TWI360373B - - Google Patents

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Publication number
TWI360373B
TWI360373B TW94109133A TW94109133A TWI360373B TW I360373 B TWI360373 B TW I360373B TW 94109133 A TW94109133 A TW 94109133A TW 94109133 A TW94109133 A TW 94109133A TW I360373 B TWI360373 B TW I360373B
Authority
TW
Taiwan
Prior art keywords
resin
substrate
printed wiring
wiring board
flexible printed
Prior art date
Application number
TW94109133A
Other languages
English (en)
Chinese (zh)
Other versions
TW200537996A (en
Inventor
Shuji Ogami
Masahiro Kanno
Ichiro Higasayama
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200537996A publication Critical patent/TW200537996A/zh
Application granted granted Critical
Publication of TWI360373B publication Critical patent/TWI360373B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW94109133A 2004-03-24 2005-03-24 Method for producing substrate for flexible printed wiring board TW200537996A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004087162A JP4360956B2 (ja) 2004-03-24 2004-03-24 フレキシブルプリント配線板用基板の製造方法

Publications (2)

Publication Number Publication Date
TW200537996A TW200537996A (en) 2005-11-16
TWI360373B true TWI360373B (enrdf_load_stackoverflow) 2012-03-11

Family

ID=34993535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94109133A TW200537996A (en) 2004-03-24 2005-03-24 Method for producing substrate for flexible printed wiring board

Country Status (3)

Country Link
JP (1) JP4360956B2 (enrdf_load_stackoverflow)
TW (1) TW200537996A (enrdf_load_stackoverflow)
WO (1) WO2005090070A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684601B2 (ja) * 2004-08-26 2011-05-18 新日鐵化学株式会社 フレキシブル積層基板の製造法
JP4790582B2 (ja) * 2006-12-12 2011-10-12 新日鐵化学株式会社 高屈曲性フレキシブル銅張積層板の製造方法
DE112008003735T5 (de) * 2008-02-29 2011-02-17 Yasui Seiki Co., Ltd. Vorrichtung zur Produktion einer Verbundmaterialfolienbahn

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157286A (ja) * 1984-01-27 1985-08-17 株式会社日立製作所 フレキシブルプリント基板の製造方法
JPH0753801B2 (ja) * 1986-12-25 1995-06-07 住友ベークライト株式会社 フレキシブルプリント回路用基板の製造方法
JP2893432B2 (ja) * 1991-12-11 1999-05-24 新日鐵化学株式会社 フレキシブルプリント配線用基板の製造方法
JPH10138318A (ja) * 1996-09-13 1998-05-26 Ube Ind Ltd 多層押出しポリイミドフィルムの製法
JP2002240195A (ja) * 2001-02-19 2002-08-28 Ube Ind Ltd ポリイミド銅張板

Also Published As

Publication number Publication date
WO2005090070A1 (ja) 2005-09-29
JP4360956B2 (ja) 2009-11-11
JP2005271374A (ja) 2005-10-06
TW200537996A (en) 2005-11-16

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