TWI372441B - - Google Patents

Info

Publication number
TWI372441B
TWI372441B TW097132199A TW97132199A TWI372441B TW I372441 B TWI372441 B TW I372441B TW 097132199 A TW097132199 A TW 097132199A TW 97132199 A TW97132199 A TW 97132199A TW I372441 B TWI372441 B TW I372441B
Authority
TW
Taiwan
Application number
TW097132199A
Other versions
TW200931581A (en
Inventor
Yuichi Doki
Koji Mahara
Tokutarou Hayashi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200931581A publication Critical patent/TW200931581A/zh
Application granted granted Critical
Publication of TWI372441B publication Critical patent/TWI372441B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49771—Quantitative measuring or gauging
TW097132199A 2007-08-24 2008-08-22 Method of adjusting moving position of transfer arm and position detecting jig TW200931581A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007217820A JP4956328B2 (ja) 2007-08-24 2007-08-24 搬送アームの移動位置の調整方法及び位置検出用治具

Publications (2)

Publication Number Publication Date
TW200931581A TW200931581A (en) 2009-07-16
TWI372441B true TWI372441B (zh) 2012-09-11

Family

ID=40381549

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097132199A TW200931581A (en) 2007-08-24 2008-08-22 Method of adjusting moving position of transfer arm and position detecting jig

Country Status (5)

Country Link
US (1) US7884622B2 (zh)
JP (1) JP4956328B2 (zh)
KR (1) KR101197426B1 (zh)
CN (1) CN101373728B (zh)
TW (1) TW200931581A (zh)

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JP4447631B2 (ja) * 2007-11-05 2010-04-07 東京エレクトロン株式会社 位置検出用治具
JP5099054B2 (ja) * 2009-03-13 2012-12-12 東京エレクトロン株式会社 基板処理装置、基板処理方法、塗布、現像装置、塗布、現像方法及び記憶媒体
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体
JP5490741B2 (ja) 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
SG185838A1 (en) * 2011-05-12 2012-12-28 Semiconductor Technologies And Instr Pte Ltd A component pane handler configured to handle component panes of multiple sizes
IL218981A (en) * 2011-05-12 2015-10-29 Semiconductor Tech & Instr Inc System and method for using multi-component windshield holders in the appropriate configuration to handle and move windshield components
JP5667996B2 (ja) * 2012-02-21 2015-02-12 東京エレクトロン株式会社 基板処理装置
JP5884624B2 (ja) 2012-05-02 2016-03-15 東京エレクトロン株式会社 基板処理装置、調整方法及び記憶媒体
US9076834B2 (en) * 2012-09-28 2015-07-07 United Microelectronics Corp. Spacer for thermal plate in semiconductor processing
KR101979903B1 (ko) * 2012-11-08 2019-05-20 삼성디스플레이 주식회사 패널 검사용 가이드 어셈블리 및 이를 포함하는 트레이
JP6111065B2 (ja) * 2012-12-28 2017-04-05 川崎重工業株式会社 自動教示システム及び教示方法
CN104078402B (zh) * 2014-06-30 2017-01-18 武汉新芯集成电路制造有限公司 一种机械手臂位置调整的辅助装置
US9786530B2 (en) * 2014-10-20 2017-10-10 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer transfer method and system
JP6383647B2 (ja) * 2014-11-19 2018-08-29 東京エレクトロン株式会社 測定システムおよび測定方法
KR102307737B1 (ko) 2015-06-11 2021-10-01 도쿄엘렉트론가부시키가이샤 정전 용량 측정용의 센서 칩 및 센서 칩을 구비한 측정기
JP6537433B2 (ja) * 2015-06-11 2019-07-03 東京エレクトロン株式会社 静電容量測定用のセンサチップ及び同センサチップを備えた測定器
CN105097592B (zh) * 2015-06-17 2018-01-26 北京七星华创电子股份有限公司 半导体设备承载区域的硅片分布状态光电扫描方法及装置
JP6502232B2 (ja) * 2015-10-23 2019-04-17 東京エレクトロン株式会社 フォーカスリング及びセンサチップ
US10074549B2 (en) 2016-03-28 2018-09-11 Tokyo Electron Limited Method for acquiring data indicating electrostatic capacitance
JP6586394B2 (ja) * 2016-03-28 2019-10-02 東京エレクトロン株式会社 静電容量を表すデータを取得する方法
JP6596375B2 (ja) * 2016-03-31 2019-10-23 株式会社荏原製作所 ティーチング装置およびティーチング方法
US10634479B2 (en) 2016-06-20 2020-04-28 Tokyo Electron Limited Measuring instrument for measuring electrostatic capacity and method of calibrating transfer position data in processing system by using measuring instrument
JP6712939B2 (ja) * 2016-06-20 2020-06-24 東京エレクトロン株式会社 静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法
JP6842934B2 (ja) * 2017-01-27 2021-03-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、検出位置較正方法および基板処理装置
JP6832207B2 (ja) 2017-03-29 2021-02-24 東京エレクトロン株式会社 静電容量測定用の測定器
JP6948873B2 (ja) * 2017-07-31 2021-10-13 東京エレクトロン株式会社 測定器を較正する方法、及び、ケース
JP7029983B2 (ja) * 2018-03-09 2022-03-04 東京エレクトロン株式会社 測定器及び測定器のずれ量を求める方法
US10794681B2 (en) 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
US11404296B2 (en) * 2018-09-04 2022-08-02 Applied Materials, Inc. Method and apparatus for measuring placement of a substrate on a heater pedestal
JP7281885B2 (ja) * 2018-09-04 2023-05-26 株式会社アルバック 静電チャック装置およびその制御方法
US10847393B2 (en) 2018-09-04 2020-11-24 Applied Materials, Inc. Method and apparatus for measuring process kit centering
US11521872B2 (en) 2018-09-04 2022-12-06 Applied Materials, Inc. Method and apparatus for measuring erosion and calibrating position for a moving process kit
US11342210B2 (en) * 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
JP7158238B2 (ja) * 2018-10-10 2022-10-21 東京エレクトロン株式会社 基板処理システム
CN109300823B (zh) * 2018-11-28 2021-02-09 德淮半导体有限公司 超声波扫描系统以及用于对晶圆进行超声波扫描的方法
JP7341237B2 (ja) * 2018-12-03 2023-09-08 ラム リサーチ コーポレーション ピンリフター試験基板

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JPH10242193A (ja) * 1997-03-03 1998-09-11 Toshiba Corp ワイヤボンディング方法及びその装置
JP2000188249A (ja) * 1998-12-22 2000-07-04 Canon Inc 露光装置およびデバイス製造方法
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JP4243937B2 (ja) 2001-11-02 2009-03-25 東京エレクトロン株式会社 基板支持ピンの支持位置検知方法、その傾き検知方法及びそれらの教示装置並びに教示用治具
JP3888620B2 (ja) 2002-01-22 2007-03-07 東京エレクトロン株式会社 基板搬送装置における基板の受け渡し位置検知方法及びその教示装置
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Also Published As

Publication number Publication date
JP2009054665A (ja) 2009-03-12
TW200931581A (en) 2009-07-16
JP4956328B2 (ja) 2012-06-20
CN101373728A (zh) 2009-02-25
KR101197426B1 (ko) 2012-11-06
US7884622B2 (en) 2011-02-08
KR20090021082A (ko) 2009-02-27
CN101373728B (zh) 2010-09-15
US20090051370A1 (en) 2009-02-26

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