TWI379375B - - Google Patents

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Publication number
TWI379375B
TWI379375B TW97133742A TW97133742A TWI379375B TW I379375 B TWI379375 B TW I379375B TW 97133742 A TW97133742 A TW 97133742A TW 97133742 A TW97133742 A TW 97133742A TW I379375 B TWI379375 B TW I379375B
Authority
TW
Taiwan
Prior art keywords
air
opening
floating
closed
air blowing
Prior art date
Application number
TW97133742A
Other languages
English (en)
Chinese (zh)
Other versions
TW200931575A (en
Inventor
Kensuke Hirata
Yoshiyuki Wada
Kai Tanaka
Susumu Murayama
Original Assignee
Ihi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ihi Corp filed Critical Ihi Corp
Publication of TW200931575A publication Critical patent/TW200931575A/zh
Application granted granted Critical
Publication of TWI379375B publication Critical patent/TWI379375B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Ventilation (AREA)
TW97133742A 2007-09-05 2008-09-03 Clean conveyance system TW200931575A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007230382A JP5233212B2 (ja) 2007-09-05 2007-09-05 クリーン搬送システム

Publications (2)

Publication Number Publication Date
TW200931575A TW200931575A (en) 2009-07-16
TWI379375B true TWI379375B (ja) 2012-12-11

Family

ID=40428736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97133742A TW200931575A (en) 2007-09-05 2008-09-03 Clean conveyance system

Country Status (5)

Country Link
JP (1) JP5233212B2 (ja)
KR (1) KR101130154B1 (ja)
CN (2) CN103247561A (ja)
TW (1) TW200931575A (ja)
WO (1) WO2009031416A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5446403B2 (ja) * 2009-04-07 2014-03-19 株式会社Ｉｈｉ 搬送方向転換装置及び浮上搬送システム
JP5088591B2 (ja) * 2010-04-15 2012-12-05 株式会社ダイフク 板状体搬送装置
CN112079049B (zh) * 2020-09-03 2022-07-12 广州小鹏汽车科技有限公司 一种运输方法和装置、介质
CN114671217A (zh) * 2020-12-24 2022-06-28 志圣工业股份有限公司 自体清洁的输送装置及包含输送装置的加热设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06298360A (ja) * 1993-04-12 1994-10-25 Hitachi Ltd 気流式搬送装置
JP2001315960A (ja) * 2000-05-09 2001-11-13 Meidensha Corp 基板搬送装置
TWI327985B (en) * 2003-04-14 2010-08-01 Daifuku Kk Apparatus for transporting plate-shaped work piece
JP4214468B2 (ja) * 2003-07-03 2009-01-28 株式会社ダイフク 搬送装置
TWI295659B (en) * 2003-08-29 2008-04-11 Daifuku Kk Transporting apparatus
JP2005167083A (ja) * 2003-12-04 2005-06-23 Daifuku Co Ltd ガラス基板用の搬送設備

Also Published As

Publication number Publication date
CN101796625A (zh) 2010-08-04
JP2009064900A (ja) 2009-03-26
KR101130154B1 (ko) 2012-03-28
TW200931575A (en) 2009-07-16
CN103247561A (zh) 2013-08-14
JP5233212B2 (ja) 2013-07-10
WO2009031416A1 (ja) 2009-03-12
KR20100053674A (ko) 2010-05-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees