1343936 九'發明說明 ί發明所屬之技術領域】 本發明係有關冷卻電子零件，介裝於發熱性電子零件 #散熱器（heat sink)或金屬筐體等散熱零件間之熱界面之 導熱材料。特別於電子零件作動溫度範圍內之溫度中使黏 度下降、軟化、或融解而提高對熱界面之密合性，進而改 善由發熱性電子零件至散熱零件之熱傳導者。 【先前技術】 電視、影像、電腦、醫療器具、事務機械、通信裝置 等’最近之電子機器之電路設計複雜性上升，而逐漸成爲 可製造相當於包含數十萬個電晶體之積體電路。隨著電子 機器之小型化、高性能化，組裝於越來越縮小之面積上之 此等電子零件個數亦增多之同時，電子零件本身之形狀亦 隨之小型化。因此，由各電子零件所產生之熱亦增加，由 於此熱會引起故障或機能不全，使熱有效地散發之實裝技 術則變爲重要。 爲去除隨著個人電腦、數位影碟、行動電話等之電子 機器所使用之CPU、驅動1C、記憶體等之電子零件集體 度之提高所產生之熱，提案多種散熱方法及使用於其中之 散熱構材。 向來，爲抑制電子機器等之電子零件之溫度上昇，採 用使用鋁、銅、黃銅等導熱率高之金屬之散熱器直接傳熱 之方法。此散熱器傳導由電子零件所產生之熱，由該熱與 1343936 外氣之溫度差由表面散出。爲有效率地傳導由電子零件產 生之熱，散熱器與電子零件則有必要無間隙密合，故於電 子零件與散熱器之間介裝具有柔軟性之低硬度導熱性薄片 或導熱性油脂。 【發明內容】 〔發明所欲解決之課題〕 然而，低硬度導熱性薄片之作業操作性雖優，但難以 使厚度變薄，又，因不能隨從電子零件或散熱器表面之微 細凹凸，使接觸熱阻變大，而有不能有效率地傳導熱爲其 問題。 一方面，因導熱性油脂因可使厚度變薄，可縮小電子 零件與散熱器之距離，更藉由埋入表面微細之凹凸而可大 幅地減低熱阻。但是，導熱性油脂操作性差且污染周圍， 因熱循環而分離油分（擠出）而有熱特性降低之問題。 近年，提案多數具有低硬度導熱性薄片之操作性與導 熱性油脂之低熱阻化兩方特性之導熱性材料，於室溫爲操 作良好之固體狀，由電子零件所產生之熱而軟化或熔融之 熱軟化性材料。 日本特表2000-509209號公報中，提案由丙烯酸系壓 感黏著劑與α -烯烴系熱可塑劑與導電性塡充材料所構成 之導熱性材料，或鏈烷烴系蠟與導熱性塡充劑所構成之導 熱性材料（專利文獻1 )。 日本特開2000-336279號報，提案由熱可塑性樹脂、 -6 - 1343936 蠟、導熱性塡充劑所構成之導熱性組成物（專利文獻2 ) 〇 日本特開200卜8975 6號公報，提案由丙烯酸等之聚 合物’與碳數12〜16醇類、石油蠟等之融點成分與導熱 性塡充劑所構成之熱仲介材料（專利文獻3 )。 日本特開2002-121332號公報，由聚烯烴與導熱性塡 充劑所構成之熱軟化性散熱薄片（專利文獻4 )。 但是’此等之任一者係皆以有機物爲基礎者，而非係 朝向難燃性之材料。又’汽車等組裝此等構件時，有高溫 劣化之疑慮。 一方面’耐熱性、耐天候性優之材料，如聚矽氧，亦 提案多數聚矽氧爲基礎之同樣熱軟化材料。 日本特開2000-321917號公報’提案由熱可塑性聚矽 氧樹脂與蠟狀變性聚矽氧烷與導熱性塡充材料所構成之組 成物（專利文獻5)。 曰本特開2〇〇1-291807號公報’提案聚矽氧烷膠體等 之黏著劑樹脂與蠟與導熱性塡充材料所構成之導熱性薄片 (專利文獻6 )。 日本特開2002-234952號公報’提案由聚矽氧等之高 分子膠體與變性聚矽氧烷、蠟等之經加熱可成爲液體之化 合物’與導熱性塡充材料所成之熱軟化性散熱薄片（專利 文獻7)。 但是’由於此等聚矽氧以外使用蠟等有機物或聚矽氧 院變性之蠟，而有比聚矽氧單者有難燃性、耐熱性差之缺 1343936 點。 (專利文獻1)日本特表2000_509209號公報 (專利文獻2)日本特開2〇〇〇_336279號公報 (專利文獻3)日本特開2〇〇1_89756號公報 (專利文獻4)日本特開2〇〇2_121332號公報 (專利文獻5)日本特開2000_3279丨7號公報 (專利文獻6)日本特開2001_2918〇7號公報 (專利文獻7)日本特開2002-234952號公報 〔課題解決手段〕 本發明係有鑑於上述問題經深入硏究結果提供，由動 作而產生高於室溫之發熱性電子零件與散熱零件之間（界 面）’配置電子零件動作前之室溫爲非流動性，且由電子 零件動作時之發熱，或於配置時積極之加熱，而低黏度化 、軟化、或熔融於電子零件與散熱零件之界面實質上無間 隙地被塡充之散熱材料，藉由實質上使厚度變小而可顯著 地減低組成物本身之熱阻，且散熱性優良之以下（1 )〜 (5 )之散熱構件。 (1 ) 由下述（A )及（B )所成之熱軟化性導熱性組成物 成形爲薄片狀爲其特徵之散熱構件。 (A )熱可塑性聚矽氧樹脂 1 〇〇質量份 (B)平均粒徑爲0.1〜5.0μηι之導熱性塡充材料（ 但最大粒徑超過1 5 // m物之含有率爲1質量％以下） -8- (2) (2)1343936 500〜2000質量份 上述（A)成分之熱可塑性聚矽氧樹脂係由RiSi〇3/2 單元（T單元）與R'SiO^單元（D單元）（式中R1爲 碳數1〜1 0之非取代之一價烴）所構成爲其特徵之散熱構 件。 (3 ) 上述（A)成分及（B)成分所成之熱軟化性導熱性 組成物，更添加於25°C黏度爲0.1〜100 Pa · s之聚矽氧 油及/或聚矽氧生橡膠爲其特徵之如申請專利範圍第1項 及第2項之散熱構件。 (4) 導熱率爲0.5W/mK以上，於80°C之黏度爲ΙχΙΟ2〜 1 xlO5 Pa · s範圍爲特徵之散熱構件。 (5 ) 上述熱軟化性導熱組成物所形成薄片狀之散熱構件， 其厚度爲20〜80"m爲其特徵之散熱構件。 〔發明之效果〕 本發明之熱軟化性導熱性構件，由於導熱性良好且與 發熱性電子零件及散熱零件之密著性良好，藉由使此介在 於兩者之間，可有效率地使由發熱性電子零件所發生之熱 發散至散熱構件，進而可大幅改善發熱性電子零件或使用 其之電子機器等之壽命。 -9- 1343936 〔實施發明之最佳型態〕 以下詳細說明本發明。 (A成分：熱可塑性聚矽氧樹脂） 可成爲本發明之散熱構件之媒介物（基質）之熱可塑 性聚矽氧樹脂，係在常溫時散熱構件實質上爲固體（非流 動性），於一定溫度時，理想爲4 0 °C以上，由發熱性電 子零件之發熱可達最高溫度下，具體的爲40〜150 °C程度 ，特別在40〜120°C範圍中可熱軟化、低黏度化或融解流 動化者即可。此媒介物係爲引起熱軟化之因子，係作爲賦 予導熱性塡充材料加工性或作業性之黏合物之任務者。 此熱軟化、低黏度化或融解之溫度爲散熱構件之溫度 ，聚矽氧樹脂本身爲具有低於40°C之融點者亦可。 引起熱軟化之媒介物，由如上述之聚矽氧樹脂所選擇 之任一者均可，爲於室溫維持非流動性，可例示如含有 WSiCh/z單元（以下以T單元稱之）及/或Si02單元（ 以下以Q單元稱之）之聚合物，及此等與R^SiO^z單元 (以下以D單元稱之）之共聚物。另外，亦可添加由D 單元所成之聚矽氧油或聚矽氧生橡膠。其中，亦以含T單 元與D單元之聚矽氧樹脂，及含T單元之聚矽氧樹脂與 於25 °C黏度爲0.1〜100 Pa. s之聚矽氧油及/或聚矽氧 生橡膠之組合者爲理想，聚矽氧樹脂之末端以Rl3Si01/2 單元（Μ單元）封鏈者亦可。 在此，上述R1爲碳數1〜10理想爲1〜6之非取代或 -10- © 1343936 取代之一價烴基。該R1之具體例可舉例如甲基、乙基、 汚基、異丙基、丁基、異丁基、叔丁基、戊基、新戊基、 己基、環己基、辛基、壬基、癸基等之烷基，苯基、甲苯 基、二甲苯基，萘基等之芳基，苄基、苯乙基、苯丙基等 之芳烷基，乙烯基、烯丙基、丙烯基、異丙烯基、丁烯基 、己烯基、環己烯基、辛烯基等之鏈烯基，或此等基之氫 原子之一部份或全部爲氟、漠、氯等之_原子、氰基等所 取代者，例如氯甲基、氯丙基、溴乙基、三氟丙基、氰乙 基等其中亦以甲基、苯基及乙烯基爲理想。 更具體的說明（A)成分相關之聚矽氧樹脂時，本發 明使用之聚矽氧樹脂爲含有T單元及/或Q單元者，設 計爲Μ單元與T單元，或Μ單元與Q單元。特別爲改善 固體狀時之脆性防止操作時破損之優強靭性以導入Τ單元 爲有效，更以使用D單元爲理想。該τ單元之取代基（ R 1 )以甲基及苯基爲理想，D單元之取代基以甲基、苯基 及乙烯基爲理想。又’上述Τ單元及D單元之比率以】〇 :90〜90: 10爲理想，特別以20: 80〜80: 20更理想， 又’即使係通常所使用由Μ單元與Τ單元，或μ單 兀與Q單兀合成之聚砂氧樹脂，以此爲主，藉由混合以D 單元所成末端爲Μ單元之黏度0.1〜〗〇〇 pa. s之聚砂氧 油及/或聚矽氧生橡膠而可改善脆性。因此，熱軟化之聚 矽氧樹脂含T單元，不含D單元時，只要添加以d單元 爲主成分之上述聚矽氧油及/或聚矽氧生橡膠等即可成爲 操作性優之材料。 -11 - 1343936 此時，以D單元爲主成分之聚矽氧油及/ 生橡膠之添加量，相對於100質量份之具有軟化 高於常溫之（A)成份之聚矽氧樹脂，使用1〜 份，特別以2〜1 0質量份爲理想。低於1質量份 性有不能改善之可能性，超過1 00質量份時，薄 形性、支撐性有惡化之可能性》 如上所述，（A)成分之聚矽氧樹脂，可產 黏度降低即可，又成爲塡充材料之黏合物者即司 )成分之聚矽氧樹脂之分子量，以 500〜20000 1000〜100 00者爲理想。聚矽氧樹脂之分子量低: ，熱軟化時之黏度過低，有因熱循環所致之擠出 過20000時相反的熱循環時之黏度過高電子零件 件有密合性下降之虞。 又，本發明使用之聚矽氧樹脂，以賦予本發 構件柔軟性或黏性者爲理想。此時，使用單一分 合物亦可，使用混合2種以上分子量不冋之聚合 (B成分：導熱性塡充材料） 本發明所使用之B成分導熱性塡充材料，係 熱材料導熱性者，爲平均粒徑〇.1〜5.0y m之導 材料，且最大粒徑超過15;/m者佔（B)成分全 1質量％以下。平均粒徑低於〇. 1 # m時，所得之 黏度由於變爲過高缺乏伸展性，而難以成形爲薄 。另一方面，平均粒徑超過5.0 "m時，薄片或 或聚砂氧 點或融點 100質量 時，操作 片等之成 生若干之 。該（A ，特別以 玲500時 之虞，超 與散熱零 明導熱性 子量之聚 物亦可。 爲賦予散 熱性塡充 體必要在 組成物之 片或薄膜 薄膜之表 -12- 1343936 面變粗糙，又由於電子零件與散熱零件之間隙變大’而有 ； 散熱性能無法充分發揮之虞。因此’其平均粒徑必要在 0.丨〜5.0/zm之範圍內，特別以1.0〜3.5//m者爲理想。 又，其最大粒徑超過1 5 /z m之比例’相對於導熱性 塡充劑全體若超過1質量％時’由於電子零件與散熱零件 之間隙變大而有不能充分發揮散熱性能之虞。理想爲〇 · 5 質量％以下，更理想爲〇.1質量％以下。 (B )成分之導熱性塡充劑’只要係導熱性良好且融 點超過2 5 0 °C者則無特別限制，可舉例如鋁粉末、氧化鋅 粉末、氧化鋁粉末、氮化硼粉末、氮化鋁粉末、氮化矽粉 末、銅粉末、銀粉末、金剛石粉末、鎳粉末、鋅粉末、不 鏽鋼粉末、碳粉末等，但不限於此等。此等爲球狀或不定 形均可，單獨或2種以上混合使用均可。混合2種以上使 用時，可提高散熱性能、薄片加工性、作業性等。 (Β)成分之配合量，相對於1〇〇質量份（Α)成分 之聚矽氧樹脂配合500〜2000質量份》特別以600〜1500 質量份爲理想。