TWI388937B - Exposure apparatus and device manufacturing method - Google Patents

Abstract

An exposure apparatus which illuminates a reticle with illumination light from a light source and projects light from the reticle onto a substrate to expose the substrate to light is disclosed. The apparatus comprises a shutter located on a path of the illumination light, a detector configured to detect a dose to the substrate, and a controller configured to control operation of the shutter. In a first exposure mode which uses illumination light with a first light intensity, the controller controls an open time of the shutter based on an output from the detector, and to store the open time. In a second exposure mode which uses illumination light with a second light intensity higher than the first light intensity, the controller controls a speed of the shutter based on the stored open time.

Description

Exposure apparatus and device manufacturing method

The present invention relates to an exposure apparatus that illuminates a reticle with illumination light from a light source and projects light onto the substrate from the reticle to expose the substrate, and a method of manufacturing the apparatus using the exposure apparatus.

Japanese Patent Publication No. 61-34252 discloses an exposure apparatus having a configuration in which light intensity from a substrate or a substrate is detected by a photodetector, an output pulse wave corresponding to a frequency of a detection value is obtained, and the pulse waves are counted. And closing the light valve when the number of counted pulse waves reaches a predetermined pulse count. In the light valve, a rotating disk is alternately provided with a light blocking portion and a light transmitting portion. By rotating the light valve, the light-shielding state and the light-transmitting state of the illumination light are controlled. The error caused by the operation delay time of the light valve, that is, the dose (exposure amount) of the substrate during the period from when the light valve closing signal is generated to when the light valve is completely closed, must be corrected. For this purpose, the pulse wave corresponding to the dose is counted when the light valve is opened when the light valve is turned on. Consider the pulse count to correct the timing at which the light valve close signal is generated.

When the exposure control is performed in a small dose, the timing of closing the light valve may sometimes be too late as configured in Japanese Patent Laid-Open No. 61-34252. In order to prevent this, the method of closing the light valve without counting the pulse wave, or counting the pulse wave as described above when the light intensity is low, and the method of closing the light valve when the number of counted pulse waves reaches the predetermined pulse wave count may be used. Adopted. As a method of reducing the light intensity, a method of moving the position of the light source along the optical axis, and A method of inserting a neutral density filter between the light source and the substrate is possible.

The method of closing the light valve without counting the pulse wave, however, requires a technique that ensures exposure of the wafer or the shot area at an appropriate dose. The yield is reduced in a method of performing exposure control as described above when the light intensity is lowered.

The present invention has been accomplished with respect to the above background, and high productivity and accurate dose control must be achieved as an exemplary purpose.

According to the present invention, there is provided an exposure apparatus that illuminates a reticle with illumination light from a light source and projects light onto the substrate from the reticle to expose the substrate. The apparatus includes a light valve positioned in the path of the illumination light, a detector configured to detect a dose for the substrate, and a controller configured to control operation of the light valve. In a first exposure mode using illumination light having a first light intensity, the controller controls the on time of the light valve based on the output from the detector and stores the on time. In a second exposure mode that uses illumination light having a second light intensity that is higher than the first light intensity, the controller controls the speed of the light valve based on the stored on time.

The present invention achieves, for example, high throughput and accurate exposure control.

Further features of the present invention will become apparent from the following description of exemplary embodiments.

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

1 is a simplified view showing an exposure apparatus in accordance with a preferred embodiment of the present invention. The schematic to be configured. An exposure apparatus 100 according to a preferred embodiment of the present invention includes a light source 1, a light valve 4, a mask stage 21, a projection optical system 6, and a substrate stage 22. The mask stage 21 holds and positions the reticle 2. The photomask 2 has a pattern such as a semiconductor circuit pattern formed thereon. The illumination light generated by the light source 1 illuminates the reticle 2. The substrate stage 22 holds and positions a substrate (wafer) 3 coated with a photoresist (photosensitizer). The pattern of the reticle 2 is projected onto the substrate 3 via the projection optical system 6 to form a latent image pattern on the photoresist applied to the substrate 3. The developer develops the latent image pattern, thereby forming a resist pattern.

