TWI389185B - 基板之處理裝置（二） - Google Patents

基板之處理裝置（二） Download PDF

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Publication number
TWI389185B
TWI389185B TW094130357A TW94130357A TWI389185B TW I389185 B TWI389185 B TW I389185B TW 094130357 A TW094130357 A TW 094130357A TW 94130357 A TW94130357 A TW 94130357A TW I389185 B TWI389185 B TW I389185B
Authority
TW
Taiwan
Prior art keywords
processing
substrate
processing tank
tank
treatment tank
Prior art date
Application number
TW094130357A
Other languages
English (en)
Chinese (zh)
Other versions
TW200616057A (en
Inventor
Hideki Sueyoshi
Akinori Iso
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200616057A publication Critical patent/TW200616057A/zh
Application granted granted Critical
Publication of TWI389185B publication Critical patent/TWI389185B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/52—Casings; Connections of working fluid for axial pumps
    • F04D29/522—Casings; Connections of working fluid for axial pumps especially adapted for elastic fluid pumps
    • F04D29/526—Details of the casing section radially opposing blade tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Tables And Desks Characterized By Structural Shape (AREA)
TW094130357A 2004-09-22 2005-09-05 基板之處理裝置（二） TWI389185B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004275755A JP4641168B2 (ja) 2004-09-22 2004-09-22 基板の処理装置

Publications (2)

Publication Number Publication Date
TW200616057A TW200616057A (en) 2006-05-16
TWI389185B true TWI389185B (zh) 2013-03-11

Family

ID=36234027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130357A TWI389185B (zh) 2004-09-22 2005-09-05 基板之處理裝置（二）

Country Status (4)

Country Link
JP (1) JP4641168B2 (ko)
KR (1) KR101160535B1 (ko)
CN (1) CN100514543C (ko)
TW (1) TWI389185B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010513694A (ja) 2006-12-20 2010-04-30 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド 向上熱的性能を有する複合材料
JP2009266962A (ja) * 2008-04-23 2009-11-12 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP5490395B2 (ja) * 2008-10-07 2014-05-14 大日本スクリーン製造株式会社 基板処理装置及びその製造方法
JP2010225687A (ja) * 2009-03-19 2010-10-07 Shibaura Mechatronics Corp 基板の処理装置
JP2013026490A (ja) * 2011-07-22 2013-02-04 Tokyo Electron Ltd 基板処理装置
JP6732213B2 (ja) * 2016-11-16 2020-07-29 日本電気硝子株式会社 ガラス基板の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03284386A (ja) * 1990-03-30 1991-12-16 Shibaura Eng Works Co Ltd 洗浄用処理槽
JPH08318169A (ja) * 1995-05-26 1996-12-03 Sanyo Electric Co Ltd ドラフト装置
JP3211147B2 (ja) * 1996-05-29 2001-09-25 株式会社荏原製作所 装置の排気構造
JP3556110B2 (ja) * 1998-12-22 2004-08-18 大日本スクリーン製造株式会社 基板処理装置
WO2001003167A1 (fr) * 1999-07-02 2001-01-11 Tokyo Electron Limited Installation, procede et dispositif de fabrication de semi-conducteurs
JP2003260422A (ja) * 2002-03-12 2003-09-16 J P C:Kk 部品洗浄システム
JP4136826B2 (ja) * 2002-08-19 2008-08-20 住友精密工業株式会社 昇降式基板処理装置及びこれを備えた基板処理システム

Also Published As

Publication number Publication date
KR101160535B1 (ko) 2012-06-28
JP2006093339A (ja) 2006-04-06
CN100514543C (zh) 2009-07-15
JP4641168B2 (ja) 2011-03-02
CN1753150A (zh) 2006-03-29
KR20060051450A (ko) 2006-05-19
TW200616057A (en) 2006-05-16

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