KR101602367B1 - 리소그래피 장치용 전단-층 척 - Google Patents

리소그래피 장치용 전단-층 척 Download PDF

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Publication number
KR101602367B1
KR101602367B1 KR1020107025177A KR20107025177A KR101602367B1 KR 101602367 B1 KR101602367 B1 KR 101602367B1 KR 1020107025177 A KR1020107025177 A KR 1020107025177A KR 20107025177 A KR20107025177 A KR 20107025177A KR 101602367 B1 KR101602367 B1 KR 101602367B1
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South Korea
Prior art keywords
chuck
stage
delete delete
stress
array
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KR1020107025177A
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Korean (ko)
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KR20100133473A (ko
Inventor
사미르 에이. 나이페흐
마크 에드 윌리엄스
저스틴 매튜 베르디람
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에이에스엠엘 홀딩 엔.브이.
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/34—Accessory or component

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020107025177A 2008-04-10 2009-04-07 리소그래피 장치용 전단-층 척 Active KR101602367B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US7105908P 2008-04-10 2008-04-10
US61/071,059 2008-04-10

Publications (2)

Publication Number Publication Date
KR20100133473A KR20100133473A (ko) 2010-12-21
KR101602367B1 true KR101602367B1 (ko) 2016-03-11

Family

ID=40752516

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025177A Active KR101602367B1 (ko) 2008-04-10 2009-04-07 리소그래피 장치용 전단-층 척

Country Status (7)

Country Link
US (3) US20110013164A1 (enExample)
JP (1) JP5372136B2 (enExample)
KR (1) KR101602367B1 (enExample)
CN (1) CN101990652B (enExample)
NL (1) NL1036735A1 (enExample)
TW (1) TWI429018B (enExample)
WO (1) WO2009124732A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.
WO2012110144A1 (en) * 2011-02-18 2012-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method.
JP5911959B2 (ja) * 2011-09-09 2016-04-27 マッパー・リソグラフィー・アイピー・ビー．ブイ． ウェーハテーブル用支持構造体
KR20170016547A (ko) 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
US11040705B2 (en) 2016-05-19 2021-06-22 Pylon Manufacturing Corp. Windshield wiper connector
US10761435B2 (en) 2017-02-10 2020-09-01 Asml Holding N.V. Reticle clamping device
JP7408683B2 (ja) * 2019-04-30 2024-01-05 エーエスエムエル ネザーランズ ビー．ブイ． 構造体に耐摩耗材料を提供するための方法、及び複合体
US11650512B2 (en) * 2021-06-25 2023-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle cleaning device and method of use
WO2025242380A1 (en) * 2024-05-20 2025-11-27 Asml Netherlands B.V. Split chuck

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20020117792A1 (en) * 2001-02-23 2002-08-29 Leidy Robert K. Wafer chuck having a removable insert
JP2004319891A (ja) * 2003-04-18 2004-11-11 Canon Inc 露光装置
US20050200827A1 (en) 2004-03-01 2005-09-15 Canon Kabushiki Kaisha Positioning apparatus and exposure apparatus using the same

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JPS6335989U (enExample) * 1986-08-25 1988-03-08
US5401973A (en) 1992-12-04 1995-03-28 Atomic Energy Of Canada Limited Industrial material processing electron linear accelerator
KR100443277B1 (ko) * 2000-02-07 2004-08-04 티디케이가부시기가이샤 복합기판, 이를 사용한 박막발광소자 및 그 제조방법
JP2003007602A (ja) * 2001-06-26 2003-01-10 Nikon Corp 計測装置及び計測方法、露光装置及び露光方法
JP2002050560A (ja) 2000-08-02 2002-02-15 Nikon Corp ステージ装置、計測装置及び計測方法、露光装置及び露光方法
JP2002134599A (ja) * 2000-10-24 2002-05-10 Ngk Insulators Ltd 静電吸着装置
JP2002299228A (ja) 2001-04-03 2002-10-11 Nikon Corp レチクル、それを用いた露光装置及び露光方法
JP4103385B2 (ja) * 2001-12-27 2008-06-18 住友金属工業株式会社 真空チャック
JP2003332411A (ja) * 2002-05-17 2003-11-21 Nikon Corp 基板保持装置及び露光装置
TWI254841B (en) * 2002-12-23 2006-05-11 Asml Netherlands Bv Lithographic apparatus
EP1434100A2 (en) * 2002-12-23 2004-06-30 ASML Netherlands B.V. Lithographic apparatus
EP1576637A2 (en) 2002-12-27 2005-09-21 Matsushita Electric Works, Ltd. Field emission-type electron source and method of producing the same
JP2005039155A (ja) * 2003-07-18 2005-02-10 Matsushita Electric Ind Co Ltd 半導体装置の製造方法及びそれに用いる半導体基板の製造方法
US7119884B2 (en) * 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7786607B2 (en) 2004-02-19 2010-08-31 Asml Holding N.V. Overlay correction by reducing wafer slipping after alignment
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
KR101585310B1 (ko) * 2004-12-15 2016-01-14 가부시키가이샤 니콘 기판 유지 장치, 노광 장치 및 디바이스 제조방법
JP4708876B2 (ja) * 2005-06-21 2011-06-22 キヤノン株式会社 液浸露光装置
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US7564536B2 (en) * 2005-11-08 2009-07-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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WO2007136123A1 (en) * 2006-05-19 2007-11-29 Nikon Corporation Chucks for reticles and other planar bodies
US7722256B2 (en) * 2006-11-17 2010-05-25 Corning Incorporated Flat surface air bearing assembly
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020117792A1 (en) * 2001-02-23 2002-08-29 Leidy Robert K. Wafer chuck having a removable insert
JP2004319891A (ja) * 2003-04-18 2004-11-11 Canon Inc 露光装置
US20050200827A1 (en) 2004-03-01 2005-09-15 Canon Kabushiki Kaisha Positioning apparatus and exposure apparatus using the same

Also Published As

Publication number Publication date
NL1036735A1 (nl) 2009-10-13
CN101990652B (zh) 2012-10-10
WO2009124732A1 (en) 2009-10-15
TWI429018B (zh) 2014-03-01
JP2011520245A (ja) 2011-07-14
US8976336B2 (en) 2015-03-10
CN101990652A (zh) 2011-03-23
US20110013164A1 (en) 2011-01-20
TW201001613A (en) 2010-01-01
US8786832B2 (en) 2014-07-22
US20140016110A1 (en) 2014-01-16
KR20100133473A (ko) 2010-12-21
US20140233009A1 (en) 2014-08-21
JP5372136B2 (ja) 2013-12-18

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