The light valve 4 is disposed between the light source 1 and the mask stage 21, and controls the incident time of the illumination light from the light source 1 to the mask 2 to determine the exposure time of the substrate 3. The exposure apparatus 100 includes a detector S that detects a dose (exposure amount) of the substrate 3. The exposure amount sensor S may include, for example, an optical sensor 5, an amplifier 7, a V/F converter 9, and a pulse counter 11. The optical sensor 5 detects the intensity of the illumination light between the light valve 4 and the mask stage 21. The optical sensor 5 includes a light receiving element. The light receiving element may be disposed in an optical path of the illumination light between the light valve 4 and the mask stage 21, or receive light extracted from the optical path by the mirror. The amplifier 7 converts a signal output from the optical sensor 5 and indicating the light intensity into a voltage signal. The V/F converter 9 converts the voltage signal output from the amplifier 7 into a frequency signal. The pulse wave counter 11 counts the pulse wave of the frequency signal output from the V/F converter 9. The pulse number counted by the pulse counter 11 indicates the cumulative amount of the light intensity of the illumination light, and thus is proportional to the dose of the substrate. Therefore, the information indicated by the dose of the substrate can be obtained from the pulse counter.

The exposure apparatus 100 may further include: a controller 13, an input/output device 15, a target exposure amount determining unit 16, a light valve driving circuit 14, and the like. In a particular mode, controller 13 controls the dose based on the output from pulse counter 11. The light valve drive circuit 14 is driven to open/close the light valve 4 upon receiving an instruction from the controller 13. An input/output device (console) 15 is used to input/output various types of information segments. The target exposure amount determining unit 16 determines the target dose based on the exposure conditions input via the input/output device 15, and other information input if necessary.

2A, 2B and 2C are schematic views illustrating the exposure control by the operation of the light valve 4. The light valve 4 includes a light valve plate 81. 2A, 2B and 2C show an example of the positional relationship between the light valve plate 81 and the optical path region 86 through which the illumination light passes. 2A shows a state in which the light shielding portion A of the light valve plate 81 blocks the optical path region 86. 2B shows the state in which the light valve plate 81 of the state of FIG. 2A is rotated clockwise by 60 degrees so that it no longer blocks the optical path region 86. 2C shows a state in which the light valve plate 81 of the state of FIG. 2B is further rotated clockwise by 60 degrees so that the light shielding portion B blocks the optical path region 86. The state in which the optical path region 86 is not blocked is a state in which the light valve 4 is opened, and the state in which the optical path region 86 is blocked is a state in which the light valve 4 is closed.

According to this embodiment, the exposure sequence when the exposure exposes the substrate at a low dose includes using a low speed exposure mode (first exposure mode) of illumination light having a first light intensity, and using a second having a higher than first light intensity High-speed exposure mode (second exposure mode) of illumination light of light intensity. The high speed exposure mode is executed after the low speed exposure mode.

The low speed exposure mode can be implemented on at least one of a plurality of substrates Guide substrate. In the low speed exposure mode, the pulse counter 11 counts the pulse wave of the frequency signal output from the V/F converter 9 when the intensity of light entering the substrate is reduced. When the number of counted pulse waves reaches the target pulse wave count, the light valve 4 is closed. It may be a method of reducing the light intensity to the first light intensity, a method of changing the position of the light source 1 along the optical axis, or a method of inserting a neutral filter between the light source and the reticle.

The high speed exposure mode is for a substrate that is attached after exposure to a substrate in a low speed exposure mode. For example, when the first substrate in the batch is exposed to the low speed exposure mode, the high speed exposure mode exposes the second and lower substrates of the batch. In the high-speed exposure mode, the light valve 4 is rotated at a rotation speed, which is determined based on the target dose and correction information, and the target dose and correction information are obtained by the exposure control of the low-speed exposure mode, and the exposure is not used. The output of the sensor S, or the light intensity, is used to control the dose. In the exposure of the single shot area, the state of the optical path area 86 is completely blocked by the light shielding portion A. As shown in FIG. 2A, the light valve 4 can be rotationally driven by 120 degrees, as shown in FIG. 2C, and the exposure time is from the light shielding portion. A ends blocking the optical path region 86 until the opaque portion B begins to block the optical path region 86. The rotational speed of the light valve 4 determines this time.

FIG. 3 is a graph illustrating the relationship between the target dose and the rotational speed of the light valve 4 (the rotational speed of the light valve plate 81). The relationship between the target dose as described in FIG. 3 and the rotational speed of the light valve 4 can be obtained by experiment or calculation, and can be stored in advance in the memory (not shown) of the controller 13 as, for example, an approximate function or a data table. In the following description, unless otherwise specified, the "memory" refers to the memory in the controller 13. In the part of memory A memory such as an external device of the controller 13 is also naturally used as the memory 13 in the replacement controller.

4 is a schematic diagram illustrating the shooting of a layout on a substrate. The area is configured to form a grid on the substrate 3 that reveals a segmented exposure zone called a shot zone. In the figure, the shooting area shows the number of exposure revolutions.

FIG. 5 is a flow chart showing a decision process in the exposure apparatus 100 before the exposure sequence is performed.

In step S102, the controller 13 obtains a conversion standard input or a preset value via the input/output device 15. In step S103, the controller 13 obtains the target exposure amount information (target dose) from the target exposure amount determining unit 16.

In step S104, the controller 13 compares the conversion criteria obtained in step S102 with the target dose obtained in step S103. If the target dose is greater than the conversion criteria, the process proceeds to step S105 to perform the exposure sequence of the high dose mode. If the target dose is equal to or less than the conversion criterion, the controller 13 advances the process to step S106 to perform the exposure sequence of the low dose mode.

Figure 6 is a flow chart showing the exposure sequence of the high dose mode. In step S202, the controller 13 stores (i.e., records) the target dose provided by the target exposure amount determining unit 16 in the memory. In step S203, the controller 13 transmits a light valve opening command to the light valve driving circuit 14 to open the light valve 4.

In step S204, the light valve 4 is turned on, and the illumination light generated by the light source 1 illuminates the mask 2 to activate the exposure of the substrate 3. At the same time, the measurement of the dose of the substrate (wafer) 3 is also started. In particular, amplifier 7 will be self-optical The signal output by the device 5 and indicating the light intensity is converted into a voltage signal. The V/F converter 9 converts the voltage signal into a pulse train. The pulse counter 11 counts the pulse waves of the pulse train.

In step S205, the controller 13 reads the count provided by the pulse counter 11 and determines whether the count coincides with the pulse count determined by the target dose stored in the memory. Step S205 is repeated until the count provided by the pulse counter 11 coincides with the pulse count determined by the target dose exposure. When the two counts coincide, the controller 13 advances the process to step S206.

In step S206, the controller 13 transmits a light valve closing command to the light valve driving circuit 14 to close the light valve 4.

Figure 7 is a flow chart showing the exposure sequence of the low dose mode. In step S302, the controller 13 determines whether the substrate as the processing target is the exposure target of the low-speed exposure mode. The substrate that is the exposure target of the low speed exposure mode is typically at least one leading substrate of the batch. Based on information input via the input/output device 15, for example, it is possible to determine which substrate should be the target substrate for exposure in the low speed exposure mode. In addition, the target substrate on which substrate should be exposed in the low-speed exposure mode can follow the information preset value as the preset information. As the target substrate for exposure in the low-speed exposure mode, unlike the substrate as described above, for example, at least one substrate may be selected to be processed after the state of the exposure apparatus 100 is changed (for example, the operation time of the light source 1 exceeds a reference value).

When the substrate to be processed is the target substrate of the low speed exposure, the controller 13 advances the process to step S303. If not, the controller 13 makes the process before Proceed to step S304.

Fig. 8 is a flow chart showing the exposure sequence of the low speed exposure mode (first exposure mode). Note that the number of shots (N) is initialized to 1 at the beginning of the process shown in FIG.

In step S402, the controller 13 reduces the intensity of light entering the substrate to the first light intensity. The method of changing the position of the light source 1 along the optical axis or the method of inserting the neutral light filter between the light source and the reticle, as described above, based on the exposure from the exposure amount The output of the device S is turned off to close the light valve 4 to reduce the intensity of the light so that the target dose can be achieved.

After the light valve 4 remains open for a sufficient period of time, the controller 13 transmits a light valve close command to the light valve drive circuit 14 based on the output from the low speed exposure mode to close the light valve 4. In this way, the substrate can be exposed in an approximate dose.

In step S403, the controller 13 stores the target dose supplied from the target exposure amount determining unit 16 in the memory. In step S404, the controller 13 transmits a light valve opening command to the light valve driving circuit 14 to open the light valve 4.

