CN1591847A - Heat radiating component - Google Patents
Heat radiating component Download PDFInfo
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- CN1591847A CN1591847A CN 200410056678 CN200410056678A CN1591847A CN 1591847 A CN1591847 A CN 1591847A CN 200410056678 CN200410056678 CN 200410056678 CN 200410056678 A CN200410056678 A CN 200410056678A CN 1591847 A CN1591847 A CN 1591847A
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- thermal
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- heat
- thermal component
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- 239000000203 mixture Substances 0.000 claims abstract description 52
- 239000002245 particle Substances 0.000 claims abstract description 18
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 11
- 229920002050 silicone resin Polymers 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 28
- -1 polysiloxanes Polymers 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 238000012856 packing Methods 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- 229920002545 silicone oil Polymers 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 230000020169 heat generation Effects 0.000 claims description 9
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000005060 rubber Substances 0.000 claims description 8
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
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- 125000003118 aryl group Chemical group 0.000 description 2
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
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- 239000010951 brass Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
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- 229910000420 cerium oxide Inorganic materials 0.000 description 1
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- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- 239000004408 titanium dioxide Substances 0.000 description 1
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- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oil, Petroleum & Natural Gas (AREA)
Abstract
To transfer heat released from a heating electronic part efficiently to a heat dissipating part so as to markedly improve a heating electronic part or an electronic apparatus equipped with it in service life in a thermally conductive sheet used for a general power supply, an electronic apparatus or the like and a thermally conductive member which is used for dissipating heat released from an integrated circuit element, such as LSI, CPU or the like, of an electronic apparatus, such as a personal computer, a digital video disk driver or the like. A heat-softening thermally conductive composition composed of 100 pts.mass thermoplastic silicone resin (A) and 500 to 2,000 pts.mass thermally conductive filler (B) having an average particle diameter of 0.1 to 5.0 [mu]m (filler whose particle diameter is above 15 [mu]m is 1 mass% or below in content) is formed into a sheet, and the sheet is made to server as a heat dissipating member.
Description
Technical field
The present invention relates to be inserted into the heat-transfer matcrial at the hot interface between the thermal component of heat generation electronic unit and fin or metal basket etc. for cooling electronic components.Particularly relate under the temperature in the electronic unit operating temperature range, viscosity descends, softening or fusion, thereby improves the adaptation to hot interface, improves from the thermal component of heat generation electronic unit to the heat transmission of radiating part.
Background technology
The complexity of the circuit design of modern electrical equipment such as television set, video recorder, computer, medical apparatus, office equipment, communication device increases, and can make to include hundreds thousand of transistorized integrated circuits.Be accompanied by miniaturization, the high performance of electrical equipment, these electronic unit numbers of installing on littler area increase, and simultaneously, the shape of electronic unit itself is also continuing miniaturization.Therefore, the heat that each electronic unit produces is increasing, because of this heat causes that fault or performance are incomplete, so the mounting technique of efficiently radiates heat becomes important.
In the electronic units such as the CPU that in electrical equipment such as personal computer, digital recording dish, mobile phone, uses, drive IC, memory, in order to remove the heat that is accompanied by the integrated level raising and produces, there is scheme to propose the thermal component that uses in multiple heat dissipating method and this method.
In the past, rose, adopted the method for carrying out direct heat transfer by high metal fins of thermal conductivity such as aluminium, copper, brass in order to suppress middle temperature of electronic component such as electrical equipment.This fin transmits the heat that is produced by electronic unit, and the temperature difference of utilization and extraneous gas should heat shed from the surface.For the heat that electronic unit is produced reaches fin efficiently, fin and electronic unit must carry out driving fit in tight ground, and soft conducting strip with flexibility or heat-conductive lubricating grease (グ リ one ス) are inserted between electronic unit and the fin.
Summary of the invention
Yet the processing operation of soft conducting strip is good, but be difficult to make very thin, in addition owing to can not follow the trickle concavo-convex of electronic unit and fin surface, so it is big that contact heat resistance becomes, the problem that existence can not effectively be conducted heat.
On the other hand,, go back the trickle concavo-convex of landfill surface, can significantly reduce thermal resistance thus because the thin thickness of heat-conductive lubricating grease can reduce the distance between electronic unit and the fin.Yet the handling property of heat-conductive lubricating grease is bad, pollutes surrounding environment, and thermal cycle causes oil content to separate (pumping), and hot property descends, and this is a problem.
In recent years, thermal conductivity parts as low thermal resistanceization two aspect characteristics of processing with soft conducting strip and heat-conductive lubricating grease, have multiple scheme to propose at room temperature to be the good solid, shaped of the property handled, and the heat that electronic unit produces make its thermal softening material softening or fusion.
