TWI343936B - - Google Patents

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Publication number
TWI343936B
TWI343936B TW93125545A TW93125545A TWI343936B TW I343936 B TWI343936 B TW I343936B TW 93125545 A TW93125545 A TW 93125545A TW 93125545 A TW93125545 A TW 93125545A TW I343936 B TWI343936 B TW I343936B
Authority
TW
Taiwan
Prior art keywords
heat
group
dissipating member
mass
component
Prior art date
Application number
TW93125545A
Other languages
English (en)
Chinese (zh)
Other versions
TW200508323A (en
Inventor
Hiroaki Tetsuka
Tsutomu Yoneyama
Kunihiko Mita
Takahiro Maruyama
Akihiro Endo
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200508323A publication Critical patent/TW200508323A/zh
Application granted granted Critical
Publication of TWI343936B publication Critical patent/TWI343936B/zh

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  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
TW093125545A 2003-08-25 2004-08-26 Heat dissipating member TW200508323A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003299471A JP3925805B2 (ja) 2003-08-25 2003-08-25 放熱部材

Publications (2)

Publication Number Publication Date
TW200508323A TW200508323A (en) 2005-03-01
TWI343936B true TWI343936B (ja) 2011-06-21

Family

ID=34404672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125545A TW200508323A (en) 2003-08-25 2004-08-26 Heat dissipating member

Country Status (4)

Country Link
JP (1) JP3925805B2 (ja)
KR (1) KR101058276B1 (ja)
CN (1) CN100420006C (ja)
TW (1) TW200508323A (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4901327B2 (ja) * 2005-07-25 2012-03-21 信越化学工業株式会社 放熱部材
EP1983568B1 (en) * 2006-01-26 2014-07-16 Momentive Performance Materials Japan LLC Heat dissipating member and semiconductor device using same
WO2008063709A2 (en) 2006-06-20 2008-05-29 Polyone Corporation Thermally conductive polymer compounds containing zinc sulfide
WO2008108482A1 (ja) 2007-03-06 2008-09-12 Teijin Limited ピッチ系炭素繊維、その製造方法および成形体
JP2009197052A (ja) * 2008-02-19 2009-09-03 Asahi Kasei E-Materials Corp 樹脂組成物
JP5819899B2 (ja) * 2013-09-11 2015-11-24 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
CN109196057B (zh) * 2016-05-31 2022-02-01 三井化学株式会社 导热性组合物
CN108598254A (zh) * 2018-04-19 2018-09-28 嘉盛半导体(苏州)有限公司 滤波器封装方法及封装结构
JP2023116884A (ja) 2022-02-10 2023-08-23 信越化学工業株式会社 熱伝導性組成物およびその硬化物
WO2024195826A1 (ja) * 2023-03-22 2024-09-26 タツタ電線株式会社 放熱シート積層体
WO2024204441A1 (ja) * 2023-03-29 2024-10-03 バンドー化学株式会社 熱伝導性組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
JP3195277B2 (ja) 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
US5969035A (en) * 1998-02-06 1999-10-19 Dow Corning Thickening of low molecular weight siloxanes with acrylate/methacrylate polyether grafted silicone elastomers
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
WO2002091465A1 (en) * 2001-04-23 2002-11-14 Shin-Etsu Chemical Co., Ltd. Heat radiating member
JP2002363406A (ja) 2001-06-08 2002-12-18 Ge Toshiba Silicones Co Ltd シリコーンゴム組成物
JP2003113308A (ja) * 2001-08-02 2003-04-18 Tokai Rubber Ind Ltd 導電性シリコーンゴム組成物およびそれを用いて得られた導電性シート
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP3844125B2 (ja) * 2002-01-22 2006-11-08 信越化学工業株式会社 放熱部材、その製造方法及びその敷設方法
CA2474740C (en) * 2002-02-06 2011-10-11 Parker-Hannifin Corporation Thermal management materials having a phase change dispersion

Also Published As

Publication number Publication date
KR20050022366A (ko) 2005-03-07
KR101058276B1 (ko) 2011-08-22
CN1591847A (zh) 2005-03-09
CN100420006C (zh) 2008-09-17
JP2005072220A (ja) 2005-03-17
JP3925805B2 (ja) 2007-06-06
TW200508323A (en) 2005-03-01

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