In step S405, the light valve 4 is turned on, and the illumination light generated by the light source 1 illuminates the mask 2 to activate the exposure of the substrate 3. The amplifier 7 converts the signal output from the optical sensor 5 and indicating the light intensity into a voltage signal. The V/F converter 9 converts the voltage signal into a pulse train. The pulse counter 11 calculates the pulse wave of the pulse train.

In step S406, the controller 13 reads the pulse wave of the exposure amount sensor S The count provided by the counter 11 determines whether the count coincides with the pulse count determined by the target dose stored in the memory. Step S406 is repeated until the count provided by the pulse counter 11 coincides with the pulse count determined by the target dose. When the two counts coincide, the controller 13 advances the process to step S407.

In step S407, the controller 13 transmits a light valve close command to the light valve drive circuit 14 to close the light valve 4. In particular, the controller 13 controls the timing of closing the light valve 4 based on the count provided by the pulse counter 11 of the exposure amount sensor S.

In step S408, the controller 13 stores the timing required from the light valve opening command (step S404) to the light valve closing command (step S407) in the memory as the light valve opening time (ShutterOpenTime).

In step S409, the controller 13 calculates a correction coefficient (correction information) according to the equation (1) based on the target dose (TargetDose) stored in step S403 and the shutter open time (ShutterOpenTime) stored in step S408. In step S410, the controller 13 stores the calculated correction coefficient (including the number of shots (N) as the configuration variable) as the second correction coefficient (Coef2(N)) in the memory.

Coef2(N)=ShutterOpenTime×TimeDoseConst/TargetDose(1)

Among them, the N-number of shots, the TargetDose target dose [J/m ² ], and the ShutterOpenTime light valve open time [S]. And TimeDoseConst is a proportional constant [J/m ² . S], and Coef2(N) are the second correction factor.

In step S411, the controller 13 determines whether all of the shooting zones have accepted the exposure. If not, the controller 13 increments the number of shots (N) by one and returns the process to step S404.

When the exposure of the low speed exposure mode is for a plurality of substrates, the second correction coefficient obtained for each of the plurality of substrates is calculated (by, for example, a mechanism calculation), and the second correction coefficient for the high speed exposure mode may be based on Obtained by calculating the result.

Fig. 9 is a flow chart showing the exposure sequence of the high speed exposure mode. Note that the number of shots (N) of the exposure target starts at 1 at the beginning of the process shown in FIG.

In step S501, the controller 13 checks whether the intensity of the light entering the substrate has a second light intensity (typically the maximum light intensity). If not, the controller 13 restores the light intensity to the second light intensity.

In step S502, the controller 13 stores the target dose provided by the target exposure amount determining unit 16 in the memory. In step S503, the controller 13 obtains the first correction coefficient Coef1(N-1) stored in the memory for the purpose of the Nth exposure. The first correction coefficient Coef1(N-1) will be described later.

In step S504, the controller 13 calculates a final target dose (FinalDose) based on the first correction coefficient Coef1 (N-1), the second correction coefficient Coef2 (N), and the target dose (TargetDose) according to the equation (2). Note that Coef1(0) can be an implicit value.

FinalDose=TargetDose×Coef1(N-1)×Coef2(N).........(2)

Among them, N series, TargetDose target dose [J/m ² ], FinalDose final target dose [J/m ² ], Coef1 (N-1) first correction coefficient, and Coef2 (N) second correction coefficient.

In step S505, the controller 13 calculates the rotational speed of the light valve 4 based on the final target dose (FinalDose). The rotational speed of the light valve 4 can be obtained by referring to an approximate equation or a data sheet stored in the memory and indicating the relationship between the target dose and the rotational speed of the light valve 4, as described with reference to FIG. In the example shown in FIG. 3, assuming the final target dose system D1, the corresponding rotational speed of the light valve 4 is R1.

In step S506, the controller 13 transmits a light valve rotation command to the light valve drive circuit 14 to rotate the rotation speed of the light valve 4 obtained in step S505, thereby rotating the light valve 4.

In step S507, the light valve 4 is turned on, and the illumination light generated by the light source 1 illuminates the mask 2 to activate the exposure of the substrate 3. The amplifier 7 converts the signal output from the optical sensor 5 and indicating the light intensity into a voltage signal. The V/F converter 9 converts the voltage signal into a pulse train. The pulse counter 11 counts the pulse waves of the pulse train.