Special table 2000-509209 communique has proposed the thermally conductive materials that acrylic psa and the hot plasticizer of alpha-olefines and thermal conductivity filler constitute, or the thermally conductive materials (Patent Document 1) of paraffin and thermal conductivity filler formation.
The spy opens the heat conductivity composition (Patent Document 2) that the proposition of 2000-336279 communique is made of thermoplastic resin, wax, thermal conductivity filler.
The spy opens the 2001-89756 communique, and to propose polymer, carbon number by acrylic acid etc. be the thermal medium material (Patent Document 3) that fusing point composition such as 12～16 alcohol, pertroleum wax and thermal conductivity filler constitute.
The spy opens the thermal softening fin (Patent Document 4) that the proposition of 2002-121332 communique is made of polyolefin and thermal conductivity filler.
Yet above-mentioned these all are to be base material with the organic substance, rather than flame-retardant materials.In addition, when on automobile, these materials being installed, worry that Yin Gaowen causes deterioration.
On the other hand, as thermal endurance, weatherability, anti-flammability excellent material, known polysiloxane, having a lot of schemes to propose with the polysiloxanes is the same thermal softening material of base material.
The spy opens the 2000-327917 communique and proposes the composition (Patent Document 5) that is made of thermoplastic silicone resin and wax shape modified polysiloxane resin and thermal conductivity filler.
The spy opens the 2001-291807 communique and proposes the conducting strip (Patent Document 6) that is made of resin of binding property such as organopolysiloxane gel and wax and thermal conductivity packing material.
The spy opens the 2002-234952 communique and proposes to become when being heated by high-molecular gel such as polysiloxanes and modified polyorganosiloxane, wax etc. the compound of liquid and thermal softening fin (Patent Document 7) that the thermal conductivity filler constitutes.
Yet these schemes are except that polysiloxanes, owing to adopt organic substance such as wax or with polysiloxane-modified wax, so its shortcoming is to compare with independent polysiloxanes, anti-flammability, thermal endurance variation.
[Patent Document 1] special table 2000-509209 communique
[Patent Document 2] spy opens the 2000-336279 communique
[Patent Document 3] spy opens the 2001-89756 communique
[Patent Document 4] spy opens the 2002-121332 communique
[Patent Document 5] spy opens the 2000-327917 communique
[Patent Document 6] spy opens the 2001-291807 communique
[Patent Document 7] spy opens the 2002-234952 communique
The present invention concentrates one's attention on to study in view of the above problems, the thermal component of the result provides following (1)～(5), when being configured in work, it reaches between the heat generation electronic unit of the temperature higher and the thermal component (interface) than room temperature, room temperature state before electronic unit work is an illiquidity, and, electronic unit when work heating or when configuration, heat artificially and cause lowering viscousity, soften or fusion, be filled in the interface of electronic unit and thermal component thus in fact tight, in this thermal component, by actual (real) thickness is diminished, make the thermal resistance of composition self significantly reduce fine heat radiation property thus:
(1) a kind of thermal component is characterized in that, following comprising (A) and thermal softening heat conductivity composition (B) are shaped to sheet:
(A) thermoplastic silicone resin 100 mass parts;
(B) average grain diameter is thermal conductivity packing material (wherein particle diameter surpasses the content of particle of maximum particle diameter 15 μ m at 1 quality % or below the 1 quality %) 500～2000 mass parts of 0.1～5.0 μ m.
(2) a kind of thermal component is characterized in that, the thermoplastic silicone resin of above-mentioned (A) composition comprises R
1SiO
3/2Unit (T unit) and R
1 2SiO
2/2Unit (D unit) (in the formula, R
1Be that carbon number is 1～10 the monovalence hydrocarbon that does not replace or replace).
(3) (1) and (2) described thermal component is characterized in that, comprise above-mentioned (A) composition and (B) viscosity when further adding 25 ℃ in the thermal softening heat conductivity composition of composition be silicone oil and/or the polysiloxanes raw rubber of 0.1～100Pas.
(4) a kind of thermal component is characterized in that, thermal conductivity is 0.5W/mK or more than the 0.5W/mK, the viscosity in the time of 80 ℃ is 1 * 10
2～1 * 10
5In the Pas scope.
(5) a kind of thermal component is characterized in that, above-mentioned thermal softening heat conductivity composition is being shaped in the thermal component of sheet, and thickness is 20～80 μ m.
The accompanying drawing summary
Fig. 1 is the product form figure of thermal component of the present invention
Symbol description
The barrier film that 1 peeling force is light slightly
The barrier film that 2 peeling forces are heavy slightly
3 thermal components
4 drawstrings (プ Le Block テ one プ)
Specific embodiments
Below the present invention is described in detail.
