TWI422487B - 薄膜及使用該薄膜之薄膜積層物 - Google Patents
薄膜及使用該薄膜之薄膜積層物 Download PDFInfo
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- TWI422487B TWI422487B TW96111188A TW96111188A TWI422487B TW I422487 B TWI422487 B TW I422487B TW 96111188 A TW96111188 A TW 96111188A TW 96111188 A TW96111188 A TW 96111188A TW I422487 B TWI422487 B TW I422487B
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- Prior art keywords
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- heat
- fluid substance
- oil
- resistant fluid
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- 239000000126 substance Substances 0.000 claims description 56
- 239000012530 fluid Substances 0.000 claims description 33
- -1 phosphate ester Chemical class 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 239000011347 resin Substances 0.000 claims description 24
- 239000003779 heat-resistant material Substances 0.000 claims description 18
- 230000002209 hydrophobic effect Effects 0.000 claims description 15
- 125000000524 functional group Chemical group 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 12
- 125000002091 cationic group Chemical group 0.000 claims description 10
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims description 7
- 229910052901 montmorillonite Inorganic materials 0.000 claims description 7
- GMEXDATVSHAMEP-UHFFFAOYSA-N dimethyl(phenyl)sulfanium Chemical class C[S+](C)C1=CC=CC=C1 GMEXDATVSHAMEP-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 125000003944 tolyl group Chemical group 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 3
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 3
- 150000004693 imidazolium salts Chemical class 0.000 claims description 3
- 229920013639 polyalphaolefin Polymers 0.000 claims description 3
- 229920002098 polyfluorene Polymers 0.000 claims description 3
- 229920005862 polyol Polymers 0.000 claims description 3
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 3
- 229910021647 smectite Inorganic materials 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 claims description 2
- 229910000271 hectorite Inorganic materials 0.000 claims description 2