低於5 00質量份時，所得之組成物缺乏導 熱性，又超過2000質量份時，加工性伸展性惡化。 (其他之添加劑） 作爲提高本組成物（Β )成分之導熱性塡充劑與（A )成分之熱可塑性聚矽氧樹脂之濕潤性之成分，以使用一 般式（1)所示之烷氧基矽烷更爲有效。 R2aR3bSiO ( OR4 ) 4.a.b ( 1 ) -13- 1343936 —般式（1)中之R2爲碳數6〜15之烷基’具體例可 列舉如己基、辛基、壬基、癸基、十二基、十四基等。碳 數低於6時，作爲導熱性材料之濕潤性不充分’超過1 5 時由於在常溫固化而使操作不方便’組成物之耐熱性及難 燃性下降。a爲1、2或3，特別以1爲理想。又，R3爲 碳數1〜8之飽和或不飽和之一價烴基，具體例可列舉如 甲基、乙基、丙基 '己基、辛基之烷基，環戊基、環己基 等之環烷基，乙烯基、烯丙基等之鏈烯基，苯基、甲苯基 等之芳基、2-苯基乙基、2-甲基-2-苯乙基等之芳烷基’ 3,3,3-三氟丙基、2-(九氟丁基）乙基、2-(十七氟辛基 )乙基、P-氯苯基等之鹵化烴基，特別以甲基、乙基爲理 想。R4爲碳數1〜6之烷基，可列舉如甲基、乙基、丙基 、丁基、戊基、己基等，特別以甲基、乙基爲理想。 上述一般式所示之烷氧基矽烷之具體例可列舉如下 C6HI3Si ( OCH3 ) 3BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-conducting material for cooling an electronic component, which is interposed between a heat sink of a heat-generating electronic component such as a heat sink or a metal casing. In particular, in the temperature range of the operating temperature range of the electronic component, the viscosity is lowered, softened, or melted to improve the adhesion to the thermal interface, thereby improving the heat conduction from the heat-generating electronic component to the heat-dissipating component. [Prior Art] Televisions, video, computers, medical appliances, business machines, communication devices, etc. The circuit design complexity of recent electronic devices has increased, and it has become an integrated circuit that can be manufactured to contain hundreds of thousands of transistors. With the miniaturization and high performance of electronic equipment, the number of such electronic components assembled in a smaller and smaller area has also increased, and the shape of the electronic components themselves has also been miniaturized. Therefore, the heat generated by each electronic component also increases, and the mounting technology that causes the heat to be efficiently dissipated becomes important because the heat causes malfunction or insufficiency. In order to remove the heat generated by the increase in the degree of collection of electronic components such as CPUs, drives 1C, and memory used in electronic devices such as personal computers, digital video disks, and mobile phones, various heat dissipation methods and heat dissipation structures are proposed. material. In order to suppress the temperature rise of electronic components such as electronic equipment, a heat transfer method using a heat sink of a metal having a high thermal conductivity such as aluminum, copper or brass has been used. The heat sink conducts heat generated by the electronic component, and the temperature difference between the heat and the external air of 1343936 is dissipated from the surface. In order to efficiently conduct heat generated by electronic components, it is necessary for the heat sink and the electronic component to have no gaps, so that a flexible low-hardness thermal conductive sheet or thermal grease is interposed between the electronic component and the heat sink. [Problem to be Solved by the Invention] However, the low-hardness thermally conductive sheet is excellent in workability, but it is difficult to make the thickness thin, and it is impossible to follow the fine unevenness of the surface of the electronic component or the heat sink. The thermal resistance becomes large, and there is a problem that heat cannot be efficiently transmitted. On the one hand, since the thermal grease can be made thinner, the distance between the electronic component and the heat sink can be reduced, and the thermal resistance can be greatly reduced by embedding the fine irregularities on the surface. However, the thermal grease has poor handleability and contamination of the surroundings, and the oil is separated (extrusion) due to thermal cycling, and the thermal characteristics are lowered. In recent years, many thermal conductive materials having low-heat-resistance sheet operability and low thermal resistance of thermal grease have been proposed. They are well-operated solids at room temperature, softened or melted by heat generated by electronic parts. Thermal softening material. Japanese Laid-Open Patent Publication No. 2000-509209 proposes a thermally conductive material composed of an acrylic pressure sensitive adhesive, an α-olefin thermoplastic plasticizer, and a conductive conductive material, or a paraffinic wax and a thermal conductive agent. A thermally conductive material formed (Patent Document 1). Japanese Laid-Open Patent Publication No. 2000-336279 proposes a thermal conductive composition composed of a thermoplastic resin, a -6 - 1343936 wax, and a thermal conductive chelating agent (Patent Document 2). A thermal intercalation material comprising a polymer of acrylic acid or the like and a melting point component of a carbon number of 12 