TWI394810B - An adhesive composition and a circuit connecting material using the same, and a method of connecting the circuit member and a circuit connecting body - Google Patents
An adhesive composition and a circuit connecting material using the same, and a method of connecting the circuit member and a circuit connecting body Download PDFInfo
- Publication number
- TWI394810B TWI394810B TW097138204A TW97138204A TWI394810B TW I394810 B TWI394810 B TW I394810B TW 097138204 A TW097138204 A TW 097138204A TW 97138204 A TW97138204 A TW 97138204A TW I394810 B TWI394810 B TW I394810B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit
- adhesive composition
- adhesive
- circuit members
- layer
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
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JP2007261995 | 2007-10-05 | ||
JP2008009673 | 2008-01-18 |
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TW200932860A TW200932860A (en) | 2009-08-01 |
TWI394810B true TWI394810B (zh) | 2013-05-01 |
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TW097138204A TWI394810B (zh) | 2007-10-05 | 2008-10-03 | An adhesive composition and a circuit connecting material using the same, and a method of connecting the circuit member and a circuit connecting body |
TW101142286A TW201309770A (zh) | 2007-10-05 | 2008-10-03 | 黏著劑組成物及使用其之電路連接材料、以及電路構件的連接方法及電路連接體 |
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TW101142286A TW201309770A (zh) | 2007-10-05 | 2008-10-03 | 黏著劑組成物及使用其之電路連接材料、以及電路構件的連接方法及電路連接體 |
Country Status (5)
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JP (2) | JP5126233B2 (fr) |
KR (3) | KR20100009538A (fr) |
CN (3) | CN101815769B (fr) |
TW (2) | TWI394810B (fr) |
WO (1) | WO2009044732A1 (fr) |
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JP2010260924A (ja) * | 2009-04-30 | 2010-11-18 | Sumitomo Electric Ind Ltd | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
JP5728804B2 (ja) * | 2009-10-07 | 2015-06-03 | デクセリアルズ株式会社 | 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 |
JP2011100927A (ja) * | 2009-11-09 | 2011-05-19 | Sony Chemical & Information Device Corp | 接着剤組成物 |
JP5619466B2 (ja) * | 2010-04-13 | 2014-11-05 | デクセリアルズ株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム |
KR101374365B1 (ko) * | 2010-12-27 | 2014-03-17 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
JP6100989B2 (ja) * | 2011-03-25 | 2017-03-22 | 藤森工業株式会社 | Ito用粘着テープ |
US9261182B2 (en) | 2011-03-31 | 2016-02-16 | Kubota Corporation | Shift power transmission apparatus and travel power transmission device |
JP5838321B2 (ja) * | 2011-05-27 | 2016-01-06 | パナソニックIpマネジメント株式会社 | 太陽電池モジュールの製造方法 |
JP5844588B2 (ja) * | 2011-09-21 | 2016-01-20 | デクセリアルズ株式会社 | 回路接続材料及びそれを用いた接続方法並びに接続構造体 |
JP6328996B2 (ja) * | 2013-05-23 | 2018-05-23 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
JP6292808B2 (ja) * | 2013-09-13 | 2018-03-14 | デクセリアルズ株式会社 | 接着剤、及び発光装置 |
JP6505423B2 (ja) | 2013-12-16 | 2019-04-24 | デクセリアルズ株式会社 | 実装体の製造方法、及び異方性導電フィルム |
KR20160130783A (ko) * | 2014-03-05 | 2016-11-14 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 피부에 부드러운 (메트)아크릴레이트 감압성 접착제 |
CN104673111B (zh) * | 2014-06-30 | 2017-01-11 | 广东丹邦科技有限公司 | 环氧树脂基各向异性导电胶膜的配方及制备方法 |
JP5983694B2 (ja) * | 2014-09-10 | 2016-09-06 | デクセリアルズ株式会社 | 異方性導電接着剤 |
CN104403610B (zh) * | 2014-11-24 | 2016-08-17 | 苏州斯迪克新材料科技股份有限公司 | 高阻燃性压敏胶黏剂及其制造工艺 |
JP6114883B1 (ja) * | 2015-05-20 | 2017-04-12 | 積水化学工業株式会社 | 導電性粘着材及び導電性基材付き導電性粘着材 |