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims description 2
- 229910052900 illite Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- VGIBGUSAECPPNB-UHFFFAOYSA-L nonaaluminum;magnesium;tripotassium;1,3-dioxido-2,4,5-trioxa-1,3-disilabicyclo[1.1.1]pentane;iron(2+);oxygen(2-);fluoride;hydroxide Chemical compound [OH-].[O-2].[O-2].[O-2].[O-2].[O-2].[F-].[Mg+2].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].[K+].[Fe+2].O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2 VGIBGUSAECPPNB-UHFFFAOYSA-L 0.000 claims description 2
- 229910000273 nontronite Inorganic materials 0.000 claims description 2
- 229920000620 organic polymer Polymers 0.000 claims description 2
- 150000002923 oximes Chemical class 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 150000004714 phosphonium salts Chemical group 0.000 claims description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 2
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 229910052902 vermiculite Inorganic materials 0.000 claims description 2
- 239000010455 vermiculite Substances 0.000 claims description 2
- 235000019354 vermiculite Nutrition 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 239000002734 clay mineral Substances 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 150000001721 carbon Chemical class 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052622 kaolinite Inorganic materials 0.000 claims 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 229910052712 strontium Inorganic materials 0.000 claims 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 description 159
- 239000003921 oil Substances 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 30
- 239000004927 clay Substances 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 239000006185 dispersion Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- 150000001768 cations Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- CXRFDZFCGOPDTD-UHFFFAOYSA-M Cetrimide Chemical compound [Br-].CCCCCCCCCCCCCC[N+](C)(C)C CXRFDZFCGOPDTD-UHFFFAOYSA-M 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
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- 238000005187 foaming Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
