JP5090121B2 - 調整装置、レーザ加工装置、調整方法、および調整プログラム - Google Patents

調整装置、レーザ加工装置、調整方法、および調整プログラム Download PDF

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Publication number
JP5090121B2
JP5090121B2 JP2007258141A JP2007258141A JP5090121B2 JP 5090121 B2 JP5090121 B2 JP 5090121B2 JP 2007258141 A JP2007258141 A JP 2007258141A JP 2007258141 A JP2007258141 A JP 2007258141A JP 5090121 B2 JP5090121 B2 JP 5090121B2
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JP
Japan
Prior art keywords
pattern
calibration
image
adjustment
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007258141A
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English (en)
Japanese (ja)
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JP2009082966A5 (https=
JP2009082966A (ja
Inventor
隆一 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2007258141A priority Critical patent/JP5090121B2/ja
Priority to TW097134855A priority patent/TWI422452B/zh
Priority to CNA2008101669582A priority patent/CN101403822A/zh
Priority to KR1020080096603A priority patent/KR101513107B1/ko
Publication of JP2009082966A publication Critical patent/JP2009082966A/ja
Publication of JP2009082966A5 publication Critical patent/JP2009082966A5/ja
Application granted granted Critical
Publication of JP5090121B2 publication Critical patent/JP5090121B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044—Seam tracking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
    • G01B11/164—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means by holographic interferometry
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/04—Arrangements for exposing and producing an image
    • G03G2215/0402—Exposure devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
JP2007258141A 2007-10-01 2007-10-01 調整装置、レーザ加工装置、調整方法、および調整プログラム Expired - Fee Related JP5090121B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007258141A JP5090121B2 (ja) 2007-10-01 2007-10-01 調整装置、レーザ加工装置、調整方法、および調整プログラム
TW097134855A TWI422452B (zh) 2007-10-01 2008-09-11 Adjustment device, laser processing device, adjustment method and adjustment program
CNA2008101669582A CN101403822A (zh) 2007-10-01 2008-09-28 调整装置、激光加工装置、调整方法以及调整程序
KR1020080096603A KR101513107B1 (ko) 2007-10-01 2008-10-01 조정 장치, 레이저 가공 장치, 조정 방법, 및 조정 프로그램

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007258141A JP5090121B2 (ja) 2007-10-01 2007-10-01 調整装置、レーザ加工装置、調整方法、および調整プログラム

Publications (3)

Publication Number Publication Date
JP2009082966A JP2009082966A (ja) 2009-04-23
JP2009082966A5 JP2009082966A5 (https=) 2010-11-11
JP5090121B2 true JP5090121B2 (ja) 2012-12-05

Family

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Family Applications (1)

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JP2007258141A Expired - Fee Related JP5090121B2 (ja) 2007-10-01 2007-10-01 調整装置、レーザ加工装置、調整方法、および調整プログラム

Country Status (4)

Country Link
JP (1) JP5090121B2 (https=)
KR (1) KR101513107B1 (https=)
CN (1) CN101403822A (https=)
TW (1) TWI422452B (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5451238B2 (ja) * 2009-08-03 2014-03-26 浜松ホトニクス株式会社 レーザ加工方法
JP5791908B2 (ja) * 2011-01-18 2015-10-07 オリンパス株式会社 調整装置、レーザ加工装置および調整方法
KR101310452B1 (ko) * 2011-08-25 2013-09-24 삼성전기주식회사 어레이 타입 공간변조기를 이용한 레이저가공방법
US20130140286A1 (en) * 2011-12-06 2013-06-06 Herbert Chidsey Roberts, III Systems and methods for internal cavity formation using laser manipulation
CN102879905B (zh) * 2012-09-13 2015-10-28 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
JP6128822B2 (ja) 2012-12-05 2017-05-17 オリンパス株式会社 光学装置
KR102117608B1 (ko) * 2013-08-14 2020-06-02 삼성디스플레이 주식회사 밀봉 장치, 밀봉 장치를 포함하는 기판 밀봉 장치 및 기판 밀봉 방법
US10618131B2 (en) 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
DE102014213518A1 (de) * 2014-07-11 2016-01-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren, Bearbeitungsmaschine und Computerprogrammprodukt zum bildbasierten Platzieren von Werkstückbearbeitungsvorgängen
JP6620976B2 (ja) * 2015-09-29 2019-12-18 株式会社東京精密 レーザー加工装置及びレーザー加工方法
CN108367389B (zh) 2015-11-23 2020-07-28 恩耐公司 激光加工方法和装置
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
JP6689631B2 (ja) * 2016-03-10 2020-04-28 浜松ホトニクス株式会社 レーザ光照射装置及びレーザ光照射方法
WO2017155104A1 (ja) * 2016-03-10 2017-09-14 浜松ホトニクス株式会社 レーザ光照射装置及びレーザ光照射方法
JP7186695B2 (ja) 2016-09-29 2022-12-09 エヌライト，インコーポレーテッド 調節可能なビーム特性
JP6768444B2 (ja) * 2016-10-14 2020-10-14 浜松ホトニクス株式会社 レーザ加工装置、及び、動作確認方法
KR102611837B1 (ko) * 2017-04-04 2023-12-07 엔라이트 인크. 검류계 스캐너 보정을 위한 광학 기준 생성
CN107186364B (zh) * 2017-07-11 2024-02-02 华侨大学 无机械运动实现精确激光切割轨迹和显微细胞切割方法
US10794838B2 (en) * 2017-07-21 2020-10-06 Isvision (Tianjin) Technology Co., Ltd Method and device for detecting defect of cover lens in laser welding system on automobile production line
JP7105639B2 (ja) * 2018-07-05 2022-07-25 浜松ホトニクス株式会社 レーザ加工装置
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
CN110497088B (zh) * 2019-08-31 2020-05-19 大连理工大学 基于曲面映射的柔性共形天线激光加工误差控制方法
CN113290313B (zh) * 2020-02-19 2023-10-31 深圳市创客工场科技有限公司 激光加工控制方法、装置及激光加工设备
JP7566640B2 (ja) * 2021-01-04 2024-10-15 株式会社東芝 処理装置、溶接システム、処理方法、プログラム、及び記憶媒体
CN114289858B (zh) * 2021-11-18 2023-07-07 富联裕展科技(深圳)有限公司 调试和监控方法、装置、设备及计算机可读存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180194B2 (ja) * 1991-07-25 2001-06-25 日立ビアメカニクス株式会社 レーザ加工機
JP2823750B2 (ja) * 1992-09-02 1998-11-11 三菱電機株式会社 レーザマーキング装置
JP2002001562A (ja) * 2000-06-16 2002-01-08 Ricoh Microelectronics Co Ltd 光加工方法及びその装置並びに記録媒体
JP2004109565A (ja) * 2002-09-19 2004-04-08 Olympus Corp 標本観察システム及び標本観察システムの調整方法
TWI279278B (en) * 2006-01-13 2007-04-21 Hs Comp Co Ltd Method of edge-directed cutting fabric with laser
JP5119728B2 (ja) * 2007-05-08 2013-01-16 ソニー株式会社 レーザ加工装置の較正方法及びレーザ加工装置

Also Published As

Publication number Publication date
JP2009082966A (ja) 2009-04-23
KR20090033817A (ko) 2009-04-06
TWI422452B (zh) 2014-01-11
CN101403822A (zh) 2009-04-08
KR101513107B1 (ko) 2015-04-17
TW200916248A (en) 2009-04-16

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