to 16 alcohols, petroleum wax or the like and a thermal conductive agent (Patent Document 3). Japanese Laid-Open Patent Publication No. 2002-121332, a heat-softening heat-dissipating sheet comprising a polyolefin and a thermal conductive agent (Patent Document 4). However, any of these are based on organic matter, not materials that are resistant to flame retardancy. Further, when assembling such components such as automobiles, there is a concern that high temperature is deteriorated. On the one hand, materials that are excellent in heat resistance and weather resistance, such as polyfluorene, also propose the same thermosoftening materials based on most polyoxygen. Japanese Laid-Open Patent Publication No. 2000-321917 proposes a composition comprising a thermoplastic polysiloxane resin and a waxy denatured polyoxyalkylene and a thermally conductive entangled material (Patent Document 5). Japanese Laid-Open Patent Publication No. Hei No.1-291807 proposes a heat-conductive sheet composed of an adhesive resin such as a polyoxyalkylene colloid and a wax and a thermal conductive filler (Patent Document 6). Japanese Laid-Open Patent Publication No. 2002-234952 proposes a heat-softening heat dissipation by a polymer colloid such as polyfluorene oxide, a compound which is heated to be a liquid, and a thermally conductive compound. Sheet (Patent Document 7). However, due to the use of organic substances such as waxes or waxes denatured by polyoxane in addition to these polyoxygen oxides, there is a lack of flame retardancy and heat resistance of 1,343,936 points. (Patent Document 1) Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. Japanese Patent Laid-Open Publication No. JP-A-2002-234952 (Patent Document 7). JP-A-2002-234952 (Patent Document 7) The invention is provided in view of the above-mentioned problems, and the room temperature between the heat-generating electronic parts and the heat-dissipating parts (interface) which are generated above the room temperature by the action is non-flowing, and The heat generated during the operation of the electronic component, or the positive heating during the arrangement, and the low-viscosity, softening, or melting of the heat-dissipating material that is substantially filled without gaps at the interface between the electronic component and the heat-dissipating component, by substantially making the thickness The heat dissipating members of the following (1) to (5) which are reduced in size and can significantly reduce the thermal resistance of the composition itself and have excellent heat dissipation properties. (1) A heat-softening thermal conductive composition comprising the following (A) and (B) is formed into a sheet-like heat dissipating member. (A) Thermoplastic polyoxyxene resin 1 〇〇 parts by mass (B) thermally conductive entangled material having an average particle diameter of 0.1 to 5.0 μm (but the maximum particle diameter of more than 1 5 // m is 1% by mass) The following) -8- (2) (2) 1343936 500 to 2000 parts by mass of the above-mentioned (A) component of the thermoplastic polyoxyl resin is composed of RiSi〇3/2 unit (T unit) and R'SiO^ unit (D unit) (wherein R1 is an unsubstituted monovalent hydrocarbon having 1 to 10 carbon atoms), and is characterized by a heat dissipating member. (3) The thermosoftening thermally conductive composition of the component (A) and the component (B) is further added to a polyoxyxene oil and/or a polyoxohydrin having a viscosity of 0.1 to 100 Pa·s at 25 ° C. Rubber is a heat dissipating member characterized by the first and second aspects of the patent application. (4) A heat-dissipating member characterized by a thermal conductivity of 0.5 W/mK or more and a viscosity at 80 ° C of ΙχΙΟ 2 to 1 x lO 5 Pa · s. (5) A heat-dissipating member having a sheet-like heat-dissipating member formed by the above-mentioned thermosoftening heat-conductive composition and having a thickness of 20 to 80 "m. [Effects of the Invention] The thermosoftening heat-conductive member of the present invention has excellent thermal conductivity and good adhesion to heat-generating electronic components and heat-dissipating components, and can be efficiently placed between the two. The heat generated by the heat-generating electronic components is dissipated to the heat radiating member, and the life of the heat-generating electronic component or the electronic device using the same can be greatly improved. -9- 1343936 [Best Mode of Carrying Out the Invention] The present invention will be described in detail below. (Component A: Thermoplastic Polydecane Resin) The thermoplastic polyoxymethylene resin which can be used as the medium (matrix) of the heat dissipating member of the present invention is a solid (non-flowing property) at a normal temperature. At the temperature, it is ideally above 40 °C, and the heat generated by the heat-generating electronic parts can reach the highest temperature, specifically 40~150 °C, especially in the range of 40~120 °C, which can be soft-softened and low-viscosity. Or melt the fluidizer. This medium is a factor that causes thermal softening and serves as a task for imparting a workability or workability bond of a thermally conductive entanglement material. The temperature of the heat softening, low viscosity or melting is the temperature of the heat dissipating member, and the polyoxynoxy resin itself may have a melting point of less than 40 ° C. The medium which causes the heat softening may be selected from any of the above-mentioned polyoxyxides, and the non-flowability at room temperature may be exemplified as containing WSiCh/z units (hereinafter referred to as T units) and / or Si02 unit (hereinafter referred to as Q unit) of the polymer, and these copolymers with R ^ SiO ^ z unit (hereinafter referred to as D unit). Alternatively, a polyoxygenated oil or a polyoxynized raw rubber made of the D unit may be added. Wherein, the polyoxynoxy resin containing the T unit and the D unit, and the polyoxynoxy resin containing the T unit and the polyoxygenated oil and/or the polyoxyxene having a viscosity of 0.1 to 100 Pa.s at 25 ° C are also used. The combination of rubber is ideal, and the end of the polyoxyl resin may be blocked by a Rl3Si01/2 unit (Μ unit). Here, the above R1 is an unsubstituted or -10 © 1343936 substituted monovalent hydrocarbon group having a carbon number of 1 to 10 and desirably 1 to 6. Specific examples of the R1 include, for example, a methyl group, an ethyl group, a thiol group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group, a pentyl group, a neopentyl group, a hexyl group, a cyclohexyl group, an octyl group, a decyl group, and the like. An alkyl group such as a fluorenyl group, an aryl group such as a phenyl group, a tolyl group, a xylyl group or a naphthyl group; an aralkyl group such as a benzyl group, a phenethyl group or a phenylpropyl group; a vinyl group, an allyl group or a propylene group; An alkenyl group such as isopropenyl group, butenyl group, hexenyl group, cyclohexenyl group or octenyl group, or a part or all of hydrogen atoms of such groups is an atom of fluorine, molybdenum, chlorine or the like. The cyano group or the like is substituted, for example, a chloromethyl group, a chloropropyl group, a bromoethyl group, a trifluoropropyl group, a cyanoethyl group or the like, and a methyl group, a phenyl group and a vinyl group are also preferable. More specifically, when the polyoxyxylene resin related to the component (A) is described, the polyoxyxylene resin used in the present invention is a unit containing a T unit and/or a Q unit, and is designed to be a unit and a unit, or a unit and a unit. In particular, in order to improve the brittleness of the solid state, it is effective to prevent the breakage of the operation, and it is effective to introduce the Τ unit, and it is preferable to use the D unit. The substituent (R 1 ) of the τ unit is preferably a methyl group or a phenyl group, and the substituent of the D unit is preferably a methyl group, a phenyl group or a vinyl group. Moreover, the ratio of the above-mentioned Τ unit and D unit is 〇: 90 to 90: 10 is ideal, especially 20: 80 to 80: 20, and even 'usually used by Μ unit and Τ unit, or μ The polysand oxide resin synthesized by single 兀 and Q 兀 is mainly used, and by mixing the end of the D unit into a Μ unit, the viscosity is 0.1~〗 〇〇 pa. s poly shale oil and/or poly 矽Oxygen-producing rubber improves brittleness. Therefore, the thermosoftened polyoxynoxy resin contains a T unit, and when the D unit is not contained, the polyoxygenated oil and/or the polyoxynized raw rubber having the d unit as a main component may be added as a material having excellent workability. . -11 - 1343936 In this case, the amount of the polyoxygenated oil and/or the raw rubber which is the main component of the D unit is used in combination with 100 parts by mass of the polyfluorene oxide resin having the softening property (A) higher than the normal temperature. ~ Part, especially 2 to 10 parts by mass is ideal. When the amount is less than 1 part by mass, the possibility of improvement is not possible. When the amount is more than 100 parts by mass, the thinness and the supportability may deteriorate. As described above, the polyoxynoxy resin of the component (A) has a reduced viscosity. The molecular weight of the polyoxynoxy resin which can be used as the binder of the filler material is preferably 500 to 20000 1000 to 100 00. The molecular weight of