- 239000012454 non-polar solvent Substances 0.000 description 2
- UNZVCQADHJCNDL-UHFFFAOYSA-M octadecyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCCCCCCCCCCCCCCCC)C1=CC=CC=C1 UNZVCQADHJCNDL-UHFFFAOYSA-M 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- SVAJFGSRMSAWIK-UHFFFAOYSA-N [keto(dimethyl)sulfuraniumyl]benzene Chemical class C[S+](C)(=O)C1=CC=CC=C1 SVAJFGSRMSAWIK-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- BPFNHYSORRSJFF-UHFFFAOYSA-N azanium 18,18-dimethylnonadecanoate Chemical compound [NH4+].CC(CCCCCCCCCCCCCCCCC(=O)[O-])(C)C BPFNHYSORRSJFF-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000275 saponite Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2429/00—Carriers for sound or information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
- Y10T428/249995—Constituent is in liquid form
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本發明是有關可作為顯示器(display)用薄膜基板而使用之具有優異的耐熱性、耐水性、以及柔軟性之薄膜及使用該薄膜之薄膜積層物。
本發明申請案,係根據2006年3月30日所提出申請之日本專利特願2006-095788號及2006年8月25日所提出申請之日本專利特願2006-229849號而主張優先權,並將其內容援用於本說明書內者。
顯示器,由可移動性(mobility)或省空間(saving space)方面來看,係從以往的陰極射線管方式急激改變為液晶(LCD,液晶顯示器)方式中。再者,作為新一代顯示器,已開始生產一種自生發光裝置(autogenuous light display device)為明亮度、鮮明度、耗電方面亦優異的有機EL(organic electroluminescent有機電致發光)方式者。此等方式與以往的陰極射線管方式相比雖然在可移動性或省空間方面格外優異,但由於仍然使用玻璃作為基板,故較為笨重、且亦有會破裂的問題。
為了解決此等問題起見,部分的液晶方式者已開始使用薄膜基板(簡稱placell)。然而,作為新一代顯示器而受人瞻目之有機EL顯示器而言,由於需要低電阻的透明導電膜,所以必需經過250℃以上之熱處理。以往的塑膠基板中尚無法忍受如此熱處理條件者,惟近年來,作為能符合要求之材料,有一種粘土薄膜頗受瞻目。
粘土薄膜,具有優異的透明性及可撓性。又,由於粒子具有按層狀細緻方式定向之構造,故氣體阻障(gas barrier)性優異。再者,由於主成分為無機物,故耐熱性非常優(例如,參考專利文獻1)。然而,如作為液晶或有機EL顯示器用的薄膜基板使用時,則會有耐水性的問題。一般所用之粘土,係於層間含有親水性陽離子(hydrophilic cathion),為一種吸濕性高的物質。因此,不適合使用為可能會有因水分而引起劣化的疑慮之有機EL顯示器用的薄膜基板。為了解決此種問題,有提案將粘土層間所含之親水性陽離子改換為疏水性陽離子(hydrophobic cathion)之方法。然而,如改換為疏水性陽離子時,由於粘土膜的柔軟性會降低,所以需要添加為了賦與柔軟性之樹脂成分,卻有由於該樹脂成分不耐熱,導致不能充分發揮粘土所具有之耐熱性之問題。
專利文獻1:日本專利特開2005-104133號公報。
如前所述,為了將粘土薄膜作為有機顯示器用的薄膜基板利用時,需要製得具有透明性、耐熱性、耐水性優異的可撓性之薄膜。因而,本發明之目的在於提供一種具備有充分的耐熱性及耐水性之同時,尚具備有柔軟性之薄膜及薄膜積層物。
本發明薄膜之特徵為:於薄片狀耐熱材料的層間,含有耐熱性流動物質。
又,本發明之薄膜積層物的特徵為:於上述薄膜的單面或兩面,按單層或複數層方式積層無機薄膜或有機薄膜中的至少一方。
本發明之薄膜,係兼備耐熱性、耐水性、柔軟性之優異薄膜。