(A composition: the thermoplastic silicone resin)
As the thermoplastic silicone resin that constitutes thermal component medium of the present invention (matrix), as long as thermal component is solid (illiquidity) at normal temperature in fact, in uniform temperature, preferably below the maximum temperature that causes to the heating of heat generation electronic unit more than 40 ℃ or 40 ℃, concrete is about 40～150 ℃, particularly in the temperature range about 40～120 ℃, thermal softening, lowering viscousity or fusing take place, reaching flows gets final product.This medium is the factor that causes thermal softening, and the packing material of giving thermal conductivity is also had as the effect that the adhesive of processability and operation is provided.
The temperature of the thermal softening here, lowering viscousity or fusing is the temperature as thermal component, also can be polyorganosiloxane resin itself have be lower than 40 ℃ melting temperature.
As the medium that causes thermal softening, from above-mentioned polyorganosiloxane resin, select any all can, but contain R in order to keep illiquidity in room temperature, can to enumerate
1SiO
3/2Unit (below be called the T unit) and/or SiO
2The polymer of unit (below be called the Q unit) and they and R
1 2SiO
2/2The copolymer of unit (below be called the D unit).In addition, adding the silicone oil and the polysiloxanes raw rubber that are made of the D unit also can.Wherein, the polyorganosiloxane resin, the viscosity when containing the polyorganosiloxane resin of T unit and 25 ℃ that contain T unit and D unit are that the silicone oil of 0.1～100Pas and/or the combination of polysiloxanes raw rubber are preferred, the also available R of the end of polyorganosiloxane resin
1 3SiO
1/2Unit (M unit) sealing.
Above-mentioned R
1Be that carbon number is 1～10, preferred 1～6 the monovalence alkyl that does not replace or replace.This R
1Object lesson can enumerate alkyl such as methyl, ethyl, propyl group, isopropyl, butyl, isobutyl group, the tert-butyl group, amyl group, neopentyl, hexyl, cyclohexyl, octyl group, nonyl, decyl; Aryl such as phenyl, tolyl, xylyl, naphthyl; Aralkyl such as benzyl, phenylethyl, phenyl propyl; The part or all of group that replaced by halogen atoms such as fluorine, bromine, chlorine, cyano group etc. of hydrogen atom in thiazolinyl such as vinyl, pi-allyl, acrylic, isopropenyl, cyclobutenyl, hexenyl, cyclohexenyl group, octenyl and these groups, for example, chloromethyl, chloropropyl, bromoethyl, trifluoro propyl, cyanoethyl etc.Wherein, special preferable methyl, phenyl and vinyl.
To the polyorganosiloxane resin of (A) composition more specific description in addition.The polyorganosiloxane resin that uses among the present invention is the polyorganosiloxane resin that contains T unit and/or Q unit, designs with M unit and T unit or M unit and Q unit.The fragility when improving solid particularly, breakage when preventing to handle etc. and make good-toughness, importing the T unit is effectively, more preferably adopts the D unit.Here, as the substituting group (R of T unit
1), preferable methyl and phenyl, as the substituting group of D unit, preferable methyl, phenyl and vinyl.In addition, preferred 10: 90～90: 10 of the ratio of above-mentioned T unit and D unit, preferred especially 20: 80～80: 20.
In addition, can be from the synthetic polyorganosiloxane resin in normally used M unit and T unit or M unit and Q unit, past wherein mixing mainly is made of the D unit, end is that M unit, viscosity are silicone oil and/or the polysiloxanes raw rubber of 0.1～100Pas, improves fragility thus.Yet the polyorganosiloxane resin of thermal softening contains the T unit and when not containing the D unit, if add with the D unit as the above-mentioned silicone oil of principal component or polysiloxanes raw rubber etc., can obtain the handling property excellent material.
At this moment, softening point or fusing point (A) composition polyorganosiloxane resin 100 mass parts higher than normal temperature reach 1～100 mass parts with the D unit as the silicone oil of principal component or the addition of polysiloxanes raw rubber, preferred especially 2～10 mass parts relatively.When being lower than 1 mass parts, the property handled might can not get improving, and when greater than 100 mass parts, the mouldability of thin slice etc., supportive might worsen.
As mentioned above, (A) the composition polyorganosiloxane resin both can produce viscosity reduction to a certain degree, also can be used as the adhesive of packing material.(A) molecular weight of composition polyorganosiloxane resin is superior selects 500～20000, preferred especially 1000～10000.When the molecular weight of polyorganosiloxane resin was lower than 500, the viscosity during thermal softening was low excessively, have thermal cycle to cause the danger of pumping, and when being higher than 20000, the viscosity during thermal softening was too high, may reduce with the adaptation of electronic unit and thermal component.
