TWI352102B - - Google Patents

Description

1352102 (1) EMBODIMENT OF THE INVENTION [Technical Fields of the Invention] The present invention relates to the provision of a thermally conductive material between a heat-generating electronic component and a heat-dissipating member such as a heat sink or a metal casing for cooling an electronic component. In the operating temperature range of the electronic component, the viscosity is lowered, softened, or melted to improve the adhesion to the heat interface, and the heat conduction of the heat-generating electronic component to the heat-dissipating component can be improved, and the present invention uses the polyoxyn resin as a matrix to resist heat. Sexual and flame retardant is superior to previous products. [Prior Art] In recent years, the circuit design complexity of electronic devices such as televisions, video recorders, computers, medical instruments, transaction machines, and communication devices has increased, so it is necessary to manufacture a triode equivalent to hundreds of thousands. The integrated circuit. With the miniaturization and high performance of the electronic equipment, the number of electronic components to be assembled in a much smaller area is increased. Therefore, the shape of the electronic component itself is further reduced in size, so that the heat generated by each electronic component increases because of the heat. It will cause malfunction or incomplete function, so the effect of the heat-dissipating mounting technology becomes very important. In order to remove the heat generated by the increase in the physical fitness of the CPU, the drive unit 1C, and other electronic components used in electronic devices such as personal computers, DVD players, and mobile phones, many heat dissipation methods have been proposed and used. Heat-dissipating member β In the past, in order to suppress the temperature rise of electronic components such as electronic equipment, direct heat transfer was performed to heat-dissipating -5 - (2) (2) 1352102 sheets of metals with high thermal conductivity such as aluminum, copper, and brass. In order to conduct heat generated by the electronic component, the temperature difference between the heat and the outside air is dissipated from the surface. In order to efficiently conduct heat generated by the electronic component, the heat sink and the electronic component must have no gaps in close contact. A soft, low-hardness thermal conductive sheet or thermal grease is placed between the part and the heat sink. [Problem to be Solved by the Invention] However, although the low-hardness thermal conductive sheet is excellent in handleability, it is difficult to make the thickness thin, and it is difficult to avoid the fine unevenness of the surface of the electronic component and the heat sink to make contact heat resistance. It becomes larger, creating the problem of inefficient heat conduction. On the other hand, since the thickness of the thermally conductive grease can be made thin, the distance from the heat sink can be reduced, and the fine unevenness of the surface can be flattened, so that the heat resistance can be greatly reduced, but the thermal grease is provided. Poor operability and contamination of the surrounding 1 due to thermal cycling to separate the oil (pumping out) and reduce thermal characteristics and the like. In recent years, many people have proposed to use a soft-softening material which is softened or melted by heat generated by electronic components as a operative and heat-conductive grease having a low-hardness thermal conductive sheet. A thermally conductive member having both characteristics of low heat resistance. In Japanese Patent Publication No. 2000-5092 09, a thermally conductive material composed of an acrylic pressure sensitive adhesive, an alpha olefin thermoplastic resin, and a thermal conductive agent is proposed. Or a thermally conductive material made of a paraffin wax and a thermal conductive agent (Patent Document). (6) (3) (3) 1352, and the heat conductive composition of the thermoplastic resin and the furnace's thermal conductive material is proposed (Patent Document 2). JP-A No. 200 1 - 8975 discloses a polymer such as acrylic acid, a melting point component such as an alcohol having 12 to 16 carbon atoms, a petroleum wax, and a thermal intercalation material formed by a thermal conductive agent (Patent Document 3). JP-A-2002-121332 discloses a thermosoftening heat-dissipating sheet made of a polyolefin and a thermally conductive enthalpy (Patent Document 4). However, any of these materials is based on organic matter and is not a non-flammable material. In addition, when assembling such components in automobiles, there is a fear of deterioration due to high temperatures. On the other hand, polyfluorene is a well-known material which is excellent in heat resistance, weather resistance, and flame retardancy, and many thermosetting materials which are also based on polyoxane. Japanese Laid-Open Patent Publication No. 2000-3279 No. 7 proposes a composition of a thermoplastic polysulfide resin, a waxy denatured polysiloxane resin, and a thermally conductive filler (Patent Document 5). Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. 2002-234952 proposes a heat-softening heat-dissipating sheet made of a polymer gel such as polyfluorene oxide, a compound which is heated to become a liquid such as denatured polyfluorene or a wax, and a thermal conductive filler (Patent Document 7) . However, in addition to the polyfluorene oxide, an organic substance such as wax and a polyfluorene-denatured wax are used, so that the flame retardancy and heat resistance are inferior to those of the polyoxyl oxide product (4) (4) 1352102. In the present invention, the heat dissipating member made of a thermoplastic polysilicate resin and a thermally conductive entangled material is proposed as a material having excellent flame retardancy and heat resistance (Patent Document 8). [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. 2000-336237 (Patent Document No. JP-A No. 2000- 336. [Patent Document 6] JP-A-2001-291807 (Patent Document 7) JP-A-2002-234952 (Patent Document 8) WO 02/9 1 465 A 1 Means for Solving the Problem The inventors of the present invention have found a desired shape in which a solid sheet or the like can be formed at a normal temperature, and are easily attached and detached to an electronic component and a heat sink, and are operated by an electronic component. A heat-softenable thermally conductive material which is excellent in heat-transfer performance and excellent in flame retardancy, heat resistance, and weather resistance, after the heat is softened and the contact heat resistance is lowered. That is, it is a solid at room temperature, and is selected from a polyoxynitride resin having excellent heat resistance in a temperature range of heat softening, low viscosity or melting, and is used as a thermal conductive chelating agent in combination with aluminum powder and zinc oxide. The heat-conductive member that is filled and formed into a sheet is placed between the electronic component and the heat-dissipating component, thereby achieving the desire to remove heat, and the thermally conductive member is compared with the conventional product, -8-(5) (5) 1352102 Excellent heat and workability. The present invention is disposed between the heat-generating electronic component and the heat-dissipating component, and has no fluidity at a temperature before the operation of the electronic component, and generates heat at a temperature of 40 to 1 〇〇 ° C when the electronic component is operated, and passes through the low viscosity. A thermosoftening thermally conductive member of the above-mentioned (5) is provided in a thermosoftening thermally conductive member which is melted and softened or melted at the junction of the electronic component and the heat dissipating component. (1) The thermosoftening thermally conductive member is characterized in that a composition composed of the following components (A) to (C) is formed into a sheet shape. (A) Thermoplastic polyoxyl resin i〇〇 parts by mass (B) Aluminum powder with an average particle diameter of i~5 0 μm (C) Zinc oxide powder (Β) composition with an average particle diameter of 0.1 to 5 μηι and (C) The total amount of the components is 4 〇〇 12 12 parts by mass (Β) and the mass ratio of the (C) component is (Β) component / ^ (C) component = 1 to ίο. The thermosoftening thermally conductive member is characterized in that the thermoplastic composition of the (Α) component is composed of I^SiO3/2 unit (Τ unit) and R 2 2〇 2/2 unit (D Zhuo). Where R is a carbon number of 1 to 1 〇 unsubstituted or substituted - a valence hydrocarbon). (6) (6) 1352102 The thermosoftening thermally conductive member is characterized in that it is composed of a polysiloxane oil or a polyoxyxylene rubber 〇~45 parts by weight at a viscosity of 〇2 Pa·s or more at 25 ° C, instead of (A) a part of the thermoplastic resin of the composition. (4) The thermosoftening thermally conductive member is characterized in that the composition of the above components (A) to (C) further contains an alkoxydecane of the general formula (1), R2aR3bSi(OR4)4-ab- (1) 0 to 20 parts by mass (wherein R2 is an alkyl group having 6 to 15 carbon atoms, R3 is a hydrocarbon group having 1 to 8 carbon atoms, R4 is an alkyl group having 1 to 6 carbon atoms, and a is 1 to 3) An integer, b is an integer from 0 to 2, and a + b is an integer from 1 to 3. (5) The thermosoftening thermally conductive member is characterized in that the thickness of the thermosoftening thermally conductive member is 〇1 to 2 