In step S508, the controller 13 waits for the timing when the light valve 4 is completely closed based on the light valve rotation speed. Thereafter, in step S509, the controller 13 ends the counting operation of the pulse wave counter 11. It is noted that in the high-speed exposure mode (second exposure mode), the operation of the light valve 4 that controls the dose of the Nth shot region does not depend on the exposure amount sensor S during the exposure of the Nth shot region. Output (or counting operation).

In step S510, the controller 13 calculates the actual dose (MeasureResult) from the number of pulse waves counted between step S507 and step S509. In step S510, the controller 13 also calculates a first correction coefficient (Coef1) according to equation (3) from the actual dose (MeasureResult) and the final target dose FinalDose. The first correction coefficient (Coef1(N)) obtained in step S510 is used to calculate the last shot TargetDose of the next shot, that is, the (N+1)th shot.

Coef1(N)=1/{MeasureResult/TargetDose} (3)

Among them, N is the number of shots, MeasureResult is the actual dose [J/m ² ], and TargetDose is the target dose [J/m ² ].

In step S511, the controller 13 stores the value calculated in step S510 in Coef1(N) in the memory associated with the number of shots (N).

In step S512, the controller 13 determines whether all of the shooting zones have accepted the exposure. If not, the controller 13 increments the number of shots (N) by one and returns the process to step S503.

As explained above, the last target dose of the Nth shot region for the exposure target is calculated based on the first correction coefficient, which can be obtained by exposure of the N-1th shot region that has received the exposure. Additionally, the last target dose for the Nth shot region may be calculated based on a first correction factor for approaching, for example, the shot region of the Nth shot region.

Equations (1), (2), and (3) are examples of calculation methods. its Its equations can be used to replace these equations. Moreover, the offset coefficient determined for each exposure device or the offset coefficient determined according to the exposure process conditions can be considered.

In correcting the separation error component of the light valve, it is advantageous to use a method of correcting the correction factor taken immediately before. The method of using a correction factor taken nearby is advantageous when correcting the error component produced in accordance with the state or process of the wafer.

According to a preferred embodiment of the present invention, for example, in the low speed exposure mode (first exposure mode), the timing of turning off the light valve is based on the output from the exposure sensor and is corrected based on the light valve opening time. Information is stored. In the high speed exposure mode (second exposure mode), the operation of the light valve is controlled based on the correction information. As a result, the high throughput can be obtained by the high speed exposure mode, and the accurate exposure amount control is also achieved in the high speed exposure mode based on the correction information obtained in the low speed exposure mode.

The calculation of the correction information for each shooting zone can suppress the dose variation of the shooting interval. The dose for the shot area on the peripheral portion of the substrate tends to be inaccurate. In particular, an irregularly shaped shooting zone (non-rectangular shooting zone). This embodiment also enables accurate exposure of such a shooting zone.

A method of manufacturing a device using the above exposure apparatus will now be described. Figure 10 is a flow chart showing the procedure of the entire semiconductor device process. In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a photomask (also known as a prototype or mask) is fabricated based on the designed circuit pattern. In step 3 (wafer fabrication), the wafer (also referred to as the substrate) is fabricated using a material such as tantalum. In step 4 called pretreatment (crystal Circle process), the actual circuit is formed on the wafer by lithography using the reticle and wafer described above. A step 5 (assembly), referred to as post-processing, is a step of forming a semiconductor wafer by using the wafer fabricated in step 4. This step includes processing such as assembly processes (cutting and bonding) and packaging processes (wafer packaging). In step 6 (inspection), an inspection such as an operation inspection test and an durability test of the semiconductor device fabricated in the step 5 is carried out. The semiconductor device is completed by these steps and then transported (step 7). Figure 11 is a flow chart showing the detailed procedure of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the surface of the wafer. In step 13 (electrode formation), the electrodes are formed on the wafer by deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (CMP), the insulating film is planarized by CMP. In step 16 (resist process), a photosensitizer is applied to the wafer. In step 17 (exposure), the exposure apparatus described above exposes the wafer coated with the photosensitizer through a mask having a circuit pattern to form a latent image pattern on the resist. In step 18 (development), the latent image pattern of the resist formed on the wafer is developed to form a resist pattern. In step 19 (etching), the layer or substrate under the resist pattern is etched through the opening of the resist pattern. Step 20 (resist removal), any unwanted photoresist left after etching is removed. These steps are repeated to form a multilayer circuit pattern on the wafer.