the polyoxyxene resin is low: the viscosity at the time of thermal softening is too low, and the adhesion due to thermal cycling is excessive, and the viscosity of the electronic component in the opposite thermal cycle is too high. Further, the polyoxyxylene resin used in the present invention is preferably one which imparts flexibility or viscosity to the hair member. In this case, it is also possible to use a single component or a mixture of two or more kinds of molecular weights (B component: thermal conductive chelating material). The B component thermal conductive entangled material used in the present invention is a thermal material thermal conductivity. It is a conductive material having an average particle diameter of 〇1 to 5.0 μm, and the maximum particle diameter exceeds 15; /m accounts for 1% by mass or less of the component (B). When the average particle diameter is less than 〇. 1 # m, the resulting viscosity is too high to be stretched, and it is difficult to form a thin one. On the other hand, when the average particle diameter exceeds 5.0 " m, when the sheet or the polycrystalline silicon oxide point or the melting point is 100 mass, the operation piece or the like is formed several times. This (A, especially after 500 rpm, super and heat-dissipating a small amount of thermal conductivity of the mass may also be. In order to impart a heat-dissipating enthalpy, it is necessary to change the surface of the composition film or film film -12-1343936 Rough, and because the gap between the electronic parts and the heat dissipating parts becomes larger, the heat dissipation performance cannot be fully exerted. Therefore, the average particle size must be in the range of 0. 丨 to 5.0/zm, especially 1.0 to 3.5/ In the case where the ratio of the maximum particle diameter to more than 1 5 /zm is more than 1% by mass with respect to the entire thermal conductive agent, the gap between the electronic component and the heat dissipating component may not be sufficient. The heat dissipation performance is preferably 〇·5 mass% or less, more preferably 〇1% by mass or less. (B) The thermal conductivity of the component is as long as the thermal conductivity is good and the melting point exceeds 25 ° C. There is no particular limitation, and examples thereof include aluminum powder, zinc oxide powder, alumina powder, boron nitride powder, aluminum nitride powder, tantalum nitride powder, copper powder, silver powder, diamond powder, nickel powder, zinc powder, and stainless steel. Powder, carbon powder, etc. However, these may be spherical or indefinite, and may be used singly or in combination of two or more kinds. When two or more types are used in combination, heat dissipation performance, sheet workability, workability, and the like can be improved. The blending amount of the component is preferably 500 to 2,000 parts by mass based on 100 parts by mass of the polyfluorene resin of 1 part by mass of the component. When the amount is less than 500 parts by mass, the composition is obtained. In the case of a lack of thermal conductivity and more than 2,000 parts by mass, the processability is deteriorated. (Other additives) As a thermally conductive silicone resin which improves the thermal conductivity of the composition (Β) and the component (A) The wettability component is more effective by using the alkoxydecane represented by the general formula (1). R2aR3bSiO (OR4) 4.ab (1) -13- 1343936 The R2 in the general formula (1) is a carbon number of 6 Specific examples of the alkyl group of -15 are hexyl, octyl, decyl, decyl, dodecyl, tetradecyl, etc. When the carbon number is less than 6, the wettability as a thermal conductive material is insufficient 'more than 1 At 5 o'clock, it is inconvenient to operate due to curing at room temperature. 'The heat resistance and flame retardancy of the composition Decrease. a is 1, 2 or 3, and particularly preferably 1. Further, R3 is a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, and specific examples thereof include methyl group, ethyl group, and propyl 'hexyl group. , an alkyl group of an octyl group, a cycloalkyl group such as a cyclopentyl group or a cyclohexyl group; an alkenyl group such as a vinyl group or an allyl group; an aryl group such as a phenyl group or a tolyl group; 2-phenylethyl group; Aralkyl group such as methyl-2-phenylethyl, 3,3,3-trifluoropropyl, 2-(nonafluorobutyl)ethyl, 2-(heptadecafluorooctyl)ethyl, P- The halogenated hydrocarbon group such as a chlorophenyl group is preferably a methyl group or an ethyl group. R4 is an alkyl group having 1 to 6 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group. In particular, methyl or ethyl is preferred. Specific examples of the alkoxydecane represented by the above general formula include the following C6HI3Si ( OCH3 ) 3