mm, and the peeling force of the sheet is required to satisfy the following relationship: a continuous strip-shaped separation film 1 and between the separation films 2 cut into a certain size, the sheet which is cut into the same shape as the separation film 2 is continuously placed, and the pull tab tape adhered to the separation film 2 is lifted up, and the sheet is separated. The film 1 is peeled off and moved toward the separation film 2, and the sheet surface is adhered to the heat-generating electronic component or the heat-dissipating component, and then the release tape is lifted upward to peel off the separation film 2, whereby the sheet is placed in the predetermined portion -10- ( 7) (7) 1352102 bits. Peeling force of the separation sheet 1 < Peeling force of the separation sheet 2 [Effect of the invention] The thermosoftening heat-conductive member of the present invention has good thermal conductivity and good adhesion to the heat-generating electronic component and the heat-dissipating member. This is placed between the two, and the heat generated by the heat-generating electronic components is efficiently dissipated to the heat-dissipating parts, which can greatly improve the life of the heat-generating electronic components and electronic devices using the same. [Best Mode for Carrying Out the Invention] Hereinafter, a more detailed invention will be made of the present invention. A thermoplastic polyoxymethylene resin which is a matrix of the thermosoftening thermally conductive member of the present invention, as long as the thermally conductive member formed is substantially solid (non-flowing) at room temperature, preferably 40 ° Above C, the heat generated by the heat-generating electronic parts can reach the maximum temperature or lower, specifically, in the temperature range of 40 to 100 °C, it can be a fluidization of heat softening, low viscosity or melting. This medium is one of the factors causing thermal softening, and it also serves as an adhesive for imparting thermal conductivity and thermal conductivity of the thermal conductive agent. The above-mentioned temperature of thermal denaturation, low viscosity or melting is a temperature range as a thermally conductive member, and the polyoxynoxy resin itself may be a medium having a melting point of less than 40 ° C, causing thermal softening, although as long as it is selected from The above-mentioned polyoxyxene resin may be 'any one', but in order to maintain frivolity at room temperature, -11 - (8) (8) 1352102 may, for example, contain R1 Si〇3/2 unit (hereinafter referred to as τ unit). And/or a copolymer of Si〇2 (hereinafter abbreviated as Q), and a copolymer of these and R, si〇2/2 monoterpene (hereinafter abbreviated as D unit), or may be added by D It is a poly-sand oxy-oil and a poly-sand-oxygen rubber. In this case, the polyoxyn resin containing T unit and D unit, and the polyoxyl resin containing τ unit and the viscosity at 25t are 〇.2Pa.s. The combination of the above polyoxygenated oil or polyoxynized raw rubber is preferred, and the polyoxyxene resin may also be a terminal blocked by a Rl3Si〇i/2 unit (Μ unit). The above R1 is an unsubstituted or substituted valent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms. Specific examples of such R1 are methyl, ethyl, propyl, isopropyl 'butyl' isobutyl tert-butyl, pentyl 'neoxyl' hexyl, cyclohexyl, octyl, decyl, An alkyl group such as a fluorenyl group, an aryl group such as a phenyl group or a tolyl 'xyphenylene naphthyl group, an aralkyl group such as a benzyl 'phenethyl group or a phenylpropyl group, a vinyl group, an allyl 'propenyl group or an isopropenyl group. An alkenyl group such as a butenyl-hexenyl group or a cyclohexenyl 'octenyl group, and a hydrogen atom of a part or all of such a group may be substituted by a halogen atom such as fluorine, bromine or chlorine, or a cyano group. For example, such as chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, cyanoethyl, etc., among these, methyl, phenyl and vinyl are particularly preferred. With regard to a more specific description of the polyoxyxene resin, the polyoxyxylene resin used in the present invention is a T unit and/or a Q unit, which is a design of a unit and a unit, or a unit and a unit, in particular In order to improve the brittleness at the time of solid form and to prevent excellent toughness such as breakage during handling, it is more effective to introduce a ruthenium unit, and it is more preferable to use a D unit. Here, the substituent of the unit (R1) is used. The methyl group and the phenyl group are preferred, and the -12-(9)(9)!3521〇2 substituent of the D unit is preferably a methyl group, a phenyl group or a vinyl group. Further, the ratio of the above-mentioned fluorene unit to the D unit is 10:90~90:10 is better, especially 20:8 0~80:20. Furthermore, 