TWI420240B - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

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Publication number
TWI420240B
TWI420240B TW100110783A TW100110783A TWI420240B TW I420240 B TWI420240 B TW I420240B TW 100110783 A TW100110783 A TW 100110783A TW 100110783 A TW100110783 A TW 100110783A TW I420240 B TWI420240 B TW I420240B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
group
compound
resin
manufactured
Prior art date
Application number
TW100110783A
Other languages
English (en)
Chinese (zh)
Other versions
TW201211680A (en
Inventor
Nobuhito Ito
Kazuyoshi Yoneda
Masao Arima
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201211680A publication Critical patent/TW201211680A/zh
Application granted granted Critical
Publication of TWI420240B publication Critical patent/TWI420240B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
    • C08G2261/342—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms
    • C08G2261/3424—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms non-conjugated, e.g. paracyclophanes or xylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW100110783A 2010-03-31 2011-03-29 Photosensitive resin composition TWI420240B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010083420A JP5439254B2 (ja) 2010-03-31 2010-03-31 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
TW201211680A TW201211680A (en) 2012-03-16
TWI420240B true TWI420240B (zh) 2013-12-21

Family

ID=44711783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100110783A TWI420240B (zh) 2010-03-31 2011-03-29 Photosensitive resin composition

Country Status (5)

Country Link
JP (1) JP5439254B2 (ja)
KR (1) KR101406441B1 (ja)
CN (1) CN102792226B (ja)
TW (1) TWI420240B (ja)
WO (1) WO2011122028A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745425B (zh) * 2016-09-28 2021-11-11 日商味之素股份有限公司 樹脂組成物

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5611769B2 (ja) * 2010-10-29 2014-10-22 株式会社カネカ 新規な白色感光性樹脂組成物及びその利用
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
JP5615415B2 (ja) * 2012-09-28 2014-10-29 太陽インキ製造株式会社 硬化性樹脂組成物、ソルダーレジスト形成用組成物、ドライフィルムおよびプリント配線板、並びに積層構造体及びその製造方法
JP5514356B2 (ja) * 2012-09-28 2014-06-04 太陽インキ製造株式会社 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法
JP5514355B2 (ja) * 2012-09-28 2014-06-04 太陽インキ製造株式会社 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法
EP2851391A1 (en) * 2013-09-23 2015-03-25 Anheuser-Busch InBev S.A. Thermoplastic polyester having enhanced barrier and impact properties
CN104516201A (zh) * 2013-09-30 2015-04-15 太阳油墨（苏州）有限公司 光固化性树脂组合物、干膜和固化物、以及印刷电路板
TWI536103B (zh) * 2014-05-08 2016-06-01 達興材料股份有限公司 感光性樹脂組合物、固化膜和電子元件
CN106462063A (zh) * 2014-06-12 2017-02-22 Dic株式会社 永久膜用感光性组合物、抗蚀材料及涂膜
KR101788090B1 (ko) * 2014-11-28 2017-11-15 삼성에스디아이 주식회사 중합체, 유기막 조성물, 유기막, 및 패턴형성방법
JP6594054B2 (ja) * 2015-06-18 2019-10-23 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102324203B1 (ko) * 2016-09-06 2021-11-10 가부시끼가이샤 쓰리본드 경화성 수지 조성물, 그것을 이용한 연료 전지 및 밀봉 방법
CN110527407B (zh) * 2019-08-08 2021-08-24 江西阪桥感光科技有限公司 一种低卤低硫感光阻焊材料及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030215746A1 (en) * 2000-09-20 2003-11-20 Noboru Kohiyama Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof
JP2007063339A (ja) * 2005-08-30 2007-03-15 Sumitomo Bakelite Co Ltd ビフェニルアラルキル変性フェノール樹脂及びその製造方法、これを含むエポキシ樹脂成形材料。
JP2009008921A (ja) * 2007-06-28 2009-01-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03249653A (ja) * 1990-02-27 1991-11-07 Konica Corp 感光性組成物
JP3731979B2 (ja) * 1997-07-29 2006-01-05 新中村化学工業株式会社 カリックスアレーン誘導体及びそれを含有する硬化性樹脂組成物
JP2005300785A (ja) * 2004-04-09 2005-10-27 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びその硬化塗膜
JP2008304849A (ja) * 2007-06-11 2008-12-18 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、および、プリント配線板の製造方法
JP5319132B2 (ja) * 2008-02-06 2013-10-16 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP5301915B2 (ja) * 2008-08-07 2013-09-25 太陽ホールディングス株式会社 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5043775B2 (ja) * 2008-08-07 2012-10-10 太陽ホールディングス株式会社 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030215746A1 (en) * 2000-09-20 2003-11-20 Noboru Kohiyama Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof
JP2007063339A (ja) * 2005-08-30 2007-03-15 Sumitomo Bakelite Co Ltd ビフェニルアラルキル変性フェノール樹脂及びその製造方法、これを含むエポキシ樹脂成形材料。
JP2009008921A (ja) * 2007-06-28 2009-01-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745425B (zh) * 2016-09-28 2021-11-11 日商味之素股份有限公司 樹脂組成物

Also Published As

Publication number Publication date
CN102792226B (zh) 2014-07-09
KR20120123549A (ko) 2012-11-08
CN102792226A (zh) 2012-11-21
WO2011122028A1 (ja) 2011-10-06
JP5439254B2 (ja) 2014-03-12
JP2011215375A (ja) 2011-10-27
TW201211680A (en) 2012-03-16
KR101406441B1 (ko) 2014-06-13

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