Ci〇H21Si ( OCH3 ) 3 C12H25Si ( OCH3 ) 3 C,2H25Si ( OC2H5 ) 3 C10H21Si ( CH3 ) ( 〇CH3 ) 2Ci〇H21Si ( OCH3 ) 3 C12H25Si ( OCH3 ) 3 C,2H25Si ( OC2H5 ) 3 C10H21Si ( CH3 ) ( 〇CH3 ) 2
Ci〇H21Si ( C6H5) ( 〇CH3 ) 2 C,〇H2iSi ( CH3) ( OC2H5 ) 2 C,〇H2iSi ( CH = CH2 ) ( OCH3 ) 2 C,〇H2iSi ( CH2CH2CF3 ) ( OCH3 ) 2 其添加量相對於1 00質量份之熱可塑性聚矽氧樹脂， -14- (2) 1343936 爲0.0 1〜20質量份之範圍，更理想爲〇. 1〜10質量份之 範圍，此有機矽烷之添加量低於0·1質量份時，缺乏導熱 性塡充性之濕潤性而使作業降低，即使係超過20質量份 時，效果亦未增大而不利於成本。 本發明之散熱構件，在不損及本發明之目的的範圍內 ，可添加通常合成橡膠所使用之添加劑或塡充劑作爲任意 成分。 具體的可添加如脫模劑之聚矽氧油、氟變性聚矽氧界 面活性劑、著色劑之碳黑、二氧化鈦、印度紅等。難燃性 賦與劑之鉑觸媒、氧化鐵、氧化鈦、二氧化铈等之金屬氧 化物，或金屬氫氧化物。加工性提昇劑之製程油、反應性 鈦酸鹽觸媒、反應性鋁觸媒等。 又，導熱性材料之於高溫下之抗沈降劑，可任意添加 沈降性或燒結二氧化矽等之微粉末粉，搖變性提昇材料等 (散熱構件之導熱率及熔融黏度） 本發明之散熱構件之導熱率以〇,5 W/ m · Κ以上爲 理想。導熱率低於0.5 W/m.K：時電子零件與散熱零件 之導熱性降低，有不能發揮充分散熱性能之慮。 又，本發明之散熱構件，電子零件與散熱零件之塡充 性之80 °C黏度爲ΙχΙΟ2〜lxlO5 Pa. s之範圍，理想爲 5χ1〇2〜5xl04 Pa，s。黏度低於1 X 1〇2 Pa . s時，有從電 子零件與散熱器等之散熱零件之間流出之慮，超過1 q〇s -15- 1343936Ci〇H21Si ( C6H5) ( 〇CH3 ) 2 C, 〇H2iSi ( CH3) ( OC2H5 ) 2 C, 〇H2iSi ( CH = CH2 ) ( OCH3 ) 2 C, 〇H2iSi ( CH2CH2CF3 ) ( OCH3 ) 2 The amount of the organic decane to be added is preferably in the range of 0.01 to 20 parts by mass, more preferably in the range of 1 to 10 parts by mass, based on 100 parts by mass of the thermoplastic polyoxyl resin, -14-(2) 1343936. When it is 0.1 part by mass, the wettability of the thermal conductivity is lacking, and the work is lowered. Even when it is more than 20 parts by mass, the effect is not increased and the cost is not favorable. In the heat dissipating member of the present invention, an additive or a chelating agent which is usually used for a synthetic rubber may be added as an optional component within a range not impairing the object of the present invention. Specifically, a polyoxygenated oil such as a releasing agent, a fluorine-denatured polyoxynoxy surfactant, a carbon black of a coloring agent, titanium dioxide, Indian red, or the like may be added. Flame retardant A platinum catalyst such as a platinum catalyst, iron oxide, titanium oxide or cerium oxide, or a metal hydroxide. Process oil for process enhancer, reactive titanate catalyst, reactive aluminum catalyst, etc. Further, the anti-settling agent of the thermally conductive material at a high temperature may optionally be added with a fine powder powder such as sedimentation or sintered cerium oxide, a thixotropy-promoting material or the like (thermal conductivity and melt viscosity of the heat-dissipating member). The thermal conductivity is preferably 〇, 5 W/m · Κ or more. When the thermal conductivity is less than 0.5 W/m.K: The thermal conductivity of the electronic parts and the heat-dissipating parts is lowered, and sufficient heat dissipation performance cannot be exerted. Further, in the heat dissipating member of the present invention, the viscosity at 80 °C of the chargeability of the electronic component and the heat dissipating component is in the range of ΙχΙΟ2 to lxlO5 Pa.s, preferably 5χ1〇2 to 5x10 Pa, s. When the viscosity is lower than 1 X 1〇2 Pa . s, there is a concern that it flows out between the heat dissipating parts such as the electronic parts and the heat sink, and exceeds 1 q〇s -15- 1343936
Pa · s時電子零件與散熱零件之間之間隙不能變小，不能 充分發揮散熱性能。 (製造方法） 本發明散熱構件所使用之熱軟化性導熱性組成物，係 將上述各成分使用捏和機、閘式混合機、行星式混合機等 橡膠練機配合混練，而可容易製造。 其次本發明之散熱材料係將熱軟化性導熱性組成物形 成薄片狀使用。在此，該薄片狀係指包含薄膜狀或軟管狀 物。形成薄片狀之方法，上述混練後之組成物使用擠壓成 型、軋壓成型、輥輪成型、壓鑄成型、溶解於溶劑後塗敷 等成型。又該薄片之厚度爲1〜200VIT1即可，理想爲10 〜1 0 0 // m ’特別理想爲2 0〜8 0 β m。低於1 " m操作性惡 化’超過2 0 0 // m時散熱性能惡化。 又’於脫模薄膜或2片脫模薄膜之間形成爲理想，如 圖1之形態加工使用可提高作業性。即，連續膠帶狀之脫 模稍稍輕易之隔離薄膜1與截切成一定形狀之脫模稍重之 隔離薄膜2之間本發明之熱軟化性導熱性構件3切割與隔 離薄膜2形狀，連續配置之形態。使用之方法爲，拉扯黏 貼於隔離薄膜拉扯片4，熱軟化性導熱性構件由隔離薄膜 1脫離轉移至隔離薄膜2，更將此熱軟化性導熱性構件面 貼於發熱性電子零件或散熱性零件，再將拉扯片4扯下與 離薄膜2脫離，熱軟化性導熱性構件則可容易地設置於指 定位置。 -16- 1343936 【實施方式】 以下舉實施例說明本發明，但本發明不限於此等。 (實施例1〜5及比較例1〜5 ) 首先，準備以下形成本發明之組成物之各成分。 (A)熱可塑性聚矽氧樹脂 A-1 : 〇251^550'〇(分子量 3,300，軟化點：40 〜50 °C ) (B )導熱性塡充劑 B-1:平均粒徑1.5#m (最大粒徑15//m之含有率 0 · 0 1 % )之鋁粉末 B-2 :平均粒徑2.0 y m (最大粒徑1 5 y m之含有率 0.0 1 % )之鋁粉末 B-3 :平均粒徑1.0 // m (最大粒徑1 5 # m之含有率 〇% )之氧化鋅粉末 B-4:平均粒徑(最大粒徑15//m之含有率 〇 · 0 1 % )之銅粉末 B-5:平均粒徑7.4/zm (最大粒徑15"m之含有率 0.5%)之鋁粉末 B-6 :平均粒徑1 .5 # m (最大粒徑1 5 m之含有率 2.0%)之鋁粉末 B·7:平均粒徑3.0/im (最大粒徑15#m之含有率 2.0%)之銅粉末 (C)聚矽氧油：25°C之黏度爲0.4 Pa· s之含苯基 -17- 1343936 矽油KF-54 (商品名，日本信越化學工業股份有限公司製 (散熱構件之製作方法） 如表1之配合將（A)成分之熱可塑性聚矽氧樹脂與 (C)成分與甲苯20質量份投入行星式混合機，於室溫攪 拌混合20分鐘成爲均勻之溶液。其次，投入如表1配方 之（B)成分，於室溫攪拌1小時。所得之組成物溶液更 以250質量份甲苯稀釋，使用缺角輪塗敷機於塗敷脫模力 稍重脫模劑之PET (聚鄰苯二甲酸醇酯）製之隔離薄膜2 。其次通過80 °C之乾燥爐5分鐘揮發除去甲苯，再於其 上以90 °C溫度之熱輥輪壓鑄貼合塗敷脫模力稍輕脫模劑 之PET製之隔離薄膜1。加工後之熱軟化性導熱性構件厚 度爲60 y m (但，實施例2爲40 // m )。 由上述步驟所得兩面以脫模力稍輕之隔離薄膜1與脫 模力稍重之隔離薄膜2所挾之熱軟化性導熱性構件3切割 成25 mm之膠帶狀，脫模力稍重之隔離薄膜2黏貼拉扯 片4於25 mm長之位置切割拉扯膠帶、隔離薄膜2與熱 軟化性導熱性構件，脫模力稍輕之隔離薄膜1以膠帶狀原 樣殘留成爲如圖1之形態。 