TWI361463B - - Google Patents

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Publication number
TWI361463B
TWI361463B TW094129403A TW94129403A TWI361463B TW I361463 B TWI361463 B TW I361463B TW 094129403 A TW094129403 A TW 094129403A TW 94129403 A TW94129403 A TW 94129403A TW I361463 B TWI361463 B TW I361463B
Authority
TW
Taiwan
Prior art keywords
rti
exhaust
exhaust port
heater
processing container
Prior art date
Application number
TW094129403A
Other languages
English (en)
Chinese (zh)
Other versions
TW200623262A (en
Inventor
Wataru Nakajima
Takuya Oikawa
Hisashi Inoue
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200623262A publication Critical patent/TW200623262A/zh
Application granted granted Critical
Publication of TWI361463B publication Critical patent/TWI361463B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
TW094129403A 2004-08-26 2005-08-26 Vertical heat treatment apparatus and method of rapid heat reduction of its treatment container TW200623262A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004246578A JP4503397B2 (ja) 2004-08-26 2004-08-26 縦型熱処理装置及びその処理容器急速降温方法

Publications (2)

Publication Number Publication Date
TW200623262A TW200623262A (en) 2006-07-01
TWI361463B true TWI361463B (enExample) 2012-04-01

Family

ID=35967511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129403A TW200623262A (en) 2004-08-26 2005-08-26 Vertical heat treatment apparatus and method of rapid heat reduction of its treatment container

Country Status (7)

Country Link
US (1) US7935188B2 (enExample)
EP (1) EP1801862A4 (enExample)
JP (1) JP4503397B2 (enExample)
KR (1) KR100958766B1 (enExample)
CN (1) CN100474525C (enExample)
TW (1) TW200623262A (enExample)
WO (1) WO2006022303A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4791303B2 (ja) * 2006-09-19 2011-10-12 株式会社日立国際電気 基板処理装置およびこの装置に用いられる冷却手段、ｉｃの製造方法
JP4335908B2 (ja) * 2006-12-22 2009-09-30 東京エレクトロン株式会社 縦型熱処理装置及び縦型熱処理方法
KR101387817B1 (ko) * 2007-02-19 2014-04-21 닛폰 하츠죠 가부시키가이샤 열교환기 및 종형 열처리장치
JP5504793B2 (ja) * 2009-09-26 2014-05-28 東京エレクトロン株式会社 熱処理装置及び冷却方法
KR101094279B1 (ko) * 2009-11-06 2011-12-19 삼성모바일디스플레이주식회사 가열 수단 및 이를 포함하는 기판 가공 장치
CN102925873A (zh) * 2011-08-09 2013-02-13 北京北方微电子基地设备工艺研究中心有限责任公司 反应腔室控温装置及应用该控温装置的半导体处理设备
TWI442013B (zh) * 2011-10-04 2014-06-21 Kern Energy Entpr Co Ltd 熱處理爐結構
JP6616265B2 (ja) * 2015-10-16 2019-12-04 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 加熱部、基板処理装置、及び半導体装置の製造方法
CN113140487B (zh) * 2021-04-14 2024-05-17 北京北方华创微电子装备有限公司 半导体热处理设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753192A (en) * 1987-01-08 1988-06-28 Btu Engineering Corporation Movable core fast cool-down furnace
DE8801785U1 (de) * 1988-02-11 1988-11-10 Söhlbrand, Heinrich, Dr. Dipl.-Chem., 8027 Neuried Vorrichtung zur Temperaturbehandlung von Halbleitermaterialien
JPH0645335A (ja) 1992-07-24 1994-02-18 Nec Corp 半導体装置の配線修正装置
JP2586600Y2 (ja) * 1992-11-19 1998-12-09 大日本スクリーン製造株式会社 基板加熱処理装置
JP3218164B2 (ja) * 1995-05-31 2001-10-15 東京エレクトロン株式会社 被処理体の支持ボート、熱処理装置及び熱処理方法
JPH0997787A (ja) * 1995-09-30 1997-04-08 Tokyo Electron Ltd 処理装置
US6121579A (en) * 1996-02-28 2000-09-19 Tokyo Electron Limited Heating apparatus, and processing apparatus
US20030164225A1 (en) * 1998-04-20 2003-09-04 Tadashi Sawayama Processing apparatus, exhaust processing process and plasma processing
JP4036598B2 (ja) * 2000-03-31 2008-01-23 株式会社日立国際電気 熱処理装置
JP2003209063A (ja) * 2001-11-08 2003-07-25 Tokyo Electron Ltd 熱処理装置および熱処理方法
US7256370B2 (en) * 2002-03-15 2007-08-14 Steed Technology, Inc. Vacuum thermal annealer

Also Published As

Publication number Publication date
TW200623262A (en) 2006-07-01
JP4503397B2 (ja) 2010-07-14
US7935188B2 (en) 2011-05-03
CN100474525C (zh) 2009-04-01
US20080187652A1 (en) 2008-08-07
EP1801862A1 (en) 2007-06-27
KR20070044798A (ko) 2007-04-30
KR100958766B1 (ko) 2010-05-18
EP1801862A4 (en) 2009-03-11
WO2006022303A1 (ja) 2006-03-02
JP2006066590A (ja) 2006-03-09
CN1842898A (zh) 2006-10-04

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MM4A Annulment or lapse of patent due to non-payment of fees