TWI398506B - 穩定、高速率之矽漿液 - Google Patents

穩定、高速率之矽漿液 Download PDF

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Publication number
TWI398506B
TWI398506B TW098115750A TW98115750A TWI398506B TW I398506 B TWI398506 B TW I398506B TW 098115750 A TW098115750 A TW 098115750A TW 98115750 A TW98115750 A TW 98115750A TW I398506 B TWI398506 B TW I398506B
Authority
TW
Taiwan
Prior art keywords
weight
polishing composition
cerium oxide
polishing
potassium
Prior art date
Application number
TW098115750A
Other languages
English (en)
Chinese (zh)
Other versions
TW201009058A (en
Inventor
麥可 懷特
傑佛瑞 吉利藍
雷蒙 瓊斯
艾麗西亞 華特絲
Original Assignee
卡博特微電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡博特微電子公司 filed Critical 卡博特微電子公司
Publication of TW201009058A publication Critical patent/TW201009058A/zh
Application granted granted Critical
Publication of TWI398506B publication Critical patent/TWI398506B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW098115750A 2008-05-23 2009-05-12 穩定、高速率之矽漿液 TWI398506B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/126,739 US8017524B2 (en) 2008-05-23 2008-05-23 Stable, high rate silicon slurry

Publications (2)

Publication Number Publication Date
TW201009058A TW201009058A (en) 2010-03-01
TWI398506B true TWI398506B (zh) 2013-06-11

Family

ID=41340714

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098115750A TWI398506B (zh) 2008-05-23 2009-05-12 穩定、高速率之矽漿液

Country Status (8)

Country Link
US (1) US8017524B2 (https=)
EP (1) EP2297263B1 (https=)
JP (1) JP5600100B2 (https=)
KR (1) KR101297900B1 (https=)
CN (1) CN102037094B (https=)
MY (1) MY148323A (https=)
TW (1) TWI398506B (https=)
WO (1) WO2009142692A2 (https=)

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US8025813B2 (en) * 2009-11-12 2011-09-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
US8491808B2 (en) * 2010-03-16 2013-07-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride
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CN102816530B (zh) * 2011-06-08 2016-01-27 安集微电子（上海）有限公司 一种化学机械抛光液
US8795548B1 (en) * 2013-04-11 2014-08-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicon wafer polishing composition and related methods
US8801959B1 (en) * 2013-04-11 2014-08-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable silicon wafer polishing composition and related methods
US9150759B2 (en) * 2013-09-27 2015-10-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing composition for polishing silicon wafers and related methods
JP5985083B2 (ja) * 2014-01-06 2016-09-06 株式会社フジミインコーポレーテッド 研磨用組成物、および半導体ウェハの製造方法
JP2015189829A (ja) * 2014-03-27 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP6357356B2 (ja) * 2014-06-09 2018-07-11 株式会社フジミインコーポレーテッド 研磨用組成物
CN104263249B (zh) * 2014-09-26 2016-06-29 深圳市力合材料有限公司 一种硅溶胶的处理方法
CN104650740B (zh) * 2014-12-10 2017-07-14 深圳市力合材料有限公司 一种可实现快速稳定抛光的抛光液
CN105802509B (zh) * 2014-12-29 2018-10-26 安集微电子（上海）有限公司 一种组合物在阻挡层抛光中的应用
WO2017051770A1 (ja) * 2015-09-25 2017-03-30 山口精研工業株式会社 研磨剤組成物、および磁気ディスク基板の研磨方法
US9534148B1 (en) 2015-12-21 2017-01-03 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing semiconductor substrate
US9803108B1 (en) 2016-10-19 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous compositions of stabilized aminosilane group containing silica particles
US20190185713A1 (en) * 2017-12-14 2019-06-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp slurry compositions containing silica with trimethylsulfoxonium cations
JP7157651B2 (ja) * 2017-12-27 2022-10-20 ニッタ・デュポン株式会社 研磨用組成物
KR102003441B1 (ko) * 2018-06-12 2019-07-24 주식회사 동진쎄미켐 화학-기계적 연마 슬러리 조성물
US11274230B1 (en) * 2021-04-27 2022-03-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
US11472984B1 (en) 2021-09-27 2022-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of enhancing the removal rate of polysilicon
CN115926629B (zh) * 2022-12-30 2023-12-05 昂士特科技(深圳)有限公司 具有改进再循环性能的化学机械抛光组合物

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TW500792B (en) * 1998-06-05 2002-09-01 Fujimi Inc Edge polishing composition
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TW200740969A (en) * 2006-02-24 2007-11-01 Fujifilm Corp Polishing liquid for metals

Also Published As

Publication number Publication date
US20090291559A1 (en) 2009-11-26
WO2009142692A2 (en) 2009-11-26
CN102037094B (zh) 2013-07-31
JP5600100B2 (ja) 2014-10-01
MY148323A (en) 2013-03-29
JP2011523207A (ja) 2011-08-04
KR101297900B1 (ko) 2013-08-22
EP2297263B1 (en) 2017-03-22
EP2297263A4 (en) 2011-11-30
TW201009058A (en) 2010-03-01
KR20110030478A (ko) 2011-03-23
EP2297263A2 (en) 2011-03-23
WO2009142692A3 (en) 2010-02-18
US8017524B2 (en) 2011-09-13
CN102037094A (zh) 2011-04-27

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