TWI372431B - Semiconductor device, semiconductor device testing method, and probe card - Google Patents

Semiconductor device, semiconductor device testing method, and probe card

Info

Publication number
TWI372431B
TWI372431B TW096120005A TW96120005A TWI372431B TW I372431 B TWI372431 B TW I372431B TW 096120005 A TW096120005 A TW 096120005A TW 96120005 A TW96120005 A TW 96120005A TW I372431 B TWI372431 B TW I372431B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
probe card
testing method
device testing
probe
Prior art date
Application number
TW096120005A
Other languages
English (en)
Other versions
TW200816341A (en
Inventor
Ren Uchida
Masami Mori
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200816341A publication Critical patent/TW200816341A/zh
Application granted granted Critical
Publication of TWI372431B publication Critical patent/TWI372431B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31701—Arrangements for setting the Unit Under Test [UUT] in a test mode
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31727—Clock circuits aspects, e.g. test clock circuit details, timing aspects for signal generation, circuits for testing clocks
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW096120005A 2006-06-22 2007-06-04 Semiconductor device, semiconductor device testing method, and probe card TWI372431B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006173133A JP4708269B2 (ja) 2006-06-22 2006-06-22 半導体装置、及び半導体装置の検査方法

Publications (2)

Publication Number Publication Date
TW200816341A TW200816341A (en) 2008-04-01
TWI372431B true TWI372431B (en) 2012-09-11

Family

ID=38872936

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120005A TWI372431B (en) 2006-06-22 2007-06-04 Semiconductor device, semiconductor device testing method, and probe card

Country Status (5)

Country Link
US (1) US7902853B2 (zh)
JP (1) JP4708269B2 (zh)
KR (1) KR100920391B1 (zh)
CN (1) CN101093244B (zh)
TW (1) TWI372431B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101148917B1 (ko) * 2008-05-16 2012-05-22 가부시키가이샤 어드밴티스트 제조 방법 및 시험용 웨이퍼 유닛
WO2009144828A1 (ja) * 2008-05-30 2009-12-03 株式会社アドバンテスト 試験用ウエハユニットおよび試験システム
TWI386649B (zh) * 2009-03-18 2013-02-21 Mjc Probe Inc 探針卡
DE102009023371A1 (de) * 2009-05-29 2010-12-02 Acandis Gmbh & Co. Kg Verfahren zur Herstellung eines medizinischen Funktionselements mit einer freitragenden Gitterstruktur
JP5266173B2 (ja) * 2009-09-18 2013-08-21 ルネサスエレクトロニクス株式会社 半導体装置
KR101067640B1 (ko) * 2010-04-16 2011-09-26 주식회사 실리콘웍스 디스플레이 구동 시스템의 신뢰성 테스트 장치
US20120120129A1 (en) * 2010-11-11 2012-05-17 Novatek Microelectronics Corp. Display controller driver and method for testing the same
JP2012220238A (ja) * 2011-04-05 2012-11-12 Sharp Corp 半導体装置及びその検査方法
KR101373744B1 (ko) * 2013-01-09 2014-03-26 (주)솔리드메카 메모리 패키지 테스트용 소켓보드 고정지그
CN103116121B (zh) * 2013-01-21 2015-03-25 合肥工业大学 基于自振荡回路的电路老化测试方法
CN103576079B (zh) * 2013-11-15 2016-08-10 上海华岭集成电路技术股份有限公司 芯片测试系统及芯片测试方法
KR20160091508A (ko) * 2015-01-23 2016-08-03 에스케이하이닉스 주식회사 테스트 모드 회로 및 이를 포함하는 반도체 장치
CN106405361B (zh) * 2016-08-24 2020-09-11 通富微电子股份有限公司 一种芯片测试方法及装置
CN106373513A (zh) * 2016-11-15 2017-02-01 武汉华星光电技术有限公司 液晶显示器的老化测试方法及液晶显示器
CN109900931B (zh) * 2017-12-08 2021-03-30 京元电子股份有限公司 半导体组件测试连接接口
CN110907803A (zh) * 2019-11-21 2020-03-24 北京中电华大电子设计有限责任公司 一种在ate上可实现7816接口通讯同步测试的方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02128179A (ja) * 1988-11-07 1990-05-16 Mitsubishi Electric Corp 集積回路
JPH0343735A (ja) 1989-07-11 1991-02-25 Fuji Photo Film Co Ltd 熱現像カラー感光材料
JPH0343735U (zh) * 1989-09-06 1991-04-24
JPH04218936A (ja) 1990-12-19 1992-08-10 Sharp Corp 集積回路装置
JP2925337B2 (ja) * 1990-12-27 1999-07-28 株式会社東芝 半導体装置
US5230001A (en) * 1991-03-08 1993-07-20 Crosscheck Technology, Inc. Method for testing a sequential circuit by splicing test vectors into sequential test pattern
JPH05183032A (ja) * 1991-12-30 1993-07-23 Hitachi Ltd 半導体集積回路装置のエージング方法
JPH0991996A (ja) * 1995-09-20 1997-04-04 Hitachi Ltd 半導体集積回路および試験装置
JPH10247208A (ja) * 1997-03-05 1998-09-14 Sharp Corp 集積回路の試験方法および試験装置
JPH11142471A (ja) * 1997-11-07 1999-05-28 Nec Corp バーンイン試験方法及びバーンイン試験装置
JP3187019B2 (ja) * 1998-12-10 2001-07-11 沖電気工業株式会社 半導体集積回路及びその試験方法
JP4036554B2 (ja) * 1999-01-13 2008-01-23 富士通株式会社 半導体装置およびその試験方法、および半導体集積回路
JP4230045B2 (ja) 1999-04-21 2009-02-25 住友ゴム工業株式会社 クローラ走行装置
JP2001021612A (ja) * 1999-07-07 2001-01-26 Hitachi Ltd 半導体装置の製造方法
JP2001236797A (ja) 1999-12-17 2001-08-31 Fujitsu Ltd 自己試験回路及びそれを内蔵するメモリデバイス
US6629277B1 (en) * 2000-02-15 2003-09-30 Sun Microsystems, Inc. LSSD interface
JP4771572B2 (ja) * 2000-04-10 2011-09-14 富士通セミコンダクター株式会社 Ｐｌｌ半導体装置並びにその試験の方法及び装置
CA2308820A1 (en) * 2000-05-15 2001-11-15 The Governors Of The University Of Alberta Wireless radio frequency technique design and method for testing of integrated circuits and wafers
JP2002158265A (ja) 2000-11-20 2002-05-31 Advantest Corp 電子デバイスの試験装置及び試験方法
JP2002216496A (ja) * 2001-01-16 2002-08-02 Umc Japan 半導体メモリ装置
JP2002373499A (ja) 2001-06-13 2002-12-26 Seiko Epson Corp 半導体メモリ及びこのバーンイン方法
JP3895163B2 (ja) 2001-11-29 2007-03-22 富士通株式会社 液晶パネルドライバ装置
JP2003249558A (ja) * 2002-02-22 2003-09-05 Seiko Instruments Inc 半導体チップ
US7466160B2 (en) * 2002-11-27 2008-12-16 Inapac Technology, Inc. Shared memory bus architecture for system with processor and memory units
JP2005157321A (ja) * 2003-11-07 2005-06-16 Renesas Technology Corp 半導体装置および半導体装置の試験方法
KR100587233B1 (ko) 2004-06-14 2006-06-08 삼성전자주식회사 반도체 메모리소자의 번인테스트 방법
KR100633455B1 (ko) 2004-09-03 2006-10-13 주식회사 유니테스트 반도체 소자 테스터를 위한 신호 분배 장치
JP4535494B2 (ja) * 2004-10-20 2010-09-01 ルネサスエレクトロニクス株式会社 薄膜プローブシートの製造方法および半導体チップの検査方法
JP2005327454A (ja) * 2005-05-13 2005-11-24 Renesas Technology Corp 並列試験装置
US7274201B2 (en) * 2005-05-19 2007-09-25 Micron Technology, Inc. Method and system for stressing semiconductor wafers during burn-in

