CN101403822A - 调整装置、激光加工装置、调整方法以及调整程序 - Google Patents

调整装置、激光加工装置、调整方法以及调整程序 Download PDF

Info

Publication number
CN101403822A
CN101403822A CNA2008101669582A CN200810166958A CN101403822A CN 101403822 A CN101403822 A CN 101403822A CN A2008101669582 A CNA2008101669582 A CN A2008101669582A CN 200810166958 A CN200810166958 A CN 200810166958A CN 101403822 A CN101403822 A CN 101403822A
Authority
CN
China
Prior art keywords
mentioned
pattern
laser
image
irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101669582A
Other languages
English (en)
Chinese (zh)
Inventor
山崎隆一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of CN101403822A publication Critical patent/CN101403822A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044Seam tracking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/14Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/16Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G01B11/161Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
    • G01B11/164Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means by holographic interferometry
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00Apparatus for electrophotographic processes
    • G03G2215/04Arrangements for exposing and producing an image
    • G03G2215/0402Exposure devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
CNA2008101669582A 2007-10-01 2008-09-28 调整装置、激光加工装置、调整方法以及调整程序 Pending CN101403822A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007258141A JP5090121B2 (ja) 2007-10-01 2007-10-01 調整装置、レーザ加工装置、調整方法、および調整プログラム
JP2007258141 2007-10-01

Publications (1)

Publication Number Publication Date
CN101403822A true CN101403822A (zh) 2009-04-08

Family

ID=40537886

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008101669582A Pending CN101403822A (zh) 2007-10-01 2008-09-28 调整装置、激光加工装置、调整方法以及调整程序

Country Status (4)

Country Link
JP (1) JP5090121B2 (https=)
KR (1) KR101513107B1 (https=)
CN (1) CN101403822A (https=)
TW (1) TWI422452B (https=)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102879905A (zh) * 2012-09-13 2013-01-16 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
CN103143840A (zh) * 2011-12-06 2013-06-12 通用电气公司 用于利用激光操作形成内部空腔的系统和方法
CN104377148A (zh) * 2013-08-14 2015-02-25 三星显示有限公司 密封设备及基底密封方法
CN107643296A (zh) * 2017-07-21 2018-01-30 易思维(天津)科技有限公司 用于汽车生产线上激光焊保护镜片的缺陷检测方法和装置
CN108712938A (zh) * 2016-03-10 2018-10-26 浜松光子学株式会社 激光照射装置及激光照射方法
CN110497088A (zh) * 2019-08-31 2019-11-26 大连理工大学 基于曲面映射的柔性共形天线激光加工误差控制方法
CN110651218A (zh) * 2017-04-04 2020-01-03 恩耐公司 用于检流计扫描仪校准的光学基准生成
CN113290313A (zh) * 2020-02-19 2021-08-24 深圳市创客工场科技有限公司 激光加工控制方法、装置及激光加工设备
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
CN114289858A (zh) * 2021-11-18 2022-04-08 深圳市裕展精密科技有限公司 调试和监控方法、装置、设备及计算机可读存储介质
US11331756B2 (en) 2015-11-23 2022-05-17 Nlight, Inc. Fine-scale temporal control for laser material processing
US11465232B2 (en) 2014-06-05 2022-10-11 Nlight, Inc. Laser patterning skew correction
US11886052B2 (en) 2016-09-29 2024-01-30 Nlight, Inc Adjustable beam characteristics

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5451238B2 (ja) * 2009-08-03 2014-03-26 浜松ホトニクス株式会社 レーザ加工方法
JP5791908B2 (ja) * 2011-01-18 2015-10-07 オリンパス株式会社 調整装置、レーザ加工装置および調整方法
KR101310452B1 (ko) * 2011-08-25 2013-09-24 삼성전기주식회사 어레이 타입 공간변조기를 이용한 레이저가공방법
JP6128822B2 (ja) 2012-12-05 2017-05-17 オリンパス株式会社 光学装置
DE102014213518A1 (de) * 2014-07-11 2016-01-14 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren, Bearbeitungsmaschine und Computerprogrammprodukt zum bildbasierten Platzieren von Werkstückbearbeitungsvorgängen
JP6620976B2 (ja) * 2015-09-29 2019-12-18 株式会社東京精密 レーザー加工装置及びレーザー加工方法
JP6689631B2 (ja) * 2016-03-10 2020-04-28 浜松ホトニクス株式会社 レーザ光照射装置及びレーザ光照射方法
JP6768444B2 (ja) * 2016-10-14 2020-10-14 浜松ホトニクス株式会社 レーザ加工装置、及び、動作確認方法
CN107186364B (zh) * 2017-07-11 2024-02-02 华侨大学 无机械运动实现精确激光切割轨迹和显微细胞切割方法
JP7105639B2 (ja) * 2018-07-05 2022-07-25 浜松ホトニクス株式会社 レーザ加工装置
JP7283918B2 (ja) * 2019-02-20 2023-05-30 株式会社ディスコ 加工装置
JP7566640B2 (ja) * 2021-01-04 2024-10-15 株式会社東芝 処理装置、溶接システム、処理方法、プログラム、及び記憶媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3180194B2 (ja) * 1991-07-25 2001-06-25 日立ビアメカニクス株式会社 レーザ加工機
JP2823750B2 (ja) * 1992-09-02 1998-11-11 三菱電機株式会社 レーザマーキング装置
JP2002001562A (ja) * 2000-06-16 2002-01-08 Ricoh Microelectronics Co Ltd 光加工方法及びその装置並びに記録媒体
JP2004109565A (ja) * 2002-09-19 2004-04-08 Olympus Corp 標本観察システム及び標本観察システムの調整方法
TWI279278B (en) * 2006-01-13 2007-04-21 Hs Comp Co Ltd Method of edge-directed cutting fabric with laser
JP5119728B2 (ja) * 2007-05-08 2013-01-16 ソニー株式会社 レーザ加工装置の較正方法及びレーザ加工装置

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103143840A (zh) * 2011-12-06 2013-06-12 通用电气公司 用于利用激光操作形成内部空腔的系统和方法
CN102879905A (zh) * 2012-09-13 2013-01-16 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
CN102879905B (zh) * 2012-09-13 2015-10-28 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
CN104377148A (zh) * 2013-08-14 2015-02-25 三星显示有限公司 密封设备及基底密封方法
CN104377148B (zh) * 2013-08-14 2018-10-19 三星显示有限公司 密封设备及基底密封方法
US11465232B2 (en) 2014-06-05 2022-10-11 Nlight, Inc. Laser patterning skew correction
US11331756B2 (en) 2015-11-23 2022-05-17 Nlight, Inc. Fine-scale temporal control for laser material processing
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
US11794282B2 (en) 2015-11-23 2023-10-24 Nlight, Inc. Fine-scale temporal control for laser material processing
CN108712938A (zh) * 2016-03-10 2018-10-26 浜松光子学株式会社 激光照射装置及激光照射方法
US11471976B2 (en) * 2016-03-10 2022-10-18 Hamamatsu Photonics K.K. Laser light radiation device and laser light radiation method
CN108712938B (zh) * 2016-03-10 2021-06-25 浜松光子学株式会社 激光照射装置及激光照射方法
US11886052B2 (en) 2016-09-29 2024-01-30 Nlight, Inc Adjustable beam characteristics
US12591144B2 (en) 2017-04-04 2026-03-31 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration
US11173548B2 (en) 2017-04-04 2021-11-16 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration
CN110651218A (zh) * 2017-04-04 2020-01-03 恩耐公司 用于检流计扫描仪校准的光学基准生成
US10794838B2 (en) 2017-07-21 2020-10-06 Isvision (Tianjin) Technology Co., Ltd Method and device for detecting defect of cover lens in laser welding system on automobile production line
CN107643296A (zh) * 2017-07-21 2018-01-30 易思维(天津)科技有限公司 用于汽车生产线上激光焊保护镜片的缺陷检测方法和装置
CN110497088A (zh) * 2019-08-31 2019-11-26 大连理工大学 基于曲面映射的柔性共形天线激光加工误差控制方法
CN113290313B (zh) * 2020-02-19 2023-10-31 深圳市创客工场科技有限公司 激光加工控制方法、装置及激光加工设备
CN113290313A (zh) * 2020-02-19 2021-08-24 深圳市创客工场科技有限公司 激光加工控制方法、装置及激光加工设备
CN114289858B (zh) * 2021-11-18 2023-07-07 富联裕展科技(深圳)有限公司 调试和监控方法、装置、设备及计算机可读存储介质
CN114289858A (zh) * 2021-11-18 2022-04-08 深圳市裕展精密科技有限公司 调试和监控方法、装置、设备及计算机可读存储介质

Also Published As

Publication number Publication date
JP2009082966A (ja) 2009-04-23
KR20090033817A (ko) 2009-04-06
TWI422452B (zh) 2014-01-11
JP5090121B2 (ja) 2012-12-05
KR101513107B1 (ko) 2015-04-17
TW200916248A (en) 2009-04-16

Similar Documents

Publication Publication Date Title
CN101403822A (zh) 调整装置、激光加工装置、调整方法以及调整程序
KR20120083854A (ko) 조정 장치, 레이저 가공 장치 및 조정 방법
US8363209B2 (en) Method and apparatus to adjust misalignment of the maskless exposure apparatus
CN101960253B (zh) 三维形状测量装置及测量方法
CN100578512C (zh) 半导体图形形状评价装置及形状评价方法
US7872745B2 (en) Pattern inspection apparatus and pattern inspection method
CN114022370A (zh) 一种振镜激光加工畸变校正方法及系统
US9329504B2 (en) Method of aligning an exposure apparatus, method of exposing a photoresist film using the same and exposure apparatus for performing the method of exposing a photoresist film
CN101548295A (zh) 晶片收纳盒检查装置及方法
JP4988000B2 (ja) パターン検査装置及びパターン検査方法
JP2012002676A (ja) マスク欠陥検査装置およびマスク欠陥検査方法
JP7082927B2 (ja) 露光装置
TWM603399U (zh) 可校正振鏡打標偏移的雷射打標系統
WO2021053852A1 (ja) 外観検査装置、外観検査装置の較正方法及びプログラム
JP2008154195A (ja) レンズのキャリブレーション用パターン作成方法、レンズのキャリブレーション用パターン、キャリブレーション用パターンを利用したレンズのキャリブレーション方法、レンズのキャリブレーション装置、撮像装置のキャリブレーション方法、および撮像装置のキャリブレーション装置
KR102080506B1 (ko) 광학 3d 스캐너
CN115698681B (zh) 检查系统以及检查方法
JP3501661B2 (ja) 液晶表示パネルの検査方法および検査装置
JP7318190B2 (ja) 形状測定装置、形状測定方法及び形状測定プログラム
JP4916280B2 (ja) 自動キャリブレーション装置、及びキャリブレーション方法
TWI831264B (zh) 描繪裝置、描繪方法以及記錄了程式的程式產品
US20020159073A1 (en) Range-image-based method and system for automatic sensor planning
CN112838018B (zh) 光学量测方法
Pieters et al. Product pattern-based camera calibration for microrobotics
TW202414106A (zh) 模板生成裝置、描繪系統、模板生成方法以及電腦可讀取的程式

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20090408