While the invention has been described in detail with reference to the exemplary embodiments, it is understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation to cover all such modifications and equivalent structures and functions.

S‧‧‧Exposure Sensor

B‧‧‧Lighting Department

A‧‧‧Lighting Department

N‧‧‧Number of shots

1‧‧‧Light source

2‧‧‧Photomask

3‧‧‧Substrate (wafer)

4‧‧‧Light valve

5‧‧‧ Optical Sensor

6‧‧‧Projection optical system

7‧‧Amplifier

9‧‧‧V/F converter

11‧‧‧ Pulse counter

13‧‧‧ Controller

14‧‧‧Light valve drive circuit

15‧‧‧Input/output devices (console)

16‧‧‧Target exposure determination unit

21‧‧‧Photomask stage

22‧‧‧Substrate stage

81‧‧‧Light valve plate

86‧‧‧ Optical path area

100‧‧‧Exposure equipment

1 is a schematic view showing a schematic configuration of an exposure apparatus according to a preferred embodiment of the present invention; FIGS. 2A, 2B and 2C are schematic diagrams illustrating exposure control by operation of a light valve; FIG. 3 is a view illustrating a target dose and a light valve; A graph showing the relationship between the rotational speeds; FIG. 4 is a schematic diagram illustrating the photographing on the substrate; FIG. 5 is a flow chart showing the decision process in the exposure apparatus before the exposure sequence is performed; and FIG. 6 is a view showing the high dose mode. Flow chart of exposure sequence; FIG. 7 is a flow chart showing the exposure sequence of the low dose mode; FIG. 8 is a flow chart showing the exposure sequence of the low speed exposure mode (first exposure mode); and FIG. 9 is a display sequence showing the exposure mode of the high speed exposure mode. FIG. 10 is a flow chart showing a procedure of the entire semiconductor device process; and FIG. 11 is a flow chart showing a detailed procedure of the wafer process.

1‧‧‧Light source

2‧‧‧Photomask

3‧‧‧Substrate

4‧‧‧Light valve

5‧‧‧ Optical Sensor

6‧‧‧Projection optical system

7‧‧Amplifier

9‧‧‧V/F converter

11‧‧‧ Pulse counter

13‧‧‧ Controller

14‧‧‧Light valve drive circuit

15‧‧‧Input/output devices

16‧‧‧Target exposure determination unit

21‧‧‧Photomask stage

22‧‧‧Substrate stage

100‧‧‧Exposure equipment

S‧‧‧Exposure Sensor

Claims (11)