Also Published As

Publication number Publication date
TW200816341A (en) 2008-04-01
US20070296395A1 (en) 2007-12-27
CN101093244B (zh) 2010-12-29
KR100920391B1 (ko) 2009-10-07
CN101093244A (zh) 2007-12-26
JP4708269B2 (ja) 2011-06-22
US7902853B2 (en) 2011-03-08
JP2008004778A (ja) 2008-01-10
KR20070121559A (ko) 2007-12-27

Similar Documents

Publication Publication Date Title
TWI372431B (en) Semiconductor device, semiconductor device testing method, and probe card
EP2088442A4 (en) PARALLEL CHECK AND METHOD AND SEMICONDUCTOR ARRANGEMENT
EP2026081A4 (en) TEST DEVICE AND TESTING METHOD
EP1870714A4 (en) MICROSTRUCTURE PROBE CARD AND MICROSTRUCTURE INSPECTION DEVICE, METHOD AND COMPUTER PROGRAM
TWI368040B (en) Test device and test method
EP2093536A4 (en) MEASURING ARRANGEMENT AND MEASURING PROCEDURE
TWI348701B (en) Semiconductor memory and method for testing the same
EP2044450A4 (en) METHOD AND SYSTEMS FOR SEMICONDUCTOR TESTING USING A REFERENCE CHIP
EP2088441A4 (en) HOLDER OF THE INVESTIGATION, INVESTIGATION FACILITY AND INVESTIGATION PROCEDURES
TWI339733B (en) Electronic device testing system and method
EP2117133A4 (en) COMMUNICATION TESTING DEVICE AND COMMUNICATION TESTING METHOD
EP1881331A4 (en) TEST DEVICE, PROGRAM AND DIAGNOSTIC METHOD
EP2028501A4 (en) SEMICONDUCTOR ERROR ANALYSIS DEVICE, ERROR ANALYSIS PROCEDURE AND ERROR ANALYSIS PROGRAM
GB0623045D0 (en) Measuring system, method and device
EP1806589A4 (en) SONDER TO WAFER INSPECTION, WAFER INSPECTION SAMPLE CARD AND WAFER INSPECTION DEVICES
TWI371594B (en) Testing device and testing method
TWI369499B (en) Test apparatus, probe card, and test method
EP1927850A4 (en) BIOSENSOR MEASURING DEVICE, BIOSENSOR MEASURING SYSTEM AND BIOSENSOR MEASURING PROCEDURES
TWI350382B (en) Measuring device, measuring method, and test apparatus
EP2028500A4 (en) SEMICONDUCTOR ERROR ANALYSIS DEVICE, ERROR ANALYSIS PROCEDURE AND ERROR ANALYSIS PROGRAM
EP2028502A4 (en) SEMICONDUCTOR DEFECT ANALYSIS DEVICE, DEFECT ANALYSIS METHOD AND PROGRAM
EP1990634A4 (en) BIOSENSOR-CHIP, BIOSENSOR-SYSTEM AND MEASURING DEVICE FOR THIS
EP1811310A4 (en) SONDER TO WAFER INSPECTION, OTHER CARDS TO WAFER INSPECTION AND WAFER INSPECTION DEVICE
EP2174593A4 (en) BLOOD TEST DEVICE AND TESTING METHOD
TWI367339B (en) Test apparatus and test method for semiconductor