en) * | 2021-06-25 | 2023-05-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle cleaning device and method of use |
| WO2025242380A1 (en) * | 2024-05-20 | 2025-11-27 | Asml Netherlands B.V. | Split chuck |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6335989U (enExample) * | 1986-08-25 | 1988-03-08 | ||
| US5401973A (en) | 1992-12-04 | 1995-03-28 | Atomic Energy Of Canada Limited | Industrial material processing electron linear accelerator |
| KR100443277B1 (ko) * | 2000-02-07 | 2004-08-04 | 티디케이가부시기가이샤 | 복합기판, 이를 사용한 박막발광소자 및 그 제조방법 |
| JP2003007602A (ja) * | 2001-06-26 | 2003-01-10 | Nikon Corp | 計測装置及び計測方法、露光装置及び露光方法 |
| JP2002050560A (ja) | 2000-08-02 | 2002-02-15 | Nikon Corp | ステージ装置、計測装置及び計測方法、露光装置及び露光方法 |
| JP2002134599A (ja) * | 2000-10-24 | 2002-05-10 | Ngk Insulators Ltd | 静電吸着装置 |
| US6513796B2 (en) * | 2001-02-23 | 2003-02-04 | International Business Machines Corporation | Wafer chuck having a removable insert |
| JP2002299228A (ja) | 2001-04-03 | 2002-10-11 | Nikon Corp | レチクル、それを用いた露光装置及び露光方法 |
| JP4103385B2 (ja) * | 2001-12-27 | 2008-06-18 | 住友金属工業株式会社 | 真空チャック |
| JP2003332411A (ja) * | 2002-05-17 | 2003-11-21 | Nikon Corp | 基板保持装置及び露光装置 |
| TWI254841B (en) * | 2002-12-23 | 2006-05-11 | Asml Netherlands Bv | Lithographic apparatus |
| EP1434100A2 (en) * | 2002-12-23 | 2004-06-30 | ASML Netherlands B.V. | Lithographic apparatus |
| EP1576637A2 (en) | 2002-12-27 | 2005-09-21 | Matsushita Electric Works, Ltd. | Field emission-type electron source and method of producing the same |
| JP4315420B2 (ja) * | 2003-04-18 | 2009-08-19 | キヤノン株式会社 | 露光装置及び露光方法 |
| JP2005039155A (ja) * | 2003-07-18 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及びそれに用いる半導体基板の製造方法 |
| US7119884B2 (en) * | 2003-12-24 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7786607B2 (en) | 2004-02-19 | 2010-08-31 | Asml Holding N.V. | Overlay correction by reducing wafer slipping after alignment |
| US7824498B2 (en) * | 2004-02-24 | 2010-11-02 | Applied Materials, Inc. | Coating for reducing contamination of substrates during processing |
| JP4298547B2 (ja) * | 2004-03-01 | 2009-07-22 | キヤノン株式会社 | 位置決め装置およびそれを用いた露光装置 |
| KR101585310B1 (ko) * | 2004-12-15 | 2016-01-14 | 가부시키가이샤 니콘 | 기판 유지 장치, 노광 장치 및 디바이스 제조방법 |
| JP4708876B2 (ja) * | 2005-06-21 | 2011-06-22 | キヤノン株式会社 | 液浸露光装置 |
| US7372549B2 (en) | 2005-06-24 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7564536B2 (en) * | 2005-11-08 | 2009-07-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7733463B2 (en) | 2006-05-05 | 2010-06-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20070268476A1 (en) | 2006-05-19 | 2007-11-22 | Nikon Corporation | Kinematic chucks for reticles and other planar bodies |
| WO2007136123A1 (en) * | 2006-05-19 | 2007-11-29 | Nikon Corporation | Chucks for reticles and other planar bodies |
| US7722256B2 (en) * | 2006-11-17 | 2010-05-25 | Corning Incorporated | Flat surface air bearing assembly |
| NL1036735A1 (nl) | 2008-04-10 | 2009-10-13 | Asml Holding Nv | Shear-layer chuck for lithographic apparatus. |
-
2009
- 2009-03-19 NL NL1036735A patent/NL1036735A1/nl active Search and Examination
- 2009-04-07 JP JP2011503375A patent/JP5372136B2/ja active Active
- 2009-04-07 CN CN200980112655.5A patent/CN101990652B/zh active Active
- 2009-04-07 US US12/921,556 patent/US20110013164A1/en not_active Abandoned
- 2009-04-07 WO PCT/EP2009/002577 patent/WO2009124732A1/en not_active Ceased
- 2009-04-07 TW TW098111528A patent/TWI429018B/zh active
- 2009-04-07 KR KR1020107025177A patent/KR101602367B1/ko active Active
-
2013
- 2013-07-10 US US13/938,746 patent/US8786832B2/en active Active
-
2014
- 2014-04-23 US US14/259,723 patent/US8976336B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| NL1036735A1 (nl) | 2009-10-13 |
| CN101990652B (zh) | 2012-10-10 |
| WO2009124732A1 (en) | 2009-10-15 |
| JP2011520245A (ja) | 2011-07-14 |
| US8976336B2 (en) | 2015-03-10 |
| CN101990652A (zh) | 2011-03-23 |
| US20110013164A1 (en) | 2011-01-20 |
| TW201001613A (en) | 2010-01-01 |
| US8786832B2 (en) | 2014-07-22 |
| KR101602367B1 (ko) | 2016-03-11 |
| US20140016110A1 (en) | 2014-01-16 |
| KR20100133473A (ko) | 2010-12-21 |
| US20140233009A1 (en) | 2014-08-21 |
| JP5372136B2 (ja) | 2013-12-18 |
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