'even the polyfluorene resin synthesized from the commonly used unit and T unit' or the unit and the Q unit is used as the main component, and the viscosity of the unit formed by the D unit and the end is the unit is mixed by mixing .2Pa·s or more of polyoxygenated oil or polyoxynized raw rubber to improve brittleness. Therefore, when the thermo-softening polyoxyxene resin contains a T unit and does not contain a D unit, a material having excellent handleability can be obtained by adding a polysiloxane or a polyoxyn rubber having a D unit as a main component. In this case, the amount of the polyoxygenated oil or the polyoxynized raw rubber added is 1 part by mass of the polyfluorene oxide resin, and the amount of the cerium to 4 5 parts by mass is substituted, in particular, the amount of 5 to 40 parts by mass is substituted. Preferably, the operability is deteriorated when it is not added, and when it exceeds 45 parts by mass, there is a concern that fluidity also occurs at room temperature to separate the component from the composition. As the above-mentioned 'heat-softening polyoxyl resin can be reduced to a certain degree when the softening is good, and if a binder is formed as a filler, the molecular weight of the polyoxyl resin is preferably 500 to 2,000. Especially 1000~10000 is preferred. When the molecular weight of the polyoxyxene resin is less than 500, the viscosity at the time of thermal softening is too low, and there is a concern that the heat is circulated, and if the viscosity exceeds 20,000, the opposite viscosity is too high, and the electronic component and the heat-dissipating component are lowered. Adhesive concerns. Further, the polyoxyxylene resin used in the present invention is suitably used for imparting flexibility and pleating property to the thermally conductive member of the present invention, and in this case, a single molecular weight of -13-(10)(10)1352102 can be used. The polymer may be a mixture of two or more polymers having different molecular weights. [Thermal Conductive Agent] The thermal conductive agent is a combination of an aluminum powder and a zinc oxide powder, and a polyoxyxylene resin is added to impart thermal conductivity to the present invention. (B) The aluminum powder of the composition has an average particle diameter of 1 to 50 μm, preferably 1 to 30 μm, and when the particle diameter is smaller than Ιμιη, it is difficult to increase the thermal conductivity of the polyfluorene resin, and the thermal conductivity is not improved. At the same time, the fluidity of the material at the time of thermal softening becomes insufficient; on the other hand, the material obtained when the particle diameter exceeds 50 μπ! becomes non-uniform, and when the heat is softened, even if the pressure is not thinned, the thermal conductivity is deteriorated. . (C) The average particle diameter of the zinc oxide powder of the composition is in the range of Ο.Ι~5μιη, preferably in the range of 〇.2~4μιη, and the particle size is less than Ο.ΐμχη, the fluidity of the material becomes insufficient at the time of thermal softening, When the amount is more than 5 μηΐ, the charging efficiency of the combination with the aluminum powder is deteriorated. In general, the average particle diameter ratio (B)/(C) of the aluminum powder and the zinc oxide powder is 3 or more, preferably 10 or more, and the charging efficiency can be improved. Further, the shape of the aluminum powder and the zinc oxide may be either spherical or unfixed, but the shape of the aluminum powder of the main component is closer to a spherical shape, and the more likely it is to become highly entangled and to improve the fluidity at the time of thermal softening. The thermal conductivity of the aluminum powder and the zinc oxide powder are each about 23 7 W/mK and about 20 W/m K because only the aluminum powder is advantageous for obtaining high thermal conductivity, but only the composition of the aluminum powder is obtained. The operability is slightly lowered, and the contact with -14-(11) (11) 1352102 heat resistance becomes large. After various reviews, it is found that the use of zinc oxide can solve this problem, and if the ratio is higher than that of aluminum powder/zinc oxide The thermal conductivity of the composition obtained by the powder of less than 1 is insufficient, and if it is more than 10, the above problem cannot be solved, so it is in the range of 1 to 10, preferably 2 to 8. The total addition amount of the aluminum powder and the zinc oxide powder is 40 to 200 parts by mass, preferably 500 to 1 100 parts by mass, and the thermal conductivity of the composition obtained when the amount is less than 400 parts by mass is changed. When the amount is more than 1200 parts by mass, the workability is lowered, and the fluidity at the time of thermal softening is