又,本發明之薄膜,可藉由該薄膜所具有之上述特性而利用於多種製品中。例如,可使用於:電子紙用基板、電子裝置用密封薄膜、透鏡薄膜(lens film)、導光板用薄膜、稜晶薄膜(prism film)、相位差板(phase shift plate).偏光板用薄膜(polarizer film)、視角校正薄膜(visual angle correction film)、PDP(電漿顯示面板)用薄膜、LED(發光二極體)用薄膜、光通信用構件、觸摸式面板(touch panel)用薄膜、各種功能性薄膜之基板、可透視內部構造的電子設備用薄膜、含有視訊光碟(video disk)、CD(compact disk,光碟)/CD-R(唯讀型光碟)/CD-RW(可重複讀寫型光碟)/DVD(多樣化數位光碟)/MO(磁光碟)/MD(小基磁碟)、相轉變光碟(phase change disk)、光學卡片(optical card)之光記錄媒體(optical record media)用薄膜、燃料電池用密封薄膜、太陽電池用薄膜等。
又,由於本發明之薄膜積層物,係於薄膜的單面或兩面,按單層或複數層方式積層無機薄膜或有機薄膜中的至少一方,故可實現高度的氣體阻障性。因而,很適合使用為液晶或有機EL顯示器用的薄膜基板。
以下,就本發明的薄膜及薄膜積層物加以詳細說明。
本發明之薄膜,具有薄片狀耐熱材料經定向並積層之構造,且於此之薄片狀耐熱材料的間隙中存在有耐熱性流動物質。膜厚為1至3000μm程度。
第1圖,係以圖解方式表示本發明薄膜的一例之剖面圖。如第1圖所示,本發明之薄膜,具有厚度在0.5至2奈米而粒徑在1μm以下的複數個薄片狀耐熱材料1經定向並積層,且於該薄片狀耐熱材1的各個之間夾雜著有耐熱性流動物質2之構造。
本發明中之薄片狀耐熱材料1而言,可例舉如:由天然或合成物所成之粘土磺物。具體的可列舉如選自:雲母、蛭石(vermiculite)、微晶高嶺石(montmorillonite)、鐵微晶高嶺石(ion montmorillonite)、貝得石(beidellite)、皀石(saponite)、鋁蒙脫石(hectorite)、富鎂蒙脫石(stevensite)、襄脫石(nontronite)、矽酸鹽層(magadiite)、伊利石(illite)、層狀聚矽酸鹽(kanemite)、層狀鈦酸、蒙脫石(smectite)等之中至少1種。
又,存在於上述薄片狀耐熱材料1的層間之耐熱性流動物質2而言,較佳為即使在潤滑油等所代表之200℃以上的加熱中仍然不會引起分解、沸騰等的變質之液狀或糊膏(paste)狀的物質。
此等耐熱性流動物質的含量,按重量比計算,較佳為薄膜全體的1至60%,更佳為5至60%。如為1%以上,則容易獲得薄膜的柔軟性。如為60%以下,則容易自立為膜。
上述耐熱性流動物質之具體例而言,可列舉如:聚烷二醇、磷酸酯、烷基苯、聚α-烯烴、多醇脂、烷基萘、聚矽氧油(silicone oil)、鹵化碳(halocarbone)、聚芳基烷烴、聚苯、矽酸酯、以及聚苯基醚等。
此等耐熱性流動物質之中,較佳為具有反應性官能基者。
又,上述耐熱性流動物質之中,較佳為聚矽氧油。此乃由於聚矽氧油,係與其他耐熱性流動物質相比,為因溫度所引起之粘度變化較小之故。
再者,聚矽氧油之中,具有各種反應性官能基之聚矽氧油很適合使用。更佳為反應性改性聚矽氧油。
在此,反應性改性聚矽氧油,係指於聚矽氧油的甲基的一部分經導入各種反應性官能基,以賦予對有機物之間的適應性或化學反應性、對水之間的溶解性、乳化性或撥水性(water repellency)等特性之意。
藉由硬化劑或反應助劑,而聚矽氧油的反應性官能基互相間會進行化學結合或交聠。由此,具有流動性之聚矽氧油或為橡膠性狀或柔軟物,而扮演對自立膜賦與柔軟性之角色。
其中,耐熱性較高的甲基苯基聚矽氧油或者甲基苯基聚矽氧油的改性油為宜。將甲基苯基聚矽氧油的構造式表示於下列。
又,環氧改質聚矽氧油亦很適合。如耐熱性流動物質為環氧改性聚矽氧油,再含有環氧樹脂硬化劑,或者再含有環氧樹脂時,則環氧改質聚矽氧油的環氧基會進行反應,而成為具有聚矽氧橡膠性狀之自立膜。
如含有環氧樹脂時,則樹脂與本身為耐熱性流動物質之環氧改質聚矽氧油之間亦會進行交聯反應,而成為更具有高強度且柔軟性之自立膜。
如上述,聚矽氧油所具有之反應性官能基,亦即,例示作為有機基之甲基苯基或環氧基。然而,本發明中並不特別限定於此等基,衹要是具有上述效果者,則可選擇各種反應性官能基。
本發明中所使用之耐熱性流動物質,較佳為含有疏水性陽離子物質。如含有疏水性陽離子物質時,則容易於薄片狀耐熱材料間存在耐熱性流動物質。一般而言,粘土係在內部含有親水性的交換性陽離子,故容易與疏水性的陽離子進行交換。
作為疏水性陽離子物質者,可例舉如:二甲基二硬酯醯銨鹽或三甲基硬脂醯銨鹽等的四級銨鹽,具有芐基或聚氧化乙烯基之銨鹽、四級鏻鹽、吡啶鎓鹽、以及咪唑鎓鹽等。
使用此等疏水性陽離子物質,利用粘土的離子交換性,例如,利用蒙脫石的陽離子交換性,則可使其有機化。由此,粘土對有機溶劑中的分散會變容易,聚矽氧油的夾雜(intercalation)容易進行。