An exposure apparatus that illuminates a reticle with illumination light from a light source and projects light onto the substrate from the reticle to expose the substrate, the apparatus comprising: a light valve positioned in the path of the illumination light; detecting a controller configured to detect a dose for the substrate; and a controller configured to control operation of the light valve, wherein the controller is configured to be based on a first exposure mode using illumination light having a first light intensity An output from the detector to control a time of opening the light valve of the light valve and storing the time to open the light valve, and a second exposure mode using illumination light having a second light intensity higher than the first light intensity, The controller is configured to control the speed of the light valve based on the stored time of opening the light valve, wherein the controller is configured to control the first exposure mode for the at least one lead substrate comprising one of the plurality of substrates The shutter time is turned on, and the speed of the second exposure mode for all other substrates connected to the at least one lead substrate is controlled. The device of claim 1, wherein in the first exposure mode, the controller is configured to store the opening time of each of the plurality of shooting zones, and in the second exposure mode, the controller is configured The speed of each of the plurality of shot regions is controlled based on the corresponding stored open time. The apparatus of claim 1, wherein in the second exposure mode, the controller is configured to further control the speed based on a dose to an exposure zone that has received exposure, the dose being detected by the detector. The apparatus of claim 1, wherein in the second exposure mode, the controller is configured to determine the speed of the shooting zone prior to initiating exposure of the shooting zone. The apparatus of claim 1, wherein in the second exposure mode, the controller is configured to control a rotational speed of the light valve. The apparatus of claim 1, wherein the detector is configured to detect a dose for the substrate by accumulating the intensity of the illumination light. A device manufacturing method comprising: exposing a substrate using an exposure device; developing the exposed substrate; and processing the developed substrate to fabricate the device, wherein the exposure device is configured to illuminate the mask with illumination light from the light source And configuring the light from the reticle to project onto the substrate to expose the substrate, the exposure apparatus comprising: a light valve positioned in the path of the illumination light; a detector configured to detect a dose for the substrate; and controlling a device configured to control operation of the light valve, wherein in a first exposure mode using illumination light having a first light intensity, the controller is configured to control an opening light of the light valve based on an output from the detector Valve time and storing the time to open the light valve, and using illumination light having a second light intensity higher than the first light intensity a second exposure mode, the controller configured to control a speed of the light valve based on the stored time of opening the light valve, wherein the controller is configured to control the at least one lead substrate for one of the plurality of substrates The opening of the shutter time of the first exposure mode and the controlling the speed of the second exposure mode for all other substrates after the at least one lead substrate. An exposure apparatus that illuminates a reticle with illumination light from a light source and projects light onto the substrate from the reticle to expose the substrate, the apparatus comprising: a light valve positioned in the path of the illumination light; detecting a controller configured to detect a dose for the substrate; and a controller configured to control operation of the light valve; wherein, in a first exposure mode using illumination light having a first light intensity, the controller is configured to be based An output from the detector to control a time of opening the light valve of the light valve and storing the time to open the light valve, and a second exposure mode using illumination light having a second light intensity higher than the first light intensity, The controller is configured to control the speed of the light valve based on the stored time of opening the light valve; wherein, in the first exposure mode, the controller is configured to store the opening time of each of the plurality of shooting zones, and In the second exposure mode, the controller is configured to control the speed of each of the plurality of shot regions based on a corresponding stored open time. An exposure apparatus that illuminates a reticle with illumination light from a light source and projects light onto the substrate from the reticle to expose the substrate, the device package Including: a light valve positioned in the path of the illumination light; a detector configured to detect a dose for the substrate; and a controller configured to control operation of the light valve; wherein the first light intensity is used a first exposure mode of illumination light, the controller configured to control an open light valve time of the light valve based on an output from the detector and to store the open light valve time, and to use having a higher than the first light intensity a second exposure mode of illumination light of a second light intensity, the controller configured to control a speed of the light valve based on the stored time of opening the light valve; wherein the controller is configured to control for including a plurality of substrates The opening shutter time of the first exposure mode of at least one of the lead substrates of a substrate set, and the controlling the speed of the second exposure mode for all other substrates after the at least one lead substrate. An exposure apparatus that illuminates a reticle with illumination light from a light source and projects light onto the substrate from the reticle to expose the substrate, the apparatus comprising: a rotary light valve configured to control the reticle An incident of illumination light; an optical sensor configured to detect a light intensity of the illumination light; and a controller configured to control operation of the rotary light valve, wherein the first use of illumination light having a first light intensity Exposing mode to expose a photographing area of the first substrate, the controller being configured to control a timing of the rotating light valve from a light transmitting state to a light blocking state based on an output from the optical sensor, and configured to store the rotary light valve Turn on the light valve time, And using a second exposure mode of illumination light having a second light intensity higher than the first light intensity to expose a shot region of the second substrate after the first substrate, the controller being configured to be based on the respective shot regions Rotating the rotary light valve according to the target dose and the correction information of the respective beat zones, the correction information is obtained based on the stored time of opening the light valve, so that the rotary light valve is from the light blocking state to the light transmitting state, and then The rotary light valve is from the light transmitting state to the light blocking state. An exposure apparatus that illuminates a reticle with illumination light from a light source and projects light onto the substrate from the reticle to expose the substrate, the apparatus comprising: a rotary light valve configured to control the reticle An incident of illumination light; an optical sensor configured to detect a light intensity of the illumination light; and a controller configured to control operation of the rotary light valve, wherein the first use of illumination light having a first light intensity Exposing mode to expose a photographing area of the first substrate, the controller being configured to control a timing of the rotating light valve from a light transmitting state to a light blocking state based on an output from the optical sensor, and configured to store the rotary light valve Opening a light valve time, and using a second exposure mode of illumination light having a second light intensity higher than the first light intensity to expose a shot region of the second substrate after the first substrate, the controller is configured to be based on Rotating the rotary light valve by a target dose of each shooting zone and a correction coefficient including correction information of the respective shooting zones, the correction information is obtained based on the stored time of opening the light valve, thereby Turn The light valve is from the light blocking state to the light transmitting state, and then the rotating light valve is from the light transmitting state to the light blocking state.