In addition, as the polyorganosiloxane resin that uses among the present invention, suitable is to give thermal conductivity parts flexibility of the present invention and fusible resin.At this moment, both can use the polymer of unimodal molecular weight, and also can have been mixed the back to the different polymer more than 2 kinds or 2 kinds of molecular weight etc. and use.
(B composition: the thermal conductivity packing material)
The B composition thermal conductivity packing material that uses among the present invention be used for giving the thermal component thermal conductivity, average grain diameter is the thermal conductivity packing material of 0.1～5.0 μ m, and shared ratio must be at 1 quality % or below the quality % in whole (B) composition greater than the particle of maximum particle diameter 15 μ m.When average grain diameter during less than 0.1 μ m, resultant composition viscosity is too high, lacks extensibility, is difficult to be shaped to sheet or film etc.On the other hand, when average grain diameter during greater than 5.0 μ m, the surface of sheet or film becomes coarse, and then the space of electronic unit and thermal component is strengthened, and the danger that can not give full play to heat dispersion is arranged.Therefore, its average grain diameter must be in the scope of 0.1～5.0 μ m, particularly preferably in the scope of 1.0～3.5 μ m.
In addition, when shared ratio is higher than 1 quality % in whole thermal conductivity packing materials greater than the particle of maximum particle diameter 15 μ m, there is the danger of increasing in the space of electronic unit and thermal component, sometimes can not give full play to heat dispersion, so, preferred 0.5 quality % or below the 0.5 quality %, more preferably 0.1 quality % or below the 0.1 quality %.
(B) the thermal conductivity packing material of composition, as long as thermal conductivity is good, fusing point surpasses 250 ℃ and gets final product, and be not particularly limited, for example, can enumerate aluminium powder, oxide powder and zinc, alumina powder, boron nitride powder, aluminum nitride powder, silicon nitride powder, copper powder, silver powder, bortz powder, nickel powder, zinc powder, stainless steel powder, powdered carbon etc., but be not limited to these.These powder both can be spherical also can be indefinite shape, both can use separately also and can mix use more than 2 kinds or 2 kinds.When mixing use more than 2 kinds or 2 kinds, can improve heat dispersion, sheet material processability and operation etc.
(A) composition polyorganosiloxane resin 100 mass parts relatively, (B) use level of composition reaches 500～2000 mass parts, especially preferably reaches 600～1500 mass parts.When being lower than 500 mass parts, resultant composition lacks thermal conductivity, and when being higher than 2000 mass parts, processability, extensibility variation.(other additives)
In this composition,, adopt the alkoxy silane of general formula (1) expression more effective as improving (B) composition thermal conductivity packing material and (A) composition of the wetability of the thermoplastic silicone resin of composition:
R
2 aR
3 bSi(OR
4)
4-a-b?????(1)
In general formula (1), R
2The expression carbon number is 6～15 alkyl, and object lesson can be enumerated hexyl, octyl group, nonyl, decyl, dodecyl, myristyl etc.When carbon number less than 6 the time, with the wetability deficiency of thermal conductivity packing material, and, solidify at normal temperatures when greater than 15 the time, therefore handle inconveniently, and the thermal endurance of composition and anti-flammability descend.A is 1,2 or 3, preferred especially 1.In addition, R
3Be that carbon number is 1～8 saturated or unsaturated monovalence alkyl, object lesson can be enumerated alkyl such as methyl, ethyl, propyl group, hexyl, octyl group; Cycloalkyl such as cyclopenta, cyclohexyl; Thiazolinyl such as vinyl, pi-allyl; Aryl such as phenyl, tolyl; 2-phenylethyl, 2-methyl-aralkyl such as 2-phenylethyl; 3,3,3-trifluoro propyl, 2-(nine fluorine butyl) ethyl, 2-(17 fluorine octyl group) ethyl, right-halo alkyl such as chlorphenyl, special preferable methyl, ethyl.R
4The expression carbon number is 1～6 alkyl, can enumerate methyl, ethyl, propyl group, butyl, amyl group, hexyl etc., special preferable methyl, ethyl.
As the object lesson of the alkoxy silane of representing with above-mentioned general formula, can enumerate following material:
[changing 1]
C
6H
13Si(OCH
3)
3
[changing 2]
C
10H
21Si(OCH
3)
3
[changing 3]
C
12H
25Si(OCH
3)
3
[changing 4]
C
12H
25Si(OC
2H
5)
3
[changing 5]
C
10H
21Si(CH
3)(OCH
3)
2
[changing 6]
C
10H
21Si(C
6H
5)(OCH
3)
2
[changing 7]
C
10H
21Si(CH
3)(OC
2H
5)
2
[changing 8]
C
10H
21Si(CH＝CH
2)(OCH
3)
2
[changing 9]
C
10H
21Si(CH
2CH
2CF
3)(OCH
3)
2
Relative thermoplastic silicone 100 mass parts, its addition is in 0.01～20 mass parts scope, more preferably in 0.1～10 mass parts scope.When the addition of this organosilan is lower than 0.1 mass parts, the wetability variation of thermal conductivity packing material, the operation reduction, and when being higher than 20 mass parts, effect does not increase, unfavorable on the cost.