評價之方法 (1)厚度、熱阻及導熱率 以2片標準鋁板挾持上述散熱構件，加以約0.14 -18- 1343936 MPa· s之壓力，於25 °C 120分鐘及125 °C 10分鐘加熱。 其次，測定含2片鋁板之厚度減去已知厚度之標準鋁板= 厚度，測定實質上薄片之厚度。又，厚度之測定，使用測 微器（股份有限公司 MITUTOYO製，型式：M8 2 0-2 5 VA )。又，熱軟化性導熱性構件之熱阻及導熱率使用 MICROFLUSH 測定機(NETZSCH G E R A T E B A U 公司製） 測定。 (2 )黏度 使用動黏彈性測定裝置 RDA-3 ( D . A · INSTRUMENT公司製商品名）測定於8 0它之黏度。 (3 )操作性 如圖1製品型態以手作品評價對散熱器之著裝性。 ◎:非常良好〇：良好 △:尙良好 X :不良 此等之評價結果如表1所示。 -19- 1343936 表1 (質量份） 實施例1 實施例2 實施例3 實施例4 實施例5 A-1 100 100 95 100 100 B-1 400 400 400 600 100 B-2 100 100 100 150 0 B-3 100 100 100 150 120 B-4 0 0 0 0 1280 B-5 0 0 0 0 0 B-6 0 0 0 0 0 B-7 0 0 0 0 0 C 0 0 5 0 0 25t>120 分鐘 熱阻 (mm2 · K/W) 25.4 18.1 25.2 17.3 15.8 厚度（"m) 57 38 55 59 58 125°〇1〇 分鐘 熱阻 (mm2 · K7W) 7.4 7.3 7.1 6.9 6.4 厚度（^m) 15 14 13 18 19 導熱率 W/m · K 2.4 2.4 2.3 4.1 5.2 黏度 xl03Pa · s 8.9 8.9 6.4 15 32 操作性 ◎ ◎ ◎ ◎ 〇 比較例 表1之各成分以表2之各成分取代，與實施例1〜5 完全同樣得到組成物。所得之組成物與實施例1〜5同樣 進行測定之結果如表2所示。When Pa · s, the gap between the electronic parts and the heat dissipating parts cannot be made small, and the heat dissipation performance cannot be fully exerted. (Manufacturing method) The thermosoftening thermally conductive composition used in the heat dissipating member of the present invention can be easily produced by kneading each of the above components using a rubber machine such as a kneader, a gate mixer or a planetary mixer. Next, the heat dissipating material of the present invention is used by forming a thermosoftening thermally conductive composition into a sheet form. Here, the flaky shape means a film-like or hose-like shape. In the form of a sheet, the kneaded composition is formed by extrusion molding, roll forming, roll forming, die casting, dissolution in a solvent, and coating. Further, the thickness of the sheet may be 1 to 200 VIT1, and preferably 10 to 1 0 0 // m ' is particularly preferably 2 0 to 8 0 β m. Below 1 " m operational deterioration 'more than 200 @ / m when the heat dissipation performance deteriorates. Further, it is preferable to form between the release film or the two release films, and the workability in the form of Fig. 1 can improve workability. That is, the heat-softening thermal conductive member 3 of the present invention is cut and the shape of the separator 2 between the separator film 1 in a continuous tape form and the separator film 2 which is slightly cut off and cut into a certain shape, and is continuously arranged. form. The method is used for pulling and adhering to the separator film pull tab 4, and the thermosoftening heat conductive member is detached from the separator film 1 to the separator film 2, and the thermosoftening heat conductive member is attached to the heat generating electronic component or heat dissipation. The parts are then pulled apart from the film 2, and the thermosoftening thermally conductive member can be easily placed at a predetermined position. [16] 1343936 [Embodiment] The present invention will be described below by way of examples, but the invention is not limited thereto. (Examples 1 to 5 and Comparative Examples 1 to 5) First, the respective components forming the composition of the present invention were prepared as follows. (A) Thermoplastic polyoxyl resin A-1 : 〇 251 550 550 〇 (molecular weight 3,300, softening point: 40 〜 50 ° C) (B) Thermal conductivity 塡 B B-1: average particle size 1.5 # m Aluminum powder B-2 (maximum particle size 15//m content 0 · 0 1 %): aluminum powder B-3 having an average particle diameter of 2.0 μm (maximum particle diameter of 15 μm, 0.01%): Zinc oxide powder B-4 having an average particle diameter of 1.0 // m (maximum particle diameter of 1 5 # m) :%: average particle diameter (content ratio of maximum particle diameter 15//m 〇·0 1%) Copper powder B-5: aluminum powder B-6 having an average particle diameter of 7.4/zm (maximum particle diameter 15 "m content: 0.5%): average particle diameter 1.5 .5 (maximum particle diameter of 1 5 m) 2.0%) aluminum powder B·7: copper powder with an average particle diameter of 3.0/im (maximum particle size of 15#m of 2.0%) (C) polyoxygenated oil: viscosity at 25 ° C is 0.4 Pa·s Phenyl-17-1343936 eucalyptus oil KF-54 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd. (manufacturing method of heat-dissipating member) As shown in Table 1, the thermoplastic resin poly(oxygenated resin) of (A) is blended with ( C) component and 20 parts by mass of toluene were put into a planetary mixer, and stirred and mixed at room temperature for 20 minutes to become uniform. Next, the component (B) of the formulation shown in Table 1 was added and stirred at room temperature for 1 hour. The obtained composition solution was further diluted with 250 parts by mass of toluene, and the stripping force was slightly removed by the use of a knurling wheel coater. Molding agent PET (polyphthalate) separator film 