TWI395801B - Circuit connection material and circuit structure of the connection structure - Google Patents

Circuit connection material and circuit structure of the connection structure Download PDF

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Publication number
TWI395801B
TWI395801B TW097143670A TW97143670A TWI395801B TW I395801 B TWI395801 B TW I395801B TW 097143670 A TW097143670 A TW 097143670A TW 97143670 A TW97143670 A TW 97143670A TW I395801 B TWI395801 B TW I395801B
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TW
Taiwan
Prior art keywords
circuit
conductive particles
circuit member
electrode
connection
Prior art date
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TW097143670A
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English (en)
Chinese (zh)
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TW200946629A (en
Inventor
Sunao Kudou
Kouji Kobayashi
Motohiro Arifuku
Kazuyoshi Kojima
Nichiomi Mochizuki
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Publication of TW200946629A publication Critical patent/TW200946629A/zh
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Publication of TWI395801B publication Critical patent/TWI395801B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
TW097143670A 2007-11-12 2008-11-12 Circuit connection material and circuit structure of the connection structure TWI395801B (zh)

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JP4640532B2 (ja) * 2009-07-02 2011-03-02 日立化成工業株式会社 被覆導電粒子
WO2011002084A1 (ja) * 2009-07-02 2011-01-06 日立化成工業株式会社 導電粒子
JP6061443B2 (ja) 2010-12-24 2017-01-18 デクセリアルズ株式会社 異方性導電接着フィルム、接続構造体及びその製造方法
JP6085970B2 (ja) * 2011-07-08 2017-03-01 日立化成株式会社 接着テープ用リール、巻重体、梱包物、リールの接着テープを巻回するための接着テープ用リールとしての使用、及び接着テープ用リールの製造方法
KR101985581B1 (ko) * 2014-01-14 2019-06-03 도요 알루미늄 가부시키가이샤 복합 도전성 입자, 그것을 함유하는 도전성 수지 조성물 및 도전성 도포물
TWI718199B (zh) 2015-11-04 2021-02-11 日商昭和電工材料股份有限公司 接著劑組成物及結構體
KR102608218B1 (ko) 2015-11-04 2023-11-30 가부시끼가이샤 레조낙 접착제 조성물 및 구조체
WO2017090659A1 (ja) 2015-11-25 2017-06-01 日立化成株式会社 回路接続用接着剤組成物及び構造体
WO2018181589A1 (ja) 2017-03-29 2018-10-04 日立化成株式会社 接着剤組成物及び構造体
WO2018199329A1 (ja) * 2017-04-28 2018-11-01 日立化成株式会社 接着剤組成物、及び接続体の製造方法
WO2019142791A1 (ja) 2018-01-17 2019-07-25 日立化成株式会社 接着剤組成物、接続構造体及びその製造方法
CN115349003B (zh) 2020-04-10 2024-02-06 株式会社力森诺科 黏合剂组合物、黏合剂膜、连接结构体及其制造方法
CN116802243A (zh) 2021-01-25 2023-09-22 株式会社力森诺科 膜状黏合剂及连接结构体的制造方法

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CN101849266A (zh) 2010-09-29
TW200946629A (en) 2009-11-16
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WO2009063827A1 (ja) 2009-05-22
KR20100080628A (ko) 2010-07-09

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