In thermal component of the present invention,, can also in not damaging the object of the invention scope, use common additive that in synthetic rubber, uses or packing material etc. as any composition.
Concrete is, also can add silicone oil, fluorine modified polyorganosiloxane surfactant as release agent, as the carbon black of colouring agent, titanium dioxide, iron oxide red etc., as metal oxide or metal hydroxidess such as the platinum catalyst of anti-flammability imparting agent, iron oxide, titanium oxide, cerium oxide, as the processing oil of processability improving agent, reactive titanate (ester) catalyst, reactive oxidants Al catalysts etc.
In addition, sedimentation at high temperature prevents agent as the thermal conductivity packing material, can also add fine powders such as settleability or pyrolytic silicon dioxide, thixotropy raising material etc. arbitrarily.
(thermal conductivity of thermal component and melt viscosity)
The preferred 0.5W/mK of the thermal conductivity of thermal component of the present invention or more than the 0.5W/mK.When thermal conductivity was lower than 0.5W/mK, the thermal conductivity of electronic unit and thermal component etc. reduced, and may not bring into play sufficient heat dispersion.
In addition, thermal component of the present invention, it is to the fillibility of electronic unit and thermal component, and the viscosity in the time of best 80 ℃ is 1 * 10
2～1 * 10
5The scope of Pas, preferred 5 * 10
2～5 * 10
4Pas.When viscosity is lower than 1 * 10
2During Pas, have from the danger of flowing out between thermal components such as electronic unit and fin, when being higher than 1 * 10
5During Pas, the gap between electronic unit and the thermal component can not be reduced, heat dispersion may not be given full play to.
(manufacture method)
Thermal softening heat conductivity composition used in the thermal component of the present invention can be by carrying out mixing manufacturing easily to above-mentioned various compositions with compounding rubber machines such as kneader (De ウ ミ キ サ one) (kneading machine), gate-type mixer (ゲ one ト ミ キ サ one), planetary-type mixers.
Secondly, thermal component of the present invention is to use after the thermal softening heat conductivity composition is shaped to sheet.Here, so-called sheet comprises membranaceous, banded.As the method that is shaped to sheet, can by above-mentioned after mixing composition extrusion molding, calendering (カ レ Application ダ one) moulding, roller moulding, compression moulding in addition, be dissolved in being coated with behind the solvent etc. and carry out moulding.Also have, the thickness of this sheet is 1～200 μ m, preferred 10～100 μ m, preferred especially 20～80 μ m.When being lower than 1 μ m, the property handled variation, when being higher than 200 μ m, the heat dispersion variation.
In addition, preferably be shaped to sheet on the stripping film or between 2 stripping films, can improving processing operation by use after being processed into the such form of Fig. 1.That is, at the light slightly barrier film 1 of continuous band-shaped peeling force be cut between the big slightly barrier film 2 of the peeling force of definite shape size, thermal softening thermal conductivity parts 3 of the present invention are cut into the same shape of barrier film 2 dispose continuously.As using method, by drawstring 4 pull-ups of pasting on the barrier film 2, thermal softening thermal conductivity parts are peeled off from barrier film 1, move to barrier film 2 one sides, after sticking on this face of thermal softening thermal conductivity parts on heat generation electronic unit or the thermal component, pull-up drawstring 4 is peeled off barrier film 2, can easily in the place of regulation thermal softening thermal conductivity parts be set thus.
Embodiment
Embodiment 1～5 and comparative example 1～5
Illustrate in greater detail the present invention below by embodiment, but the present invention is not subjected to their restriction.
At first, prepare to form the following various compositions of the present composition:
(A) thermoplastic silicone resin
A-1:D
25T
Φ 55D
Vi 20(molecular weight 3300, softening point: 40～50 ℃)
(B) thermal conductivity packing material
B-1: average grain diameter is the aluminium powder of 1.5 μ m (granule content of maximum particle diameter 15 μ m is 0.01%);
B-2: average grain diameter is the aluminium powder of 2.0 μ m (granule content of maximum particle diameter 15 μ m is 0.01%);
B-3: average grain diameter is the oxide powder and zinc of 1.0 μ m (granule content of maximum particle diameter 15 μ m is 0%);
B-4: average grain diameter is the copper powder of 3.0 μ m (granule content of maximum particle diameter 15 μ m is 0.01%);
B-5: average grain diameter is the aluminium powder of 7.4 μ m (granule content of maximum particle diameter 15 μ m is 0.5%);
B-6: average grain diameter is the aluminium powder of 1.5 μ m (granule content of maximum particle diameter 15 μ m is 2.0%);
B-7: average grain diameter is the copper powder of 3.0 μ m (granule content of maximum particle diameter 15 μ m is 2.0%).
(C) silicone oil: the viscosity in the time of 25 ℃ be 0.4Pas contain phenyl silicone oil KF-54 (trade name, Shin-Etsu Chemial Co., Ltd's system)
(manufacture method of thermal component)
The thermoplastic silicone resin of (A) composition and (C) composition and toluene 20 mass parts cooperate by table 1, drop into planetary-type mixer, mix in stirring at room and made homogeneous solution in 20 minutes.Then, press proportioning input (B) composition of table 1, mixed 1 hour in stirring at room.The composition solution that obtains further with after the dilution of toluene 250 mass parts, is coated with on the barrier film 2 that the PET (PETG) that has been coated with the big slightly release agent of peeling force makes with コ Application マ coating machine.Then, be 80 ℃ drying oven 5 minutes by temperature, after toluene is removed in volatilization, the hot-rolling of 90 ℃ of PET system barrier film 1 usefulness the temperature that has been coated with the light slightly release agent of peeling force on it pressed glue.Thermal softening thermal conductivity component thickness after the processing is 60 μ m (wherein embodiment 2 is 40 μ m).
The two sides of adopting above-mentioned operation to obtain is clipped in thermal softening thermal conductivity parts 3 between the heavy slightly barrier film 2 of peeling force light slightly barrier film 1 and peeling force, after cutting film (ス リ Star ト) and be processed into band shape with wide 25mm, on the heavy slightly barrier film 2 of peeling force, paste drawstring 4, simultaneously at the cutting of the position of length 25mm drawstring, barrier film 2 and thermal softening thermal conductivity parts, the barrier film 1 that peeling force is light slightly is residual with banded former state, makes the product form of Fig. 1.
Evaluation method
(1) thickness, thermal resistance and thermal conductivity
Live in to state thermal component with 2 standard aluminum plate holders, apply the pressure of about 0.14MPa, simultaneously in 25 ℃ of heating 120 minutes or in 125 ℃ of heating 10 minutes.Then, measure the thickness of per 2 blocks of aluminium sheets respectively, the known standard aluminum plate thickness of deduction thickness is measured actual sheet thickness.When measuring thickness, adopt micrometer (ミ of Co., Ltd. Star ト ヨ system, model: M820-25VA).In addition, the thermal resistance of thermal softening conducting-heat elements and thermal conductivity are measured with miniature flash spotting machine (マ イ Network ロ Off ラ Star シ エ) (manufacturing of ネ Star チ ゲ レ イ テ バ ウ society).
(2) viscosity
Viscosity when adopting Measurement of Dynamic Viscoelasticity device RDA3 (テ イ one エ イ イ Application ス Star Le メ Application ト society system, trade name) to measure 80 ℃.
(3) property handled
With the product form of Fig. 1, by the installation of handwork evaluation to fin.
◎: very good
Zero: good
△: good slightly
*: bad
Above-mentioned evaluation result is shown in table 1.
Table 1
| (mass parts) | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 |
| ????A-1 | ????100 | ????100 | ????95 | ????100 | ????100 |
| ????B-1 | ????400 | ????400 | ????400 | ????600 | ????100 |
| ????B-2 | ????100 | ????100 | ????100 | ????150 | ????0 |
| ????B-3 | ????100 | ????100 | ????100 | ????150 | ????120 |
| ????B-4 | ????0 | ????0 | ????0 | ????0 | ????1280 |
| ????B-5 | ????0 | ????0 | ????0 | ????0 | ????0 |
| ????B-6 | ????0 | ????0 | ????0 | ????0 | ????0 |
| ????B-7 | ????0 | ????0 | ????0 | ????0 | ????0 |
| ????C | ????0 | ????0 | ????5 | ????0 | ????0 | |
| 25 ℃ * 120 minutes | Thermal resistance (mm 2·K/W) | ????25.4 | ????18.1 | ????25.2 | ????17.3 | ????15.8 |
| Thickness (μ m) | ????57 | ????38 | ????55 | ????59 | ????58 | |
| 25 ℃ * 10 minutes | Thermal resistance (mm 2·K/W) | ????7.4 | ????7.3 | ????7.1 | ????6.9 | ????6.4 |
| Thickness (μ m) | ????15 | ????14 | ????13 | ????18 | ????19 | |
| Thermal conductivity | ?W/m·K | ????2.4 | ????2.4 | ????2.3 | ????4.1 | ????5.2 |
| Viscosity | ?×10 3Pa·s | ????8.9 | ????8.9 | ????6.4 | ????15 | ????32 |
| The property handled | ????◎ | ????◎ | ????◎ | ????◎ | ????○ | |
Comparative example
With the various compositions in the various composition substitution lists 1 in the table 2,, make composition with the same fully operation of embodiment 1～5.Same to resultant composition and embodiment 1～5, carry out the mensuration of projects, the results are shown in table 2.