下列中,將上述所示之疏水性陽離子的物質依一般式加以表示。下述一般式(1)表示四級銨鹽、一般式(2)表示四級鏻鹽、一般式(3)表示吡啶鎓鹽、而一般式(4)表示咪啶鎓鹽。
(式中,X表示鹵元素、R1至R11表示烷基或苯基)
為了增加薄膜的強度,耐熱性流動物質,較佳為含有在室溫下具有固體形狀之樹脂。作為在室溫下具有固體形狀之樹脂者,雖並不特別加以限定,但可列舉如:以熱或紫外線而聚合之環氧系樹脂、聚醯胺醯亞胺、聚矽氧樹脂等。
再者,在上述室溫下為固體形狀之樹脂,較佳為具有能與上述耐熱性流動物質進行化學反應之官能基。
例如,此種樹脂與合適的耐熱性流動物質的組合者,可例示如:具有如上所說明之環氧基的聚矽氧油與環氧系樹脂,具有胺基之聚矽氧油與聚醯亞胺樹脂或聚矽氧樹脂等各種組合。
藉由將耐熱性流動物質與具有能進行化學反應之官能基之樹脂加以組合,則該樹脂即與前述耐熱性流動物質進行化學反應而成為交聯結構,其結果,薄膜的強度可獲提升。
具有在此所稱之官能基之樹脂,以重量計算較佳為,在薄膜全體的50%以下者。如在50%以下,則由於能維持合適的薄片狀耐熱材的比例,故更能獲得良好的耐熱性及氣體阻障性。
本發明之薄膜,例如,可依下列方法製得。
(1)使薄片狀耐熱材料及具有疏水性之陽離子物質分散於純水中後,加以固液分離並使其乾燥以製得有機化粘土。
(2)使上述有機化粘土及耐熱性流動物質分散到有機溶劑後,將此分散液靜置於容器內或薄膜等以使薄片狀耐熱材料沉積之同時,使有機溶劑揮發以去除,以任意方式在60至300℃的溫度條件下乾燥,則可製得自立之薄膜。
另外,作為上述步驟(1)的前步驟,如預先使用有機矽烷偶合劑(silane coupling agent)或矽烷化合物等加以矽烷基化處理(silglation treatment),則可得提高與耐熱性流動物質之間的相溶性,反應性的提升等的效果之故很合適。
又,於上述步驟(1)中,使薄片狀耐熱材料及具有疏水性之陽離子物質分散於純水中時,或者於上述步驟(2)中,在有機溶劑中分散時,亦可添加各種硬化助劑、抗氧化劑、表面活性劑、顏料、塗平劑(leveling agent)等的一般性添加劑。
除上述製造方法之外,亦可使薄片狀耐熱材料及耐熱性流動物質分散於溶劑中,並將此塗佈於支撐體等之上以形成薄膜,然後將支撐體及薄膜加以熱處理後,從支撐體剝離薄膜而製得。
本發明之薄膜雖單獨亦能作為自立膜利用,惟為了獲得更高的氣體阻障性、耐藥品性、表面平滑性,亦可作成於薄膜的單面或兩面,按單層或複層方式積層無機薄膜或有機薄膜中的至少一方之薄膜積層物。
上述無機薄膜或有機薄膜而言,並無特別限定,惟可視用途而選擇最合適者。例如,可將氧化矽或氧化氮化矽依濺鍍法(sputtering)或電漿CVD(化學蒸汽沉積)法實施無機薄膜之製膜,即可賦與更高的氣體阻障性及耐藥品性。進一步藉由塗佈有機聚合物以形成有機薄膜,即可於表面賦與平坦性。將此等無機薄膜及有機薄膜的表面塗膜加以積層,則可賦與單獨薄膜所不能具備之特性。
以下,根據實施例,就本發明之最佳實施形態加以說明,惟本發明並不侷限於此等實施例。
(有機化黏土之製作)作為疏水性陽離子物質的溴化十四烷基三甲基銨(tetradecyl trimethyl ammonium bromide)5g分散於純水50g中後投入,作為薄片狀耐熱材料的合成蒙脫石(國峰工業社製,商品名:斯梅克頓SA)5g,並使其充分分散潤脹(swelling)。使用離心分離器而進行該溶液的固液分離(solid-liquid speration)以去除液分後,再投入純水50g並實施分散、固液分離。反覆此種分散,固液分離至不再發泡為止之後,使用乾燥機將水分完全去除。藉此,粘土中所含之親水性的交換性陽離子與十四烷基三甲基銨離子進行交換,可製得對於非極性溶劑(nonpolar solvent)之甲苯具有潤脹性之有機化黏土。
(薄膜之製作)將上述所得之有機化黏土加以粉碎後,使有機化黏土5g分散.潤脹於甲苯100g中,並添加作為耐熱性流動物質之二甲基苯基聚矽氧油4g後,再繼續分散。將所得溶液灌注於底面為平坦而深度為2mm之含氟樹脂容器中。將此放置於室溫環境中,使溶劑揮發後,再以150℃的溫風乾燥器使溶劑分完全去除,製得本實施例的薄膜。該薄膜係能容易自容器中剝離,為一種透明而具有柔軟性之厚度100 μm的含聚矽氧油之薄膜。
除將疏水性陽離子改換為溴化十八烷基三苯基鏻以外,其餘則按照與實施例1同樣方法製得本發明之薄膜。
除在黏土膜形成的二甲基苯基聚矽氧油投入時,同時投入熱硬化性環氧樹脂2g以外,其餘則按照與實施例1同樣方法製得本發明之薄膜。
於前述實施例2中所得薄膜的兩面,以2 μm厚度塗佈紫外線硬化型丙烯酸樹脂。然後,於所塗佈之樹脂上,使用反應性濺鍍裝置進行60nm的氧化氮化矽膜之製膜,製得本實施例的薄膜積層物。
除將耐熱性流動物質改換為烷基苯(新日本石油社製,商品名:克列特阿爾堅200P)以外,其餘則按照與實施例2同樣方法製得本實施例的薄膜。
除將耐熱性流動物質改換為聚α-烯烴(出光社製,商品名:PAO5010)以外,其餘則按照與實施例2同樣方法製得本實施例的薄膜。