JP6875378B2 (ja) | 2015-08-31 | 2021-05-26 | スリーエム イノベイティブ プロパティズ カンパニー | 湿潤表面に対する接着力が高められた(メタ)アクリレート感圧接着剤を含む陰圧閉鎖創傷療法被覆材 |
KR20180035926A (ko) | 2015-08-31 | 2018-04-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 습윤 표면에 대한 접착력이 향상된 (메트)아크릴레이트 감압 접착제를 포함하는 물품 |
JP2017110128A (ja) * | 2015-12-17 | 2017-06-22 | Dic株式会社 | 熱硬化性接着シート、物品及び物品の製造方法 |
FR3066385B1 (fr) | 2017-05-19 | 2020-01-17 | Laboratoires M&L | Composition cosmetique biphasique |
SG11202103537PA (en) * | 2018-11-09 | 2021-05-28 | Showa Denko Materials Co Ltd | Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device |
WO2020110785A1 (fr) * | 2018-11-29 | 2020-06-04 | 日立化成株式会社 | Agent adhésif de type film pour semi-conducteur, dispositif à semi-conducteur et son procédé de fabrication |
CN109735276B (zh) * | 2019-01-11 | 2021-03-26 | 华玻视讯(珠海)科技有限公司 | 一种微米铜片-聚苯醚-环氧树脂导电胶及制备方法 |
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JP2007112949A (ja) * | 2005-10-24 | 2007-05-10 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
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JP3617417B2 (ja) * | 1999-06-18 | 2005-02-02 | 日立化成工業株式会社 | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JP2001212525A (ja) * | 2000-02-01 | 2001-08-07 | Kubota Corp | 粉粒体検査装置 |
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JP2002212525A (ja) | 2001-01-22 | 2002-07-31 | Hitachi Chem Co Ltd | 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置 |
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JP4123963B2 (ja) * | 2003-02-17 | 2008-07-23 | 日立化成工業株式会社 | 接着シート及びそれを用いた半導体装置 |
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-
2008
- 2008-09-30 WO PCT/JP2008/067742 patent/WO2009044732A1/fr active Application Filing
- 2008-09-30 CN CN2008801101962A patent/CN101815769B/zh active Active
- 2008-09-30 KR KR1020097018997A patent/KR20100009538A/ko not_active Application Discontinuation
- 2008-09-30 KR KR1020127013159A patent/KR101403282B1/ko active IP Right Grant
- 2008-09-30 JP JP2009536053A patent/JP5126233B2/ja active Active
- 2008-09-30 CN CN2012103394608A patent/CN102850982A/zh active Pending
- 2008-09-30 CN CN201210337992.8A patent/CN102876277B/zh active Active
- 2008-09-30 KR KR1020117012448A patent/KR101376002B1/ko active IP Right Grant
- 2008-10-03 TW TW097138204A patent/TWI394810B/zh active
- 2008-10-03 TW TW101142286A patent/TW201309770A/zh unknown
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2012
- 2012-10-15 JP JP2012228303A patent/JP2013058764A/ja active Pending
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JPH0249087A (ja) * | 1988-08-11 | 1990-02-19 | Toray Ind Inc | 接着剤組成物 |
JP2007112949A (ja) * | 2005-10-24 | 2007-05-10 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
Also Published As
Publication number | Publication date |
---|---|
TW201309770A (zh) | 2013-03-01 |
CN101815769B (zh) | 2012-11-07 |
JP2013058764A (ja) | 2013-03-28 |
CN102876277B (zh) | 2014-12-10 |
CN101815769A (zh) | 2010-08-25 |
KR101403282B1 (ko) | 2014-06-02 |
WO2009044732A1 (fr) | 2009-04-09 |
JPWO2009044732A1 (ja) | 2011-02-10 |
JP5126233B2 (ja) | 2013-01-23 |
TW200932860A (en) | 2009-08-01 |
KR20120073354A (ko) | 2012-07-04 |
CN102876277A (zh) | 2013-01-16 |
KR20100009538A (ko) | 2010-01-27 |
KR101376002B1 (ko) | 2014-03-19 |
KR20110066235A (ko) | 2011-06-16 |
CN102850982A (zh) | 2013-01-02 |
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