2. Secondly, it is volatilized by a drying oven at 80 °C for 5 minutes to remove toluene, and then coated with a hot roller at a temperature of 90 °C. A release film of PET made of a slightly release agent with a release agent is applied. The thickness of the thermally softened thermally conductive member after processing is 60 μm (however, Example 2 is 40 // m). The heat-softening heat-conductive member 3 which is slightly lighter in the release film 1 and the release film 2 which is slightly more mold-releasing is cut into a tape shape of 25 mm, and the release film 2 having a slightly releasing force is adhered to the pull piece 4 at 25 mm. The long position is cut and pulled, the separator 2 and the thermosoftening heat-conductive member, and the release film 1 having a slightly lower mold release force remains as a tape as shown in Fig. 1. Evaluation method (1) Thickness, thermal resistance and The thermal conductivity is held by two standard aluminum plates to hold the above-mentioned heat dissipating member, and is about 0.14 -1 8- 1343936 MPa·s pressure, heated at 25 ° C for 120 minutes and 125 ° C for 10 minutes. Next, measure the thickness of the two sheets of aluminum sheet minus the known thickness of the standard aluminum sheet = thickness, and determine the thickness of the sheet. Further, for the measurement of the thickness, a micrometer (manufactured by MITUTOYO Co., Ltd., type: M8 2 0-2 5 VA) was used. Further, the thermal resistance and thermal conductivity of the thermosoftening thermally conductive member were measured using a MICROFLUSH measuring machine (manufactured by NETZSCH G E R A T E B A U Co., Ltd.). (2) Viscosity The viscosity was measured at 80% using a dynamic viscoelasticity measuring device RDA-3 (trade name, manufactured by D. A. INSTRUMENT Co., Ltd.). (3) Operationality As shown in Fig. 1, the product type evaluates the suitability of the heat sink by hand work. ◎: Very good 〇: Good △: 尙 Good X: Poor The evaluation results of these are shown in Table 1. -19- 1343936 Table 1 (parts by mass) Example 1 Example 2 Example 3 Example 4 Example 5 A-1 100 100 95 100 100 B-1 400 400 400 600 100 B-2 100 100 100 150 0 B -3 100 100 100 150 120 B-4 0 0 0 0 1280 B-5 0 0 0 0 0 B-6 0 0 0 0 0 B-7 0 0 0 0 0 C 0 0 5 0 0 25t> 120 minutes heat Resistance (mm2 · K/W) 25.4 18.1 25.2 17.3 15.8 Thickness ("m) 57 38 55 59 58 125°〇1〇minute thermal resistance (mm2 · K7W) 7.4 7.3 7.1 6.9 6.4 Thickness (^m) 15 14 13 18 19 Thermal conductivity W/m · K 2.4 2.4 2.3 4.1 5.2 Viscosity xl03Pa · s 8.9 8.9 6.4 15 32 operability ◎ ◎ ◎ ◎ 〇 Comparative Example Table 1 is replaced by each component of Table 2, and Example 1~ 5 The composition is obtained exactly the same. The obtained composition was measured in the same manner as in Examples 1 to 5, and the results are shown in Table 2.
-20- 1343936 表2 (質量份） 比較例1 比較例2 比較例3 比較例4 比較例5 A-1 100 100 95 100 100 B-1 200 1200 0 0 100 B-2 50 500 0 100 0 B-3 50 500 0 100 120 B-4 0 0 0 0 0 B-5 0 0 600 0 0 B-6 0 0 0 400 0 B-7 0 0 0 1280 C 0 0 5 0 0 ""^><120 分鐘 熱阻 (mm2 · K/W) 32.1 28.5 27.5 27.7 26.7 厚度 59 61 59 58 60 125°〇1〇 分鐘 熱阻 (mm2 * K/W) 13.4 18.1 12.7 11.0 10.2 厚度（/m) 13 53 29 23 25 導熱率 W/m · K 1.8 5.8 2.5 2.4 5.3 黏度 xl03Pa · s 5.2 91 6.8 8.5 30 操作性 Δ X ◎ ◎ 〇 〔發明的功效〕 本發明之熱軟化性導熱性構件，導熱性良好與發熱性 電子零件及散熱零件之密合性佳’將其介入兩者之間將發 熱性零件所產生之熱有效率散發至散熱零件，可大幅改善 發熱性電子零件或使用其之電子機器等之壽命。 【圖式簡單說明】 圖1所示爲本發明散熱構件之製品型態之圖。 -21 - 1343936 【主要元件符號說明】 1 :脫模力稍輕之隔離薄膜 2 :脫模力稍重之隔離薄膜 3 :散熱構件 4 :拉扯片 -22-20- 1343936 Table 2 (parts by mass) Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 A-1 100 100 95 100 100 B-1 200 1200 0 0 100 B-2 50 500 0 100 0 B -3 50 500 0 100 120 B-4 0 0 0 0 0 B-5 0 0 600 0 0 B-6 0 0 0 400 0 B-7 0 0 0 1280 C 0 0 5 0 0 ""^> ; <120 minutes thermal resistance (mm2 · K/W) 32.1 28.5 27.5 27.7 26.7 Thickness 59 61 59 58 60 125°〇1〇minute thermal resistance (mm2 * K/W) 13.4 18.1 12.7 11.0 10.2 Thickness (/m) 13 53 29 23 25 Thermal conductivity W/m · K 1.8 5.8 2.5 2.4 5.3 Viscosity xl03Pa · s 5.2 91 6.8 8.5 30 Operational Δ X ◎ ◎ 〇 [Effect of the invention] The thermosoftening thermally conductive member of the present invention, thermal conductivity Good adhesion to heat-generating electronic parts and heat-dissipating parts. Intervene between them to dissipate heat generated by heat-generating parts to heat-dissipating parts, which can greatly improve heat-generating electronic parts or electronic machines using them. Wait for life. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a product type of a heat dissipating member of the present invention. -21 - 1343936 [Description of main component symbols] 1 : Isolation film with slightly lower release force 2 : Isolation film with slightly lower release force 3 : Heat dissipating member 4 : Pulling piece -22