TWI372429B - - Google Patents

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Publication number
TWI372429B
TWI372429B TW097129609A TW97129609A TWI372429B TW I372429 B TWI372429 B TW I372429B TW 097129609 A TW097129609 A TW 097129609A TW 97129609 A TW97129609 A TW 97129609A TW I372429 B TWI372429 B TW I372429B
Authority
TW
Taiwan
Application number
TW097129609A
Other languages
Chinese (zh)
Other versions
TW201007864A (en
Inventor
Toru Maeda
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW201007864A publication Critical patent/TW201007864A/zh
Application granted granted Critical
Publication of TWI372429B publication Critical patent/TWI372429B/zh

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Classifications

    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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US7743964B2 (en) 2010-06-29
KR100979472B1 (ko) 2010-09-02
KR20090096733A (ko) 2009-09-14
CN101681849B (zh) 2011-09-21
TWI377633B (fr) 2012-11-21
KR100979471B1 (ko) 2010-09-02
KR20090106546A (ko) 2009-10-09
US7726546B2 (en) 2010-06-01
US20100093131A1 (en) 2010-04-15
TW201007860A (en) 2010-02-16
CN101681850B (zh) 2011-08-10
JP2008218474A (ja) 2008-09-18
CN101681850A (zh) 2010-03-24
JP4361572B2 (ja) 2009-11-11
TW201007864A (en) 2010-02-16
WO2008105425A1 (fr) 2008-09-04
WO2008105426A1 (fr) 2008-09-04
US20100089980A1 (en) 2010-04-15

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