deteriorated. [Other Additives] As a component for improving the wettability of the thermally conductive filler and the thermosoftening polyoxyxene resin, the following general formula (1) R2aR3bSiO(OR4) 4-ab ( 1 ) The oxygen sand chamber is more effective. R2 in the general formula (1) is an alkyl group having 6 to 15 carbon atoms, and specific examples thereof include a hexyl group, an octyl group, a decyl group, a decyl group, and a dodecyl 'tetradecane group. When the carbon number is less than 6, the thermal conductive agent and the wettability are insufficient, and if it is more than 15, it is cured at normal temperature, which is inconvenient to handle, and the heat resistance and flame retardancy of the composition are lowered. a is 1, 2 or 3, but in particular, 1 is preferably 'and' R3 is a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms. Specific examples thereof include methyl group, ethyl group, propyl group, hexyl group and octyl group. a cycloalkyl group such as a cyclopentyl group such as a cyclopentyl group or a cyclohexyl group; an alkenyl group such as a vinyl group or an allyl group; an aryl '2-phenethyl group such as a phenyl group or a tolyl group; Benzylethyl, etc. -15-(12) 1352102 aralkyl, 3,3,3-trifluoropropyl, 2-(nonafluorobutyl)ethyl, 2-(heptadecafluorooctyl)ethyl, P A halogenated hydrocarbon group such as a chlorophenyl group, etc., particularly preferably a methyl group or an ethyl group. R4 is an alkyl group having 1 to 6 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group. Particularly, a methyl group or an ethyl group is preferred. Specific examples of the alkoxydecane represented by the above general formula include the following. 〔1

C6H13Si ( OCH3 ) 3

C]〇H21Si ( OCH3 ) 3 [Chemical 3] C12H25Si ( OCH3 ) 3

C12H25Si ( OC2H5 ) 3 [Chemical 5] C, 〇H21Si ( CH3 ) ( 〇CH3 ) 2

C,〇H2)Si(C6H5)(〇CH3) 2 -16- (13) (13)1352102 [Chemical 7] C 丨〇H2,Si(CH3)( OC2H5 ) 2 〔化8〕 C,〇H2iSi ( CH = CH2 ) ( OCH3 ) 2 [Chemical 9]

The amount of the organic decane added is in the range of 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the thermoplastic polyacrylic resin. When the amount is less than 0.1 part by mass, the wettability of the thermal conductive agent is insufficient to lower the workability, and more than 20 parts by mass not only cannot increase the effect but is disadvantageous to the cost. In the thermosoftening heat-conductive member of the present invention, any component of the additive or the chelating agent used in the general synthetic rubber may be reused without detriment to the object of the present invention, and specifically, the fluorinated polycondensation of the releasing agent may be added. Oxide surfactant, carbon black of coloring agent, titanium dioxide, oxidation, iron red, platinum catalyst for flame retardant imparting agent, metal oxide such as iron oxide, titanium oxide, cerium oxide, or metal hydroxide, processability A working oil agent, a reactive decane or a decane, etc. of a lifting agent, and optionally a cerium oxide powder such as a splashing cerium oxide or a cerium oxide, a thixotropic enhancer, or the like may be added as a separation at a high temperature. Preventive agent. The thermosoftening thermally conductive member of the present invention is produced by using a mixer such as a helium mixer -17-(14) (14) 1352102 (needer), a low-speed gate mixer, a planetary mixer, or the like. The above components can be easily produced by blending and kneading at a temperature equal to or higher than the softening temperature of the thermoplastic polyfluorene resin. The present invention is formed into a general sheet-like molding method, and the sheet-like molding method is formed by extrusion molding of a hot flexible heat conductive material, rolling forming, press molding, or coating of an organic solvent. . The thickness of the sheet is in the range of 0.01 to 2 mm, particularly preferably in the range of 0.02 to 0.5 mm, and in the case of 0.01 mm or less, the fine unevenness on the surface of the heat-generating electronic component and the heat-dissipating member cannot be flattened, and the contact resistance is increased. When the thickness exceeds 2 mm, the thermal conductivity is deteriorated. Further, the present invention can be improved by the use of the form as shown in Fig. 1. In summary, the separation film 1 having a small peeling force of a continuous strip shape and the separation film 2 having a large peeling force cut into a certain size are interposed. The thermosoftening thermally conductive member 3 of the present invention cut into the same shape as the separation film 2 is placed in a continuous placement. The method is as follows: the pull tab tape 4 adhered to the separation film 2 is lifted up. At this time, the thermosoftening heat conductive member is peeled off from the separation film 1 and