KR101513107B1 - 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램 - Google Patents

조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램 Download PDF

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Publication number
KR101513107B1
KR101513107B1 KR1020080096603A KR20080096603A KR101513107B1 KR 101513107 B1 KR101513107 B1 KR 101513107B1 KR 1020080096603 A KR1020080096603 A KR 1020080096603A KR 20080096603 A KR20080096603 A KR 20080096603A KR 101513107 B1 KR101513107 B1 KR 101513107B1
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South Korea
Prior art keywords
pattern
image
calibration
light
irradiation
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KR1020080096603A
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English (en)
Korean (ko)
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KR20090033817A (ko
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류이치 야마자키
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올림푸스 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044—Seam tracking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
    • G01B11/164—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means by holographic interferometry
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/04—Arrangements for exposing and producing an image
    • G03G2215/0402—Exposure devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
KR1020080096603A 2007-10-01 2008-10-01 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램 Expired - Fee Related KR101513107B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007258141A JP5090121B2 (ja) 2007-10-01 2007-10-01 調整装置、レーザ加工装置、調整方法、および調整プログラム
JPJP-P-2007-258141 2007-10-01

Publications (2)

Publication Number Publication Date
KR20090033817A KR20090033817A (ko) 2009-04-06
KR101513107B1 true KR101513107B1 (ko) 2015-04-17

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KR1020080096603A Expired - Fee Related KR101513107B1 (ko) 2007-10-01 2008-10-01 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램

Country Status (4)

Country Link
JP (1) JP5090121B2 (https=)
KR (1) KR101513107B1 (https=)
CN (1) CN101403822A (https=)
TW (1) TWI422452B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5451238B2 (ja) * 2009-08-03 2014-03-26 浜松ホトニクス株式会社 レーザ加工方法
JP5791908B2 (ja) * 2011-01-18 2015-10-07 オリンパス株式会社 調整装置、レーザ加工装置および調整方法
KR101310452B1 (ko) * 2011-08-25 2013-09-24 삼성전기주식회사 어레이 타입 공간변조기를 이용한 레이저가공방법
US20130140286A1 (en) * 2011-12-06 2013-06-06 Herbert Chidsey Roberts, III Systems and methods for internal cavity formation using laser manipulation
CN102879905B (zh) * 2012-09-13 2015-10-28 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
JP6128822B2 (ja) 2012-12-05 2017-05-17 オリンパス株式会社 光学装置
KR102117608B1 (ko) * 2013-08-14 2020-06-02 삼성디스플레이 주식회사 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법
US10618131B2 (en) 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
DE102014213518A1 (de) * 2014-07-11 2016-01-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren, Bearbeitungsmaschine und Computerprogrammprodukt zum bildbasierten Platzieren von Werkstückbearbeitungsvorgängen
JP6620976B2 (ja) * 2015-09-29 2019-12-18 株式会社東京精密 レーザー加工装置及びレーザー加工方法
CN108367389B (zh) 2015-11-23 2020-07-28 恩耐公司 激光加工方法和装置
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
JP6689631B2 (ja) * 2016-03-10 2020-04-28 浜松ホトニクス株式会社 レーザ光照射装置及びレーザ光照射方法
WO2017155104A1 (ja) * 2016-03-10 2017-09-14 浜松ホトニクス株式会社 レーザ光照射装置及びレーザ光照射方法
JP7186695B2 (ja) 2016-09-29 2022-12-09 エヌライト，インコーポレーテッド 調節可能なビーム特性
JP6768444B2 (ja) * 2016-10-14 2020-10-14 浜松ホトニクス株式会社 レーザ加工装置、及び、動作確認方法
KR102611837B1 (ko) * 2017-04-04 2023-12-07 엔라이트 인크. 검류계 스캐너 보정을 위한 광학 기준 생성
CN107186364B (zh) * 2017-07-11 2024-02-02 华侨大学 无机械运动实现精确激光切割轨迹和显微细胞切割方法
US10794838B2 (en) * 2017-07-21 2020-10-06 Isvision (Tianjin) Technology Co., Ltd Method and device for detecting defect of cover lens in laser welding system on automobile production line
JP7105639B2 (ja) * 2018-07-05 2022-07-25 浜松ホトニクス株式会社 レーザ加工装置
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
CN110497088B (zh) * 2019-08-31 2020-05-19 大连理工大学 基于曲面映射的柔性共形天线激光加工误差控制方法
CN113290313B (zh) * 2020-02-19 2023-10-31 深圳市创客工场科技有限公司 激光加工控制方法、装置及激光加工设备
JP7566640B2 (ja) * 2021-01-04 2024-10-15 株式会社東芝 処理装置、溶接システム、処理方法、プログラム、及び記憶媒体
CN114289858B (zh) * 2021-11-18 2023-07-07 富联裕展科技(深圳)有限公司 调试和监控方法、装置、设备及计算机可读存储介质

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* Cited by examiner, † Cited by third party
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JP3180194B2 (ja) * 1991-07-25 2001-06-25 日立ビアメカニクス株式会社 レーザ加工機
JP2823750B2 (ja) * 1992-09-02 1998-11-11 三菱電機株式会社 レーザマーキング装置
JP2002001562A (ja) * 2000-06-16 2002-01-08 Ricoh Microelectronics Co Ltd 光加工方法及びその装置並びに記録媒体
JP2004109565A (ja) * 2002-09-19 2004-04-08 Olympus Corp 標本観察システム及び標本観察システムの調整方法
TWI279278B (en) * 2006-01-13 2007-04-21 Hs Comp Co Ltd Method of edge-directed cutting fabric with laser
JP5119728B2 (ja) * 2007-05-08 2013-01-16 ソニー株式会社 レーザ加工装置の較正方法及びレーザ加工装置

Also Published As

Publication number Publication date
JP2009082966A (ja) 2009-04-23
KR20090033817A (ko) 2009-04-06
TWI422452B (zh) 2014-01-11
CN101403822A (zh) 2009-04-08
JP5090121B2 (ja) 2012-12-05
TW200916248A (en) 2009-04-16

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