除將耐熱性流動物質改換為多醇酯(花王社製,商品名:花王盧布262)以外,其餘則按照與實施例2同樣方法製得本實施例的薄膜。
除將耐熱性流動物質改換為聚苯基醚(松村石油研究所社製,商品名:莫列斯科海拉特RP-42R)以外,其餘則按照與實施例2同樣方法製得本實施例的薄膜。
使合成蒙脫石(國峰社製,商品名:斯梅克頓SA)5g分散,潤脹於純水100g中後,投入聚丙烯酸鈉2g後再繼續分散。將所得溶液灌注於底面為平坦而深度為2mm之含氟樹脂容器中。將此在100℃下乾燥以去除水分,製得比較用的薄膜。該薄膜係能容易從容器剝離,為一種透明性之厚度100 μm的薄膜。
使與前述實施例1同樣的有機化粘土5g分散,潤脹於甲苯100g中,並將所得溶液灌注於底面為平坦而深度為2mm之含氟樹脂容器中。將此放置於室溫環境中,以使溶劑揮發後,再以150℃的溫風乾燥器使溶劑分完全去除,製得比較用的薄膜。該薄膜係能容易從容器剝離,為一種透明性之厚度100 μm的薄膜。
使與前述實施例1同樣的有機化粘土5g分散,潤脹於甲苯100g中,並投入熱硬化性環氧樹脂4g後再繼續分散。將所得溶液灌注於底面為平坦而深度為2mm之含氟樹脂容器中。將此放置於室溫環境中使溶劑揮發後,再以150℃的溫風乾燥器使溶劑分完全去除,並進行樹脂的硬化,製得比較用的薄膜。該薄膜係容易從容器剝離,為一種透明性之厚度100 μm的含環氧樹脂之薄膜。
就前述實施例1至8及比較例1至3中所製作之薄膜及薄膜積層物,實施下述之特性評估。
(1)水浸(water immersion)後的外觀評估將前述實施例1至8及比較例1至3所製作之薄膜及薄膜積層物裁切為3cm×3cm大小,並評估於水中經浸漬1小時後的外觀,將此結果表示於表1中。
(2)屈撓(flex)後的外觀將前述實施例1至8及比較例1至3中所製作之薄膜及薄膜積層物裁切為3cm×6cm大小,並評估經捲繞於直徑20mm的圓棒時的外觀,將其結果表示於表1中。
(3)加熱後的外觀將前述實施例1至8及比較例1至3中所製作之薄膜及薄膜積層物裁切為3cm×3cm大小後,評估將此等經在烘箱(oven)中200℃下加熱15分鐘,250℃下加熱15分鐘後的外觀,將此結果表示於表1中。
(4)全光線穿透率(total light transmission ratio)將上述實施例1至4及比較例1至3中之經過加熱後的薄膜及薄膜積層體和未經過加熱者,使用混濁計(haze meter,NDH2000,日本電色社製)以測定全光線穿透率,將此結果表示於表2中。
(5)線膨脹率(linear expausion ratio)將前述實施例1至4及比較例1至3中所製作之薄膜及薄膜積層物,按照線膨漲率試驗方法(JIS K 7197)測定線膨艱率,將此結果表示於表2。
(6)水蒸氣穿透率(steam transmission ratio)將前述實施例1至4及比較例1至3中所製作之薄膜及薄膜積層物,藉由按照(JIS K 7126 A)法(差壓法)之差壓式(differential pressure)的氣體層析法(gas chromatography),使用能測定氣體、蒸氣等的穿透率、透濕度(misture permeability)之GTR科技(股)公司製的氣體、水蒸氣穿透率測定裝置,測定水蒸氣穿透率,並將此結果表示於表2中。水蒸氣穿透率,係在40℃/90%RH(相對濕度)的條件下進行。
由表1的結果可知,本實施例1至8的薄膜及薄膜積層物,係在水浸後,屈撓後以及加熱後並無任何變化,而經確認為耐水性、耐熱性、柔軟性優異之事實。
相對於此,經確認比較例1者為柔軟性不佳、比較例2以及3者為耐熱性不佳。
由表2的結果可知,本實施例1至4的薄膜及薄膜積層物,係在未加熱及加熱後其全光線穿透率均有81%以上,且線膨脹率及水蒸氣穿透率在實用上亦無問題。
相對於此,比較例1者,則發生顯著的收縮,水蒸氣穿透率亦惡化到不能測定之程度。又,比較例2及3者,則加熱後的全光線穿透率惡化到不能測定之程度,線膨脹率及水蒸氣穿透率亦不能測定或實用上有顯著惡化之結果。
(有機化粘土之製作)使溴化十四烷基三甲基銨5g分散於純水50g中之後,投入合成蒙脫石(國峰工業社製,商品名:斯梅克頓SA)5g,並使其充分分散膨脹。使用離心分離器進行該溶液的固液分離以去除液體部分後,再投入純水50g並實施分散、固液分離。反覆此種分散.固液分離至不再發泡為止之後,使用乾燥機將水分完全去除。藉此,粘土中所含之親水性的交換性陽離子與十四烷基三甲基三甲基銨離子進行交換,製得對於非極性溶劑的甲苯具有膨脹性之有機化黏土。
將上述所得之有機化粘土加以粉碎後,使有機化黏土10g於甲苯100g中分散.膨脹,並添加具有環氧基之環氧改質二甲基苯基矽氧油(信越化學工業社製,商品名:X-22-2000)0.5g、酸酐系硬化劑(新日本理化社製,商品名:理化希土MH-700)0.25g後再繼續分散。使用塗佈器(applictor)將所得溶液塗佈於經脫模處理之聚對苯二甲酸乙二醇酯(以下,簡稱PET薄膜)上以進行製膜。然後,投到100℃的乾燥機中以去除溶劑成分,從PET薄膜剝離,藉由170℃/2小時的熱處理而使環氧改質矽氧油進行交聯,製得本實施例的薄膜。該薄膜,為一種透明而具有柔軟性之厚度80μm的薄狀物。
