TWI354344B - - Google Patents
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- Publication number
- TWI354344B TWI354344B TW096137279A TW96137279A TWI354344B TW I354344 B TWI354344 B TW I354344B TW 096137279 A TW096137279 A TW 096137279A TW 96137279 A TW96137279 A TW 96137279A TW I354344 B TWI354344 B TW I354344B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- liquid
- processing
- rinsing
- cup cover
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims description 530
- 239000000758 substrate Substances 0.000 claims description 411
- 238000012545 processing Methods 0.000 claims description 234
- 238000011282 treatment Methods 0.000 claims description 102
- 238000000034 method Methods 0.000 claims description 100
- 230000007246 mechanism Effects 0.000 claims description 81
- 230000008569 process Effects 0.000 claims description 78
- 230000002093 peripheral effect Effects 0.000 claims description 64
- 238000004140 cleaning Methods 0.000 claims description 54
- 230000001965 increasing effect Effects 0.000 claims description 35
- 238000005406 washing Methods 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 13
- 238000011010 flushing procedure Methods 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 7
- 230000008439 repair process Effects 0.000 claims description 2
- 230000001174 ascending effect Effects 0.000 claims 2
- 230000003247 decreasing effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 106
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 27
- 239000000243 solution Substances 0.000 description 16
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 15
- 239000002253 acid Substances 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 239000003513 alkali Substances 0.000 description 13
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 12
- 238000007599 discharging Methods 0.000 description 11
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 238000011084 recovery Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 229910021529 ammonia Inorganic materials 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 229940079593 drug Drugs 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006274304 | 2006-10-05 | ||
| JP2006274303 | 2006-10-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200832587A TW200832587A (en) | 2008-08-01 |
| TWI354344B true TWI354344B (enExample) | 2011-12-11 |
Family
ID=39268593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096137279A TW200832587A (en) | 2006-10-05 | 2007-10-04 | Substrate processing equipment, substrate processing method and cleaning method of exhaust liquid cup |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8152933B2 (enExample) |
| JP (1) | JP4723001B2 (enExample) |
| KR (1) | KR100945768B1 (enExample) |
| TW (1) | TW200832587A (enExample) |
| WO (1) | WO2008041741A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100979979B1 (ko) * | 2006-07-26 | 2010-09-03 | 도쿄엘렉트론가부시키가이샤 | 액처리 장치 및 액처리 방법 |
| JP5390824B2 (ja) * | 2008-10-10 | 2014-01-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5420222B2 (ja) * | 2008-10-10 | 2014-02-19 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5401255B2 (ja) * | 2008-11-05 | 2014-01-29 | 東京エレクトロン株式会社 | 洗浄装置、洗浄方法、および記憶媒体 |
| KR101678229B1 (ko) * | 2010-03-24 | 2016-11-21 | 도쿄엘렉트론가부시키가이샤 | 액처리 장치, 액처리 방법, 및 그 액처리 방법을 실행시키기 위한 프로그램을 기록한 기록 매체 |
| JP5546472B2 (ja) * | 2010-03-24 | 2014-07-09 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体 |
| JP5864232B2 (ja) * | 2011-02-01 | 2016-02-17 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
| JP5890108B2 (ja) | 2011-04-27 | 2016-03-22 | 株式会社Ｓｃｒｅｅｎホールディングス | 洗浄処理方法 |
| CN103801527B (zh) * | 2012-11-13 | 2015-08-26 | 沈阳芯源微电子设备有限公司 | 一种光刻胶收集杯自动清洗系统 |
| JP6250973B2 (ja) * | 2013-08-08 | 2017-12-20 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6229933B2 (ja) * | 2013-09-27 | 2017-11-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 処理カップ洗浄方法、基板処理方法および基板処理装置 |
| KR102549285B1 (ko) | 2015-11-14 | 2023-06-28 | 도쿄엘렉트론가부시키가이샤 | 묽은 tmah을 사용하여 마이크로전자 기판을 처리하는 방법 |
| JP6845696B2 (ja) * | 2016-02-25 | 2021-03-24 | 芝浦メカトロニクス株式会社 | 基板処理装置、基板処理方法及び基板の製造方法 |
| JP6513048B2 (ja) * | 2016-03-28 | 2019-05-15 | 東京エレクトロン株式会社 | 液処理装置 |
| JP6722532B2 (ja) * | 2016-07-19 | 2020-07-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および処理カップ洗浄方法 |
| JP6836912B2 (ja) | 2017-01-17 | 2021-03-03 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体 |
| US11747742B2 (en) * | 2017-04-11 | 2023-09-05 | Visera Technologies Company Limited | Apparatus and method for removing photoresist layer from alignment mark |
| JP6983602B2 (ja) * | 2017-09-26 | 2021-12-17 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
| JP6513774B2 (ja) * | 2017-11-24 | 2019-05-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP6735384B2 (ja) * | 2019-04-09 | 2020-08-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| JP7438015B2 (ja) * | 2020-05-01 | 2024-02-26 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7752985B2 (ja) * | 2021-07-21 | 2025-10-14 | ダイキンファインテック株式会社 | 基板処理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136528A (ja) * | 1986-11-27 | 1988-06-08 | Mitsubishi Electric Corp | 処理液塗布装置 |
| SG76527A1 (en) * | 1996-09-24 | 2000-11-21 | Tokyo Electron Ltd | Method and apparatus for cleaning treatment |
| US6207231B1 (en) * | 1997-05-07 | 2001-03-27 | Tokyo Electron Limited | Coating film forming method and coating apparatus |
| JP3587723B2 (ja) * | 1999-04-30 | 2004-11-10 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| JP2002368066A (ja) | 2001-06-06 | 2002-12-20 | Tokyo Electron Ltd | 処理装置 |
-
2007
- 2007-10-04 WO PCT/JP2007/069455 patent/WO2008041741A1/ja not_active Ceased
- 2007-10-04 KR KR1020087006814A patent/KR100945768B1/ko active Active
- 2007-10-04 JP JP2008537547A patent/JP4723001B2/ja not_active Expired - Fee Related
- 2007-10-04 US US12/308,395 patent/US8152933B2/en not_active Expired - Fee Related
- 2007-10-04 TW TW096137279A patent/TW200832587A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200832587A (en) | 2008-08-01 |
| KR100945768B1 (ko) | 2010-03-08 |
| WO2008041741A1 (en) | 2008-04-10 |
| JP4723001B2 (ja) | 2011-07-13 |
| JPWO2008041741A1 (ja) | 2010-02-04 |
| US20100212701A1 (en) | 2010-08-26 |
| US8152933B2 (en) | 2012-04-10 |
| KR20080056165A (ko) | 2008-06-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |