TWI388937B - 曝光設備及裝置製造方法 - Google Patents
曝光設備及裝置製造方法 Download PDFInfo
- Publication number
- TWI388937B TWI388937B TW096141897A TW96141897A TWI388937B TW I388937 B TWI388937 B TW I388937B TW 096141897 A TW096141897 A TW 096141897A TW 96141897 A TW96141897 A TW 96141897A TW I388937 B TWI388937 B TW I388937B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- substrate
- light valve
- controller
- exposure
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 238000005286 illumination Methods 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims description 31
- 238000012937 correction Methods 0.000 claims description 29
- 230000000903 blocking effect Effects 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 40
- 239000004065 semiconductor Substances 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/72—Controlling or varying light intensity, spectral composition, or exposure time in photographic printing apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006302137A JP5100088B2 (ja) | 2006-11-07 | 2006-11-07 | 露光装置及びデバイス製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200832078A TW200832078A (en) | 2008-08-01 |
| TWI388937B true TWI388937B (zh) | 2013-03-11 |
Family
ID=39359445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096141897A TWI388937B (zh) | 2006-11-07 | 2007-11-06 | 曝光設備及裝置製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7936446B2 (enExample) |
| JP (1) | JP5100088B2 (enExample) |
| KR (1) | KR100972240B1 (enExample) |
| TW (1) | TWI388937B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5173650B2 (ja) * | 2008-07-29 | 2013-04-03 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
| KR101154779B1 (ko) * | 2011-03-11 | 2012-06-18 | 하이디스 테크놀로지 주식회사 | 포토 리소그래피 방법 |
| TWI436030B (zh) | 2012-07-04 | 2014-05-01 | Test Research Inc | 三維量測系統 |
| CN103528541B (zh) * | 2012-07-04 | 2016-05-04 | 德律科技股份有限公司 | 三维测量系统 |
| JP6861463B2 (ja) * | 2015-06-16 | 2021-04-21 | キヤノン株式会社 | 露光装置及び物品の製造方法 |
| KR102355296B1 (ko) * | 2017-08-08 | 2022-01-25 | 삼성전자주식회사 | 반도체 메모리 장치 및 이의 제조를 위한 반도체 메모리 제조 장치 |
| JP7352332B2 (ja) * | 2018-05-14 | 2023-09-28 | キヤノン株式会社 | 露光装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5771132A (en) * | 1980-10-21 | 1982-05-01 | Canon Inc | Exposure controlling system |
| JPS6134252A (ja) | 1984-07-20 | 1986-02-18 | 津田駒工業株式会社 | 織機における不良緯糸の自動引出方法と装置 |
| JPH0555106A (ja) * | 1991-08-28 | 1993-03-05 | Canon Inc | 露光量制御装置 |
| JP2843895B2 (ja) * | 1991-10-01 | 1999-01-06 | キヤノン株式会社 | 露光装置 |
| JP3103461B2 (ja) * | 1993-06-29 | 2000-10-30 | キヤノン株式会社 | Ｘ線露光方法と装置、並びにデバイス製造方法 |
| JPH06120103A (ja) * | 1992-10-07 | 1994-04-28 | Canon Inc | 露光装置 |
| JPH09320938A (ja) * | 1996-05-29 | 1997-12-12 | Nikon Corp | 投影露光装置 |
| JPH10284371A (ja) | 1997-04-03 | 1998-10-23 | Nikon Corp | 露光方法及び装置 |
| KR100616293B1 (ko) * | 1999-11-11 | 2006-08-28 | 동경 엘렉트론 주식회사 | 기판처리장치 및 기판처리방법 |
| JP2005252161A (ja) * | 2004-03-08 | 2005-09-15 | Powerchip Semiconductor Corp | フォトリソグラフィーシステム及び関連方法 |
| JP5025250B2 (ja) * | 2006-12-15 | 2012-09-12 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP5173650B2 (ja) * | 2008-07-29 | 2013-04-03 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
-
2006
- 2006-11-07 JP JP2006302137A patent/JP5100088B2/ja active Active
-
2007
- 2007-11-06 US US11/935,814 patent/US7936446B2/en active Active
- 2007-11-06 TW TW096141897A patent/TWI388937B/zh active
- 2007-11-07 KR KR1020070112939A patent/KR100972240B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20080106721A1 (en) | 2008-05-08 |
| JP2008118062A (ja) | 2008-05-22 |
| TW200832078A (en) | 2008-08-01 |
| KR100972240B1 (ko) | 2010-07-23 |
| US7936446B2 (en) | 2011-05-03 |
| KR20080041591A (ko) | 2008-05-13 |
| JP5100088B2 (ja) | 2012-12-19 |
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