Table 2
| (mass parts) | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | |
| ????A-1 | ????100 | ????100 | ????95 | ????100 | ????100 | |
| ????B-1 | ????200 | ????1200 | ????0 | ????0 | ????100 | |
| ????B-2 | ????50 | ????500 | ????0 | ????100 | ????0 | |
| ????B-3 | ????50 | ????500 | ????0 | ????100 | ????120 | |
| ????B-4 | ????0 | ????0 | ????0 | ????0 | ????0 | |
| ????B-5 | ????0 | ????0 | ????600 | ????0 | ????0 | |
| ????B-6 | ????0 | ????0 | ????0 | ????400 | ????0 | |
| ????B-7 | ????0 | ????0 | ????0 | ????1280 | ||
| ????C | ????0 | ????0 | ????5 | ????0 | ????0 | |
| 25 ℃ * 120 minutes | Thermal resistance (mm 2·K/W) | ????32.1 | ????28.5 | ????27.5 | ????27.7 | ????26.7 |
| Thickness (μ m) | ????59 | ????61 | ????59 | ????58 | ????60 | |
| 25 ℃ * 10 minutes | Thermal resistance (mm 2·K/W) | ????13.4 | ????18.1 | ????12.7 | ????11.0 | ????10.2 |
| Thickness (μ m) | ????13 | ????53 | ????29 | ????23 | ????25 | |
| Thermal conductivity | W/m·K | ????1.8 | ????5.8 | ????2.5 | ????2.4 | ????5.3 |
| Viscosity | ×10 3Pa·s | ????5.2 | ????91 | ????6.8 | ????8.5 | ????30 |
| The property handled | ????△ | ????× | ????◎ | ????◎ | ???○ |
The invention effect
Thermal softening thermal conductivity parts thermal conductivity of the present invention is good, good with the adaptation of heat generation electronic unit and thermal component, by it is inserted between the two, the heat that the heat generation electronic unit is produced reaches thermal component, the life-span of significantly improving the heat generation electronic unit and adopting the electrical equipment of this electronic unit efficiently.
Claims (5)
1. thermal component, it is characterized in that, when being configured in work, it reaches between the heat generation electronic unit of the temperature higher and the thermal component (interface) than room temperature, room temperature state before electronic unit work is an illiquidity, and, heat that produces when working or lowering viscousity, softening or fusion by when disposing, heating artificially by electronic unit, be filled into the interface of electronic unit and thermal component thus in fact tight, in this thermal component, following comprising (A) and thermal softening heat conductivity composition (B) are shaped to sheet:
(A) thermoplastic silicone resin 100 mass parts;
(B) average grain diameter is thermal conductivity packing material (wherein maximum particle diameter is that 1 quality % or 1 quality % are following above the particle content of 15 μ m) 500～2000 mass parts of 0.1～5.0 μ m.
2. the described thermal component of claim 1 is characterized in that, (A) polyorganosiloxane resin of composition comprises R
1SiO
3/2Unit (T unit) and R
1 2SiO
2/2Unit (D unit) (R in the formula
1Be that carbon number is 1～10 the monovalence hydrocarbon that does not replace or replace).
3. claim 1 and 2 described thermal components is characterized in that, are comprising (A) composition and (B) in the thermal softening heat conductivity composition of composition, the viscosity when further adding 25 ℃ is silicone oil and/or the polysiloxanes raw rubber of 0.1～100Pas.
4. the described thermal component of claim 1～3 is characterized in that, thermal conductivity is 0.5W/mK or more than the 0.5W/mK, the viscosity in the time of 80 ℃ is 1 * 10
2～1 * 10
5In the Pas scope.
