TW200508323A - Heat dissipating member - Google Patents
Heat dissipating memberInfo
- Publication number
- TW200508323A TW200508323A TW093125545A TW93125545A TW200508323A TW 200508323 A TW200508323 A TW 200508323A TW 093125545 A TW093125545 A TW 093125545A TW 93125545 A TW93125545 A TW 93125545A TW 200508323 A TW200508323 A TW 200508323A
- Authority
- TW
- Taiwan
- Prior art keywords
- thermally conductive
- electronic apparatus
- heat
- sheet
- heat dissipating
- Prior art date
Links
Landscapes
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oil, Petroleum & Natural Gas (AREA)
Abstract
To transfer heat released from a heating electronic part efficiently to a heat dissipating part so as to markedly improve a heating electronic part or an electronic apparatus equipped with it in service life in a thermally conductive sheet used for a general power supply, an electronic apparatus or the like and a thermally conductive member which is used for dissipating heat released from an integrated circuit element, such as LSI, CPU or the like, of an electronic apparatus, such as a personal computer, a digital video disk driver or the like. A heat-softening thermally conductive composition composed of 100 wt. parts thermoplastic silicone resin (A) and 500 to 2,000 wt. parts thermally conductive filler (B) having an average particle diameter of 0.1 to 5.0 μm (filler whose particle diameter is above 15 μm is 1 mass% or below in content) is formed into a sheet, and the sheet is made to server as a heat dissipating member.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003299471A JP3925805B2 (en) | 2003-08-25 | 2003-08-25 | Heat dissipation member |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200508323A true TW200508323A (en) | 2005-03-01 |
TWI343936B TWI343936B (en) | 2011-06-21 |
Family
ID=34404672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093125545A TW200508323A (en) | 2003-08-25 | 2004-08-26 | Heat dissipating member |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3925805B2 (en) |
KR (1) | KR101058276B1 (en) |
CN (1) | CN100420006C (en) |
TW (1) | TW200508323A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI462968B (en) * | 2006-01-26 | 2014-12-01 | Momentive Performance Mat Jp | A heat dissipating material and a semiconductor device using the same |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4901327B2 (en) * | 2005-07-25 | 2012-03-21 | 信越化学工業株式会社 | Heat dissipation member |
WO2008063709A2 (en) * | 2006-06-20 | 2008-05-29 | Polyone Corporation | Thermally conductive polymer compounds containing zinc sulfide |
WO2008108482A1 (en) | 2007-03-06 | 2008-09-12 | Teijin Limited | Pitch-derived carbon fiber, process for producing the same, and molded object |
JP2009197052A (en) * | 2008-02-19 | 2009-09-03 | Asahi Kasei E-Materials Corp | Resin composition |
JP5819899B2 (en) * | 2013-09-11 | 2015-11-24 | 日東電工株式会社 | Flip chip type film for semiconductor back surface and use thereof |
CN109196057B (en) * | 2016-05-31 | 2022-02-01 | 三井化学株式会社 | Thermally conductive composition |
CN108598254A (en) * | 2018-04-19 | 2018-09-28 | 嘉盛半导体(苏州)有限公司 | Filter package method and encapsulating structure |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
JP3195277B2 (en) | 1997-08-06 | 2001-08-06 | 信越化学工業株式会社 | Thermal conductive silicone composition |
US5969035A (en) * | 1998-02-06 | 1999-10-19 | Dow Corning | Thickening of low molecular weight siloxanes with acrylate/methacrylate polyether grafted silicone elastomers |
US6391442B1 (en) * | 1999-07-08 | 2002-05-21 | Saint-Gobain Performance Plastics Corporation | Phase change thermal interface material |
JP4054986B2 (en) * | 2001-04-23 | 2008-03-05 | 信越化学工業株式会社 | Heat dissipation member |
JP2002363406A (en) | 2001-06-08 | 2002-12-18 | Ge Toshiba Silicones Co Ltd | Silicone rubber composition |
JP2003113308A (en) * | 2001-08-02 | 2003-04-18 | Tokai Rubber Ind Ltd | Electroconductive silicone rubber composition and electroconductive sheet obtained by using the same |
JP3803058B2 (en) * | 2001-12-11 | 2006-08-02 | 信越化学工業株式会社 | Thermally conductive silicone composition, cured product thereof, laying method, and heat dissipation structure of semiconductor device using the same |
JP3844125B2 (en) * | 2002-01-22 | 2006-11-08 | 信越化学工業株式会社 | Heat dissipating member, manufacturing method thereof and laying method thereof |
CA2474740C (en) * | 2002-02-06 | 2011-10-11 | Parker-Hannifin Corporation | Thermal management materials having a phase change dispersion |
-
2003
- 2003-08-25 JP JP2003299471A patent/JP3925805B2/en not_active Expired - Fee Related
-
2004
- 2004-08-12 CN CNB2004100566788A patent/CN100420006C/en active Active
- 2004-08-24 KR KR20040066750A patent/KR101058276B1/en active IP Right Grant
- 2004-08-26 TW TW093125545A patent/TW200508323A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI462968B (en) * | 2006-01-26 | 2014-12-01 | Momentive Performance Mat Jp | A heat dissipating material and a semiconductor device using the same |
Also Published As
Publication number | Publication date |
---|---|
CN1591847A (en) | 2005-03-09 |
CN100420006C (en) | 2008-09-17 |
TWI343936B (en) | 2011-06-21 |
JP3925805B2 (en) | 2007-06-06 |
KR20050022366A (en) | 2005-03-07 |
KR101058276B1 (en) | 2011-08-22 |
JP2005072220A (en) | 2005-03-17 |
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