TWI422452B - Adjustment device, laser processing device, adjustment method and adjustment program - Google Patents
Adjustment device, laser processing device, adjustment method and adjustment program Download PDFInfo
- Publication number
- TWI422452B TWI422452B TW097134855A TW97134855A TWI422452B TW I422452 B TWI422452 B TW I422452B TW 097134855 A TW097134855 A TW 097134855A TW 97134855 A TW97134855 A TW 97134855A TW I422452 B TWI422452 B TW I422452B
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- Taiwan
- Prior art keywords
- pattern
- image
- calibration
- adjustment
- light
- Prior art date
Links
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- 238000002360 preparation method Methods 0.000 claims description 11
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- 230000009466 transformation Effects 0.000 description 48
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/044—Seam tracking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
- G01B11/164—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means by holographic interferometry
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G2215/00—Apparatus for electrophotographic processes
- G03G2215/04—Arrangements for exposing and producing an image
- G03G2215/0402—Exposure devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007258141A JP5090121B2 (ja) | 2007-10-01 | 2007-10-01 | 調整装置、レーザ加工装置、調整方法、および調整プログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200916248A TW200916248A (en) | 2009-04-16 |
| TWI422452B true TWI422452B (zh) | 2014-01-11 |
Family
ID=40537886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097134855A TWI422452B (zh) | 2007-10-01 | 2008-09-11 | Adjustment device, laser processing device, adjustment method and adjustment program |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5090121B2 (https=) |
| KR (1) | KR101513107B1 (https=) |
| CN (1) | CN101403822A (https=) |
| TW (1) | TWI422452B (https=) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5451238B2 (ja) * | 2009-08-03 | 2014-03-26 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP5791908B2 (ja) * | 2011-01-18 | 2015-10-07 | オリンパス株式会社 | 調整装置、レーザ加工装置および調整方法 |
| KR101310452B1 (ko) * | 2011-08-25 | 2013-09-24 | 삼성전기주식회사 | 어레이 타입 공간변조기를 이용한 레이저가공방법 |
| US20130140286A1 (en) * | 2011-12-06 | 2013-06-06 | Herbert Chidsey Roberts, III | Systems and methods for internal cavity formation using laser manipulation |
| CN102879905B (zh) * | 2012-09-13 | 2015-10-28 | 北京国科世纪激光技术有限公司 | 一种用于观察光斑方位变换的装置和光束整形方法 |
| JP6128822B2 (ja) | 2012-12-05 | 2017-05-17 | オリンパス株式会社 | 光学装置 |
| KR102117608B1 (ko) * | 2013-08-14 | 2020-06-02 | 삼성디스플레이 주식회사 | 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법 |
| US10618131B2 (en) | 2014-06-05 | 2020-04-14 | Nlight, Inc. | Laser patterning skew correction |
| DE102014213518A1 (de) * | 2014-07-11 | 2016-01-14 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren, Bearbeitungsmaschine und Computerprogrammprodukt zum bildbasierten Platzieren von Werkstückbearbeitungsvorgängen |
| JP6620976B2 (ja) * | 2015-09-29 | 2019-12-18 | 株式会社東京精密 | レーザー加工装置及びレーザー加工方法 |
| CN108367389B (zh) | 2015-11-23 | 2020-07-28 | 恩耐公司 | 激光加工方法和装置 |
| US11179807B2 (en) | 2015-11-23 | 2021-11-23 | Nlight, Inc. | Fine-scale temporal control for laser material processing |
| JP6689631B2 (ja) * | 2016-03-10 | 2020-04-28 | 浜松ホトニクス株式会社 | レーザ光照射装置及びレーザ光照射方法 |
| WO2017155104A1 (ja) * | 2016-03-10 | 2017-09-14 | 浜松ホトニクス株式会社 | レーザ光照射装置及びレーザ光照射方法 |
| JP7186695B2 (ja) | 2016-09-29 | 2022-12-09 | エヌライト，インコーポレーテッド | 調節可能なビーム特性 |
| JP6768444B2 (ja) * | 2016-10-14 | 2020-10-14 | 浜松ホトニクス株式会社 | レーザ加工装置、及び、動作確認方法 |
| KR102611837B1 (ko) * | 2017-04-04 | 2023-12-07 | 엔라이트 인크. | 검류계 스캐너 보정을 위한 광학 기준 생성 |
| CN107186364B (zh) * | 2017-07-11 | 2024-02-02 | 华侨大学 | 无机械运动实现精确激光切割轨迹和显微细胞切割方法 |
| US10794838B2 (en) * | 2017-07-21 | 2020-10-06 | Isvision (Tianjin) Technology Co., Ltd | Method and device for detecting defect of cover lens in laser welding system on automobile production line |
| JP7105639B2 (ja) * | 2018-07-05 | 2022-07-25 | 浜松ホトニクス株式会社 | レーザ加工装置 |
| JP7283918B2 (ja) * | 2019-02-20 | 2023-05-30 | 株式会社ディスコ | 加工装置 |
| CN110497088B (zh) * | 2019-08-31 | 2020-05-19 | 大连理工大学 | 基于曲面映射的柔性共形天线激光加工误差控制方法 |
| CN113290313B (zh) * | 2020-02-19 | 2023-10-31 | 深圳市创客工场科技有限公司 | 激光加工控制方法、装置及激光加工设备 |
| JP7566640B2 (ja) * | 2021-01-04 | 2024-10-15 | 株式会社東芝 | 処理装置、溶接システム、処理方法、プログラム、及び記憶媒体 |
| CN114289858B (zh) * | 2021-11-18 | 2023-07-07 | 富联裕展科技(深圳)有限公司 | 调试和监控方法、装置、设备及计算机可读存储介质 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002001562A (ja) * | 2000-06-16 | 2002-01-08 | Ricoh Microelectronics Co Ltd | 光加工方法及びその装置並びに記録媒体 |
| JP2004109565A (ja) * | 2002-09-19 | 2004-04-08 | Olympus Corp | 標本観察システム及び標本観察システムの調整方法 |
| TWI279278B (en) * | 2006-01-13 | 2007-04-21 | Hs Comp Co Ltd | Method of edge-directed cutting fabric with laser |
| JP2008279470A (ja) * | 2007-05-08 | 2008-11-20 | Sony Corp | レーザ加工装置の較正方法及びレーザ加工装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3180194B2 (ja) * | 1991-07-25 | 2001-06-25 | 日立ビアメカニクス株式会社 | レーザ加工機 |
| JP2823750B2 (ja) * | 1992-09-02 | 1998-11-11 | 三菱電機株式会社 | レーザマーキング装置 |
-
2007
- 2007-10-01 JP JP2007258141A patent/JP5090121B2/ja not_active Expired - Fee Related
-
2008
- 2008-09-11 TW TW097134855A patent/TWI422452B/zh not_active IP Right Cessation
- 2008-09-28 CN CNA2008101669582A patent/CN101403822A/zh active Pending
- 2008-10-01 KR KR1020080096603A patent/KR101513107B1/ko not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002001562A (ja) * | 2000-06-16 | 2002-01-08 | Ricoh Microelectronics Co Ltd | 光加工方法及びその装置並びに記録媒体 |
| JP2004109565A (ja) * | 2002-09-19 | 2004-04-08 | Olympus Corp | 標本観察システム及び標本観察システムの調整方法 |
| TWI279278B (en) * | 2006-01-13 | 2007-04-21 | Hs Comp Co Ltd | Method of edge-directed cutting fabric with laser |
| JP2008279470A (ja) * | 2007-05-08 | 2008-11-20 | Sony Corp | レーザ加工装置の較正方法及びレーザ加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009082966A (ja) | 2009-04-23 |
| KR20090033817A (ko) | 2009-04-06 |
| CN101403822A (zh) | 2009-04-08 |
| JP5090121B2 (ja) | 2012-12-05 |
| KR101513107B1 (ko) | 2015-04-17 |
| TW200916248A (en) | 2009-04-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |