TWI415897B - Polyimide polysiloxane resin composition - Google Patents

Polyimide polysiloxane resin composition Download PDF

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Publication number
TWI415897B
TWI415897B TW096120176A TW96120176A TWI415897B TW I415897 B TWI415897 B TW I415897B TW 096120176 A TW096120176 A TW 096120176A TW 96120176 A TW96120176 A TW 96120176A TW I415897 B TWI415897 B TW I415897B
Authority
TW
Taiwan
Prior art keywords
group
bis
tetracarboxylic acid
component
compound
Prior art date
Application number
TW096120176A
Other languages
English (en)
Chinese (zh)
Other versions
TW200804518A (en
Inventor
Nobuhiro Ichiroku
Akio Yokoo
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200804518A publication Critical patent/TW200804518A/zh
Application granted granted Critical
Publication of TWI415897B publication Critical patent/TWI415897B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW096120176A 2006-06-06 2007-06-05 Polyimide polysiloxane resin composition TWI415897B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006157081A JP4772593B2 (ja) 2006-06-06 2006-06-06 ポリイミドシリコーン系樹脂組成物

Publications (2)

Publication Number Publication Date
TW200804518A TW200804518A (en) 2008-01-16
TWI415897B true TWI415897B (zh) 2013-11-21

Family

ID=38927592

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120176A TWI415897B (zh) 2006-06-06 2007-06-05 Polyimide polysiloxane resin composition

Country Status (4)

Country Link
JP (1) JP4772593B2 (ja)
KR (1) KR101297940B1 (ja)
CN (1) CN101085868B (ja)
TW (1) TWI415897B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5304106B2 (ja) * 2008-08-28 2013-10-02 三菱化学株式会社 ビスイミドフェノール化合物及びその製造方法
CN102209754B (zh) * 2008-11-10 2013-07-17 味之素株式会社 印刷线路板用树脂组合物
JP5206977B2 (ja) * 2009-03-12 2013-06-12 信越化学工業株式会社 新規ポリイミドシリコーン及びこれを含有する感光性樹脂組成物並びにパターン形成方法
JP5499312B2 (ja) * 2009-09-30 2014-05-21 信越化学工業株式会社 アルコール性水酸基を有する新規のポリイミドシリコーンおよびその製造方法
CN103649174B (zh) * 2011-06-14 2016-02-03 新日铁住金化学株式会社 交联聚酰亚胺树脂、其制造方法、粘接剂树脂组合物、及其应用
CN114032060B (zh) * 2021-11-26 2023-05-02 广东粤港澳大湾区黄埔材料研究院 聚酰亚胺组合物、聚酰亚胺复合物及其制备与应用
CN114181393B (zh) * 2022-01-27 2023-06-02 中国科学院过程工程研究所 一种半脂环聚酰亚胺材料、半脂环聚酰亚胺薄膜及其制备方法和应用
CN115466393B (zh) * 2022-10-19 2023-08-08 开封大学 一种不燃轻质复合材料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01126335A (ja) * 1987-11-12 1989-05-18 Chisso Corp 可溶性イミド基含有シリコン系オリゴマー及びその製造方法
US5473040A (en) * 1993-07-16 1995-12-05 Chisso Corporation Polyimidesiloxane film of low heat-conductivity
JP2004346178A (ja) * 2003-05-22 2004-12-09 Shin Etsu Chem Co Ltd ポリイミドシリコーン系樹脂組成物
US7026382B2 (en) * 2002-04-24 2006-04-11 Shin-Etsu Chemical Co., Ltd. Conductive resin composition
JP2006117710A (ja) * 2004-10-19 2006-05-11 Shin Etsu Chem Co Ltd ポリイミドシリコーン系樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631878B2 (ja) 1988-09-27 1997-07-16 宇部興産株式会社 ポリイミドシロキサン組成物および膜
JP2513096B2 (ja) * 1991-08-15 1996-07-03 信越化学工業株式会社 硬化性化合物、その製造方法、絶縁保護膜形成剤及び電子部品用保護剤
JP2003213129A (ja) 2002-01-29 2003-07-30 Shin Etsu Chem Co Ltd ポリイミドシリコーン系樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01126335A (ja) * 1987-11-12 1989-05-18 Chisso Corp 可溶性イミド基含有シリコン系オリゴマー及びその製造方法
US5473040A (en) * 1993-07-16 1995-12-05 Chisso Corporation Polyimidesiloxane film of low heat-conductivity
US7026382B2 (en) * 2002-04-24 2006-04-11 Shin-Etsu Chemical Co., Ltd. Conductive resin composition
JP2004346178A (ja) * 2003-05-22 2004-12-09 Shin Etsu Chem Co Ltd ポリイミドシリコーン系樹脂組成物
JP2006117710A (ja) * 2004-10-19 2006-05-11 Shin Etsu Chem Co Ltd ポリイミドシリコーン系樹脂組成物

Also Published As

Publication number Publication date
CN101085868A (zh) 2007-12-12
JP4772593B2 (ja) 2011-09-14
TW200804518A (en) 2008-01-16
JP2007326894A (ja) 2007-12-20
KR101297940B1 (ko) 2013-08-19
KR20070116727A (ko) 2007-12-11
CN101085868B (zh) 2011-05-18

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