5. the described thermal component of claim 1～4 is characterized in that, the thermal softening heat conductivity composition is being shaped in the thermal component of sheet, and its thickness is 20～80 μ m.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP299471/2003 | 2003-08-25 | ||
| JP2003299471A JP3925805B2 (en) | 2003-08-25 | 2003-08-25 | Heat dissipation member |
| JP299471/03 | 2003-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1591847A true CN1591847A (en) | 2005-03-09 |
| CN100420006C CN100420006C (en) | 2008-09-17 |
Family
ID=34404672
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100566788A Expired - Fee Related CN100420006C (en) | 2003-08-25 | 2004-08-12 | Heat radiating component |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3925805B2 (en) |
| KR (1) | KR101058276B1 (en) |
| CN (1) | CN100420006C (en) |
| TW (1) | TW200508323A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101375395B (en) * | 2006-01-26 | 2012-10-03 | 迈图高新材料日本合同公司 | Heat dissipating material and semiconductor device using same |
| CN108598254A (en) * | 2018-04-19 | 2018-09-28 | 嘉盛半导体(苏州)有限公司 | Filter package method and encapsulating structure |
| CN109196057A (en) * | 2016-05-31 | 2019-01-11 | 三井化学株式会社 | Heat conductivity composition |
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| JP4901327B2 (en) * | 2005-07-25 | 2012-03-21 | 信越化学工業株式会社 | Heat dissipation member |
| WO2008063709A2 (en) | 2006-06-20 | 2008-05-29 | Polyone Corporation | Thermally conductive polymer compounds containing zinc sulfide |
| WO2008108482A1 (en) | 2007-03-06 | 2008-09-12 | Teijin Limited | Pitch-derived carbon fiber, process for producing the same, and molded object |
| JP2009197052A (en) * | 2008-02-19 | 2009-09-03 | Asahi Kasei E-Materials Corp | Resin composition |
| JP5819899B2 (en) * | 2013-09-11 | 2015-11-24 | 日東電工株式会社 | Flip chip type film for semiconductor back surface and use thereof |
| JP2023116884A (en) | 2022-02-10 | 2023-08-23 | 信越化学工業株式会社 | Thermally conductive composition and cured product thereof |
| WO2024195826A1 (en) * | 2023-03-22 | 2024-09-26 | タツタ電線株式会社 | Heat dissipation sheet laminate |
| WO2024204441A1 (en) * | 2023-03-29 | 2024-10-03 | バンドー化学株式会社 | Thermally conductive composition |
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| US5545473A (en) * | 1994-02-14 | 1996-08-13 | W. L. Gore & Associates, Inc. | Thermally conductive interface |
| JP3195277B2 (en) | 1997-08-06 | 2001-08-06 | 信越化学工業株式会社 | Thermal conductive silicone composition |
| US5969035A (en) * | 1998-02-06 | 1999-10-19 | Dow Corning | Thickening of low molecular weight siloxanes with acrylate/methacrylate polyether grafted silicone elastomers |
| US6391442B1 (en) * | 1999-07-08 | 2002-05-21 | Saint-Gobain Performance Plastics Corporation | Phase change thermal interface material |
| WO2002091465A1 (en) * | 2001-04-23 | 2002-11-14 | Shin-Etsu Chemical Co., Ltd. | Heat radiating member |
| JP2002363406A (en) | 2001-06-08 | 2002-12-18 | Ge Toshiba Silicones Co Ltd | Silicone rubber composition |
| JP2003113308A (en) * | 2001-08-02 | 2003-04-18 | Tokai Rubber Ind Ltd | Electroconductive silicone rubber composition and electroconductive sheet obtained by using the same |
| JP3803058B2 (en) * | 2001-12-11 | 2006-08-02 | 信越化学工業株式会社 | Thermally conductive silicone composition, cured product thereof, laying method, and heat dissipation structure of semiconductor device using the same |
| JP3844125B2 (en) * | 2002-01-22 | 2006-11-08 | 信越化学工業株式会社 | Heat dissipating member, manufacturing method thereof and laying method thereof |
| CA2474740C (en) * | 2002-02-06 | 2011-10-11 | Parker-Hannifin Corporation | Thermal management materials having a phase change dispersion |
-
2003
- 2003-08-25 JP JP2003299471A patent/JP3925805B2/en not_active Expired - Fee Related
-
2004
- 2004-08-12 CN CNB2004100566788A patent/CN100420006C/en not_active Expired - Fee Related
- 2004-08-24 KR KR20040066750A patent/KR101058276B1/en active IP Right Grant
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101375395B (en) * | 2006-01-26 | 2012-10-03 | 迈图高新材料日本合同公司 | Heat dissipating material and semiconductor device using same |
| CN109196057A (en) * | 2016-05-31 | 2019-01-11 | 三井化学株式会社 | Heat conductivity composition |
| CN109196057B (en) * | 2016-05-31 | 2022-02-01 | 三井化学株式会社 | Thermally conductive composition |
| CN108598254A (en) * | 2018-04-19 | 2018-09-28 | 嘉盛半导体(苏州)有限公司 | Filter package method and encapsulating structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI343936B (en) | 2011-06-21 |
| KR20050022366A (en) | 2005-03-07 |
| KR101058276B1 (en) | 2011-08-22 |
| CN100420006C (en) | 2008-09-17 |
| JP2005072220A (en) | 2005-03-17 |
| JP3925805B2 (en) | 2007-06-06 |
| TW200508323A (en) | 2005-03-01 |
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