TWI406879B - Ｃｏｆ安裝用密封劑、及使用該密封劑密封之半導體零件 - Google Patents

Ｃｏｆ安裝用密封劑、及使用該密封劑密封之半導體零件 Download PDF

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Publication number
TWI406879B
TWI406879B TW096117172A TW96117172A TWI406879B TW I406879 B TWI406879 B TW I406879B TW 096117172 A TW096117172 A TW 096117172A TW 96117172 A TW96117172 A TW 96117172A TW I406879 B TWI406879 B TW I406879B
Authority
TW
Taiwan
Prior art keywords
component
sealant
cof
anhydride
epoxy resin
Prior art date
Application number
TW096117172A
Other languages
English (en)
Chinese (zh)
Other versions
TW200745197A (en
Inventor
Hidenori Iida
Toshiyuki Sato
Hiroshi Takasugi
Hiroki Honma
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of TW200745197A publication Critical patent/TW200745197A/zh
Application granted granted Critical
Publication of TWI406879B publication Critical patent/TWI406879B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
TW096117172A 2006-05-15 2007-05-15 Ｃｏｆ安裝用密封劑、及使用該密封劑密封之半導體零件 TWI406879B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006134660 2006-05-15

Publications (2)

Publication Number Publication Date
TW200745197A TW200745197A (en) 2007-12-16
TWI406879B true TWI406879B (zh) 2013-09-01

Family

ID=38693917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117172A TWI406879B (zh) 2006-05-15 2007-05-15 Ｃｏｆ安裝用密封劑、及使用該密封劑密封之半導體零件

Country Status (4)

Country Link
JP (1) JP5317695B2 (ja)
KR (1) KR101373791B1 (ja)
TW (1) TWI406879B (ja)
WO (1) WO2007132827A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5671778B2 (ja) * 2008-03-26 2015-02-18 日立化成株式会社 半導体封止用フィルム状接着剤、半導体装置及びその製造方法
JP5647769B2 (ja) * 2009-05-13 2015-01-07 ナミックス株式会社 Ｃｏｆ封止用樹脂組成物
JP5507162B2 (ja) * 2009-09-01 2014-05-28 京セラケミカル株式会社 電気二重層キャパシタ
WO2011065365A1 (ja) * 2009-11-30 2011-06-03 ナミックス株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP5411774B2 (ja) * 2010-03-30 2014-02-12 ナミックス株式会社 先供給型液状半導体封止樹脂組成物
CN102477290B (zh) * 2010-11-30 2014-01-29 北京华纺高新技术有限公司 一种热敏变色材料微胶囊及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001247654A (ja) * 2000-03-06 2001-09-11 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物及びそれを用いた半導体装置
JP2002302534A (ja) * 2001-01-29 2002-10-18 Ube Ind Ltd Ｃｏｆ実装用アンダ−フィル材および電子部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0931161A (ja) * 1995-07-19 1997-02-04 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
JP2000294894A (ja) * 1998-12-21 2000-10-20 Seiko Epson Corp 回路基板およびその製造方法ならびに回路基板を用いた表示装置および電子機器
JP4023594B2 (ja) * 2002-07-09 2007-12-19 日本化薬株式会社 エポキシ樹脂組成物、及びその硬化物
JP2006213823A (ja) * 2005-02-03 2006-08-17 Nippon Kayaku Co Ltd 耐熱性エポキシ樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001247654A (ja) * 2000-03-06 2001-09-11 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物及びそれを用いた半導体装置
JP2002302534A (ja) * 2001-01-29 2002-10-18 Ube Ind Ltd Ｃｏｆ実装用アンダ−フィル材および電子部品

Also Published As

Publication number Publication date
JPWO2007132827A1 (ja) 2009-09-24
KR20090015062A (ko) 2009-02-11
JP5317695B2 (ja) 2013-10-16
WO2007132827A1 (ja) 2007-11-22
KR101373791B1 (ko) 2014-03-13
TW200745197A (en) 2007-12-16

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