TWI427178B - 用於沉積薄膜之裝置、方法及系統 - Google Patents

用於沉積薄膜之裝置、方法及系統 Download PDF

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Publication number
TWI427178B
TWI427178B TW099107789A TW99107789A TWI427178B TW I427178 B TWI427178 B TW I427178B TW 099107789 A TW099107789 A TW 099107789A TW 99107789 A TW99107789 A TW 99107789A TW I427178 B TWI427178 B TW I427178B
Authority
TW
Taiwan
Prior art keywords
substrate
substrate holder
chambers
chamber
deposition source
Prior art date
Application number
TW099107789A
Other languages
English (en)
Chinese (zh)
Other versions
TW201104008A (en
Inventor
Kyung Bin Bae
Hyung Seok Yoon
Chang Ho Kang
Hyun Goo Kwon
Original Assignee
Snu Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snu Precision Co Ltd filed Critical Snu Precision Co Ltd
Publication of TW201104008A publication Critical patent/TW201104008A/zh
Application granted granted Critical
Publication of TWI427178B publication Critical patent/TWI427178B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW099107789A 2009-03-31 2010-03-17 用於沉積薄膜之裝置、方法及系統 TWI427178B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090027351A KR101097737B1 (ko) 2009-03-31 2009-03-31 박막 증착 장치와 박막 증착 방법 및 박막 증착 시스템

Publications (2)

Publication Number Publication Date
TW201104008A TW201104008A (en) 2011-02-01
TWI427178B true TWI427178B (zh) 2014-02-21

Family

ID=42828832

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099107789A TWI427178B (zh) 2009-03-31 2010-03-17 用於沉積薄膜之裝置、方法及系統

Country Status (5)

Country Link
JP (1) JP5364200B2 (ja)
KR (1) KR101097737B1 (ja)
CN (1) CN102369306B (ja)
TW (1) TWI427178B (ja)
WO (1) WO2010114274A2 (ja)

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US20100279021A1 (en) * 2009-05-04 2010-11-04 Samsung Mobile Display Co., Ltd. Apparatus for depositing organic material and depositing method thereof
KR101151234B1 (ko) * 2010-03-30 2012-06-14 주식회사 케이씨텍 직립방식 증착장치 및 기판 이송 방법
JP2013167001A (ja) * 2012-02-16 2013-08-29 Hitachi High-Technologies Corp 真空蒸着システム及び真空蒸着方法
KR102106414B1 (ko) * 2013-04-26 2020-05-06 삼성디스플레이 주식회사 증착 챔버, 이를 포함하는 증착 시스템 및 유기 발광 표시장치 제조방법
KR20150053161A (ko) * 2013-11-07 2015-05-15 삼성디스플레이 주식회사 증착 장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법
WO2015086049A1 (en) * 2013-12-10 2015-06-18 Applied Materials, Inc. Evaporation source for organic material, apparatus having an evaporation source for organic material, system having an evaporation deposition apparatus with an evaporation source for organic materials, and method for operating an evaporation source for organic material
KR102229761B1 (ko) 2014-03-17 2021-03-23 삼성디스플레이 주식회사 원자층 증착 장치
CN107002223B (zh) * 2014-12-05 2019-11-05 应用材料公司 材料沉积系统和用于在材料沉积系统中沉积材料的方法
DE102016110884A1 (de) 2016-06-14 2017-12-14 Aixtron Se Vorrichtung und Verfahren zum Abscheiden organischer Schichten auf ein oder mehreren Substraten
CN106435482A (zh) * 2016-10-27 2017-02-22 安徽恒致铜铟镓硒技术有限公司 独立箱式蒸发源装置
CN108701775A (zh) * 2017-02-03 2018-10-23 应用材料公司 用于具有并排的基板的连续蒸发的设备和方法
EP3394881A1 (en) * 2017-03-17 2018-10-31 Applied Materials, Inc. Methods of handling a mask device in a vacuum system, mask handling apparatus, and vacuum system
CN110998869B (zh) * 2017-08-09 2022-12-27 株式会社钟化 光电转换元件的制造方法
CN109423610B (zh) * 2017-08-24 2020-12-04 京东方科技集团股份有限公司 一种蒸镀装置及蒸镀方法
KR101921648B1 (ko) * 2017-12-28 2018-11-26 주식회사 올레드온 수직형 면증발원을 이용한 고해상도 ａｍｏｌｅｄ 소자의 클러스터형 양산장비
KR102355814B1 (ko) * 2020-03-20 2022-01-26 주식회사 선익시스템 증착 장치 및 이를 이용한 유기물 증착 방법
KR102430349B1 (ko) * 2020-04-14 2022-08-08 주식회사 선익시스템 클러스터 증착 시스템
KR102413664B1 (ko) * 2020-04-20 2022-06-28 주식회사 선익시스템 클러스터 증착 시스템
KR102407505B1 (ko) * 2020-04-29 2022-06-13 주식회사 선익시스템 증착 장치 및 인라인 증착 시스템
CN111663104A (zh) * 2020-06-24 2020-09-15 武汉华星光电半导体显示技术有限公司 蒸镀系统及蒸镀方法
CN114875363A (zh) * 2022-03-24 2022-08-09 广州华星光电半导体显示技术有限公司 蒸镀装置及显示面板的制作方法

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Also Published As

Publication number Publication date
CN102369306B (zh) 2014-01-22
WO2010114274A2 (en) 2010-10-07
JP5364200B2 (ja) 2013-12-11
CN102369306A (zh) 2012-03-07
KR101097737B1 (ko) 2011-12-22
JP2012522137A (ja) 2012-09-20
WO2010114274A3 (en) 2010-12-23
KR20100108994A (ko) 2010-10-08
TW201104008A (en) 2011-02-01

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