TW200508323A - Heat dissipating member - Google Patents

Heat dissipating member

Info

Publication number
TW200508323A
TW200508323A TW093125545A TW93125545A TW200508323A TW 200508323 A TW200508323 A TW 200508323A TW 093125545 A TW093125545 A TW 093125545A TW 93125545 A TW93125545 A TW 93125545A TW 200508323 A TW200508323 A TW 200508323A
Authority
TW
Taiwan
Prior art keywords
thermally conductive
electronic apparatus
heat
sheet
heat dissipating
Prior art date
Application number
TW093125545A
Other languages
Chinese (zh)
Other versions
TWI343936B (en
Inventor
Hiroaki Tetsuka
Tsutomu Yoneyama
Kunihiko Mita
Takahiro Maruyama
Akihiro Endo
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200508323A publication Critical patent/TW200508323A/en
Application granted granted Critical
Publication of TWI343936B publication Critical patent/TWI343936B/zh

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Oil, Petroleum & Natural Gas (AREA)

Abstract

To transfer heat released from a heating electronic part efficiently to a heat dissipating part so as to markedly improve a heating electronic part or an electronic apparatus equipped with it in service life in a thermally conductive sheet used for a general power supply, an electronic apparatus or the like and a thermally conductive member which is used for dissipating heat released from an integrated circuit element, such as LSI, CPU or the like, of an electronic apparatus, such as a personal computer, a digital video disk driver or the like. A heat-softening thermally conductive composition composed of 100 wt. parts thermoplastic silicone resin (A) and 500 to 2,000 wt. parts thermally conductive filler (B) having an average particle diameter of 0.1 to 5.0 μm (filler whose particle diameter is above 15 μm is 1 mass% or below in content) is formed into a sheet, and the sheet is made to server as a heat dissipating member.
TW093125545A 2003-08-25 2004-08-26 Heat dissipating member TW200508323A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003299471A JP3925805B2 (en) 2003-08-25 2003-08-25 Heat dissipation member

Publications (2)

Publication Number Publication Date
TW200508323A true TW200508323A (en) 2005-03-01
TWI343936B TWI343936B (en) 2011-06-21

Family

ID=34404672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125545A TW200508323A (en) 2003-08-25 2004-08-26 Heat dissipating member

Country Status (4)

Country Link
JP (1) JP3925805B2 (en)
KR (1) KR101058276B1 (en)
CN (1) CN100420006C (en)
TW (1) TW200508323A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462968B (en) * 2006-01-26 2014-12-01 Momentive Performance Mat Jp A heat dissipating material and a semiconductor device using the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4901327B2 (en) * 2005-07-25 2012-03-21 信越化学工業株式会社 Heat dissipation member
WO2008063709A2 (en) * 2006-06-20 2008-05-29 Polyone Corporation Thermally conductive polymer compounds containing zinc sulfide
WO2008108482A1 (en) 2007-03-06 2008-09-12 Teijin Limited Pitch-derived carbon fiber, process for producing the same, and molded object
JP2009197052A (en) * 2008-02-19 2009-09-03 Asahi Kasei E-Materials Corp Resin composition
JP5819899B2 (en) * 2013-09-11 2015-11-24 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
CN109196057B (en) * 2016-05-31 2022-02-01 三井化学株式会社 Thermally conductive composition
CN108598254A (en) * 2018-04-19 2018-09-28 嘉盛半导体(苏州)有限公司 Filter package method and encapsulating structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
JP3195277B2 (en) 1997-08-06 2001-08-06 信越化学工業株式会社 Thermal conductive silicone composition
US5969035A (en) * 1998-02-06 1999-10-19 Dow Corning Thickening of low molecular weight siloxanes with acrylate/methacrylate polyether grafted silicone elastomers
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
JP4054986B2 (en) * 2001-04-23 2008-03-05 信越化学工業株式会社 Heat dissipation member
JP2002363406A (en) 2001-06-08 2002-12-18 Ge Toshiba Silicones Co Ltd Silicone rubber composition
JP2003113308A (en) * 2001-08-02 2003-04-18 Tokai Rubber Ind Ltd Electroconductive silicone rubber composition and electroconductive sheet obtained by using the same
JP3803058B2 (en) * 2001-12-11 2006-08-02 信越化学工業株式会社 Thermally conductive silicone composition, cured product thereof, laying method, and heat dissipation structure of semiconductor device using the same
JP3844125B2 (en) * 2002-01-22 2006-11-08 信越化学工業株式会社 Heat dissipating member, manufacturing method thereof and laying method thereof
CA2474740C (en) * 2002-02-06 2011-10-11 Parker-Hannifin Corporation Thermal management materials having a phase change dispersion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462968B (en) * 2006-01-26 2014-12-01 Momentive Performance Mat Jp A heat dissipating material and a semiconductor device using the same

Also Published As

Publication number Publication date
CN1591847A (en) 2005-03-09
CN100420006C (en) 2008-09-17
TWI343936B (en) 2011-06-21
JP3925805B2 (en) 2007-06-06
KR20050022366A (en) 2005-03-07
KR101058276B1 (en) 2011-08-22
JP2005072220A (en) 2005-03-17

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