除了將環氧改質二甲基苯基矽氧油(信越化學工業社製,商品名:X-22-2000)改變為5g,將酸酐系硬化劑(新日本理化社製,商品名:理化希土MH-700)改變為2.5g之外,其餘與實施例9同樣方法製得厚度80μm的本實施例
的薄膜。
除了將環氧改質二甲基苯基矽氧油(信越化學工業社製,商品名:X-22-2000)改變為10g,將酸酐系硬化劑(新日本理化社製,商品名:理化希土MH-700)改變為5g之外,其餘與實施例9同樣方法製得厚度80μm的本實施例的薄膜。
除了不用溴化十四烷基三甲基銨5g而使用溴化十八烷基三苯基鏻5g之外,其餘與實施例9同樣方法製得厚度80μm的本實施例的薄膜。
除了不用環氧改質二甲基苯基矽氧油(信越化學工業社製,商品名:X-22-2000)1g而使用胺基改質二甲基苯基矽氧油(信越化學工業社製,商品名:X-22-1660b-3)1g以外,其餘與實施例9同樣方法製得厚度80μm的本實施例的薄膜。
除了在薄膜的形成時,再添加以雙芳基茀(fluoren)作為基本骨架之熱硬化型環氧樹脂(長瀨產業社製,商品名:EX1020)1g以外,其餘則按與實施例9同樣方法製得厚度80μm的本實施例的薄膜。
於實施例9所製作之薄膜的表面及背面,使用桿塗佈
器塗佈於硬質覆膜(hard coat)材料之紫外線硬化丙烯酸胺酯(日本合成化學社製,商品名:紫光UV7600B),並使用紫外線照射使其硬化後,將表面背面各1μm的硬質覆膜層加以積層,製得本實施例的薄膜積層物。
於實施例9所製作之薄膜的表面背面,藉由反應性濺鍍(reactive sputtering)而將本身為無機層之SiOx膜加以積層60nm,製得本實施例的薄膜積層物。
使實施例9所得之經有機化之粘土5g於甲苯100g中分散.膨脹,並將未調配耐熱性流動物質所得之溶液使用塗佈器塗佈於經脫模處理之PET薄膜上以製膜。然後,投入於100℃的乾燥機中,以去除溶劑成分,從PET薄膜剝離,製得厚度80μm的比較用的薄膜。
除了不用環氧改質二甲基苯基矽氧油而使用無反應性之流動物質之二甲基矽氧油(信越化學工業社製,商品名:KF-54)1g,並不含有酸酐系硬化劑之外,其餘與實施例9同樣方法製得厚度80μm的比較用的薄膜。
就如上述方式所得實施例9至16及比較例4及5所製作之薄膜,測定下述特性,並將其結果表示於表3中。
將薄膜捲繞於直徑15mm的圓棒中並使其屈撓後,觀察其外觀。
將各經過放置於200℃及250℃的恒溫槽中1小時後之薄膜外觀,加以觀察。
按照ASTM-D696而測定線膨脹係數。
藉由按照JIS K 7126 A法(差壓法)之差壓式的氣體層析法,使用能測定氣體,水蒸氣等的穿透率,透濕度之GTR科技(股)公司製的氣體,水蒸氣穿透率測定裝置,在溫度40℃/濕度90%RH條件下測定水蒸氣穿透率。
使用混濁計(haze weter NDH2000,日本電色社製),以進行全光線穿透率的測定。
由上述表3可知,本發明之實施例9至16的薄膜及積層物,屈撓後的外觀上並無變化而具有柔軟性,在200℃加熱後仍然無變化且具有充分的耐熱性者。叉,實施例9至16的薄膜,線膨脹係數在33ppm/℃以下且尺寸穩定性亦具有良好的耐熱性,水蒸氣穿透率亦在0.8g/m2
day以下而具有良好的耐水性,全光線穿透率亦達90%上而透明性亦良好者。
相對於此,比較例4之薄膜則在屈撓後發生裂紋而不具有柔軟性者。又,比較例5的薄膜,由於線膨脹係數在53ppm/℃且耐熱性不足夠,故尺寸穩定性不佳而經確認為加工上有問題者。
本發明之薄膜,係因薄膜之各種特性而可利用於多種製品中。例如可使用在:電子紙用基板、電子裝置用密封薄膜、透鏡薄膜、導光板用薄膜、稜晶(prism)薄膜、位差板、偏光板用薄膜、視角校正薄膜、PDP用薄膜、LED用薄膜、光通信用構材、觸模式面板用薄膜,各種功能性薄膜的基板,可透視內部之構造的電子機器用薄膜、含有視訊光碟,CD/CD-R/CD-RW/DVD/MO/MD,相轉變光碟,光學卡片之光記錄媒體用薄膜、燃料電池用密封薄膜,太陽電池用薄膜等。
又,本發明之薄膜積層物,可實現高度的氣體阻障性,很適合使用為液晶或有機EL顯示器的薄膜基板。
1...薄片狀耐熱材料
2...耐熱性流動物質
第1圖係本發明薄膜之一例的圖解剖面圖。
1...薄片狀耐熱材料
2...耐熱性流動物質
Claims (14)
- 一種薄膜,其特徵為:於含有疏水性陽離子物質之薄片狀耐熱材料的層間,包含有選自聚烷二醇、磷酸酯、烷基苯,聚α-烯烴、多醇酯、烷基萘、聚矽氧油、鹵化碳、聚芳基烷烴、聚苯、矽酸酯、聚苯基醚之中至少1種之耐熱性流動物質,與具有能與該耐熱性流動物質進行化學反應之官能基的樹脂,其中,該耐熱性流動物質具有作為反應性官能基之環氧基或胺基,該耐熱性流動物質的含量,按重量比計算,為薄膜全體之1至60%,且該樹脂與該耐熱性流動物質形成交聯結構。
- 如申請專利範圍第1項之薄膜,其中,該薄片狀耐熱材料為黏土礦物。
- 如申請範圍專利範圍第1項之薄膜,其中,該粘土礦物,係選自雲母、蛭石(vermiculite)、微晶高嶺石(montmorillonite)、鐵微晶高嶺石、貝得石(beidellite)、皀石、鋁蒙脫石(hectorite)、富鎂蒙脫石(stevensite)、襄脫石(nontronite)、矽酸鹽層(magadiite)、伊利石、層狀聚矽酸鹽(kanemite)、層狀鈦酸、蒙脫石(smectite)等之中至少一種。
- 如申請範圍專利範圍第1項之薄膜,其中,該耐熱性流動物質係環氧改質二甲基苯基矽氧油或胺基改質二甲基苯基矽氧油。
- 如申請專利範圍第4項之薄膜,其中,耐熱性流動物質 的含量,按重量比計算,為薄膜全體的5至60%。
- 如申請專利範圍第1項之薄膜,其中,該具有反應性官能基之耐熱性流動物質,為具有反應性官能基之聚矽氧油。
- 如申請專利範圍第6項之薄膜,其中,該具有反應性官能基之聚矽氧油,為甲基苯基聚矽氧油或甲基苯基聚矽氧的改質油。
- 如申請專利範圍第1項之薄膜,其中,該耐熱性流動物質為含有疏水性陽離子物質。
- 如申請專利範圍第8項之薄膜,其中,該疏水性陽離子物質,為選自四級銨鹽、四級鏻鹽、吡啶鎓鹽、咪唑鎓鹽之中至少一種。
- 如申請專利範圍第1項之薄膜,其中,該耐熱性流動物質,含有在室溫下具有固體形狀之樹脂。
- 如申請專利範圍第1項之薄膜,其中,該樹脂的含量,按重量比計算,為薄膜全體的50%以下。
- 一種薄膜積層物,其特徵為:於如申請專利範圍第1項的薄膜之單面或兩面,積層單層或複數層之無機薄膜或有機薄膜之中的至少一方。
- 如申請專利範圍第12項之薄膜積層物,其中,該無機薄膜,為將氧化矽或氧化氮化矽藉由濺鍍法或電漿CVD法實施製膜者。
- 如申請專利範圍第12項之薄膜積層物,其中,該有機薄膜,為塗佈有機聚合物而形成者。
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US11431280B2 (en) | 2019-08-06 | 2022-08-30 | Tesla, Inc. | System and method for improving color appearance of solar roofs |
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- 2007-03-29 WO PCT/JP2007/056949 patent/WO2007114289A1/ja active Application Filing
- 2007-03-29 EP EP07740387.1A patent/EP2030779A4/en not_active Withdrawn
- 2007-03-29 US US12/294,436 patent/US20090233083A1/en not_active Abandoned
- 2007-03-29 KR KR1020087016592A patent/KR101446811B1/ko active IP Right Grant
- 2007-03-30 TW TW96111188A patent/TWI422487B/zh active
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TW589336B (en) * | 1999-02-16 | 2004-06-01 | Du Pont | Gas barrier coating system for polymeric films and rigid containers |
JP2004224815A (ja) * | 2003-01-20 | 2004-08-12 | Fuji Photo Film Co Ltd | ガスバリア性積層フィルムの製造方法及びガスバリア性積層フィルム |
WO2005023714A1 (ja) * | 2003-09-08 | 2005-03-17 | National Institute Of Advanced Industrial Science And Technology | 粘土膜 |
Also Published As
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US20090233083A1 (en) | 2009-09-17 |
KR20080106162A (ko) | 2008-12-04 |
KR101446811B1 (ko) | 2014-10-01 |
TW200744838A (en) | 2007-12-16 |
EP2030779A4 (en) | 2015-05-27 |
WO2007114289A1 (ja) | 2007-10-11 |
EP2030779A1 (en) | 2009-03-04 |
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