moved to the separation film 2, and at this time, the heat softening heat conduction is further performed. After the surface of the member is adhered to the heat-generating electronic component or the heat-dissipating member, the tab tape 4 is lifted upward to peel the separation film 2, whereby the thermosoftening thermally conductive member can be easily placed in a desired fixed portion. [Embodiment] [Embodiment] -18-(15) 1352102 [Examples 1 to 6 and Comparative Example 5] Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited thereto. First, the following components are prepared to constitute the thermosoftening thermally conductive member of the present invention. (A) Thermoplastic polyoxyl resin A-1: Ο25Τφ55ϋνΐ20 (molecular weight 3,300, softening point: 40 to 50 Α-2: Μ15ϋΙ20Φ: \ *τ> Φ 2 2 1 5 1 (molecular weight 9,000, softening point: 9 0 to 1 0 0 〇C ) However, D is Me 2 S i 0 2 /2 , τ Φ is PhSi03/2 , and Dvi is ViMeSi02/2 Μ Is M e 3 S ϊ Ο 1 / 2 ' Σ > φ 2 is P h 2 S i 0 2 / 2 * where Me is methyl, Ph is phenyl, vi is vinyl, and their respective ratios are Mohr (B) Ingredient aluminum powder B_1: Aluminum powder of average particle size 7. 〇μηι Β-2: Aluminum powder of average particle size 22μηι Β-3: Aluminum powder of average particle size 1.5μτΏ · Β-4: average grain Aluminum powder with a diameter of 75 μm. (C) Ingredient zinc oxide powder C-]: Zinc oxide powder with an average particle size of 0·5μπΐ-19- (16) (16) 1352102 (D) Other additives D-] ·· 25° The phenyl phenyl sulfonium oleate 1C F - 5 4 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) D-2: the alkoxy decane c1 (the composition of the next) )H2 |Si (OCH3) 3 KBM3103 (product name: Shin-Etsu Chemical Co., Ltd.) Preparation method of thermosoftening heat-conductive member (A) Thermoplastic poly-oxygen resin of component (D) and other additives of (D) component and toluene 2 0 The mass parts are blended into the planetary mixer according to the ratio of Table 1, and stirred at room temperature for 20 minutes to form a homogeneous solution. Then, the aluminum powder in the component (B) and the zinc oxide powder in the component (C) are in accordance with Table 1. The mixture was stirred at room temperature for 1 hour, and the obtained composition solution was further diluted with 250 parts by mass of a nail, and then coated with a dot coater (cornma co at er) to coat the coating with a large peeling force. The separating film 2 of the release agent pet (polyethylene terephthalate) was passed through a drying oven at a temperature of 80 ° C for 5 minutes to remove toluene by evaporation, and then rolled thereon by hot rolling at 90 ° C. The PET separation film 1 coated with a release agent having a small peeling force is applied by press-fitting, and the thickness of the completed thermosoftening heat-conductive member is 100 μm, and the two sides obtained by the above steps are obtained. Separation of the separation film with less peeling force and separation of the larger separation film 2 The heat-softening heat-conductive member 3 is processed into a strip shape by a slit having a width of 25 mm, and the peeling force is large. -20-(17) (17) 1352102 is attached to the film 2 with a pull tab tape. At the same time, the pull-tab tape, the separation film 2, and the thermosoftening thermally conductive member are cut at a position of 25 mm in length. The separation film 1 having a small peeling force retains the band shape, and forms a form as shown in Fig. 1. Evaluation method (The above-mentioned thermosoftening thermally conductive member was held in a standard aluminum plate having two thicknesses and heat resistance, and the pressure was about 1414 Mpa while being heated at 100 ° C for 10 minutes, and then two standard aluminum plates were measured. The thickness of the actual sheet was measured by subtracting the thickness of the known standard aluminum sheet, but the thickness was measured using a micrometer (Mitutoyo Co., Ltd., M820-25VA), and laser (micr 〇f) 1 ash ) The thermal resistance of the moisture-hardening thermal conductive member of the measuring machine (manufactured by NETZSC Co., Ltd.) (2) The softening point was measured by the JI S Κ 7 206 Wechsler softening temperature test method. (3) The operability of Figure 1 When the product form is mounted on the heat sink, it is evaluated by manual work. ◎: Very good 〇: Good △: Slightly good X: Poor The evaluation results are shown in Table 1 ° -21 - (18) 1352102 Table 1 EXAMPLES (mass parts) Examples of the implementation Examples 1 Examples 3 Examples 5 Examples 6 A-1 100 100 100 100 (A) Ingredient A-2 80 65 B-1 400 640 800 (B) Ingredients B-2 440 440 400 B-3 200 200 180 (C) Component C- 1 100 160 160 300 1 60 140 D-1 20 35 (D) Component D-2 5 5 7 5 5 Softening point uc About 50 About 50 About 50 About 50 About 80 About 70 Thickness μ m 20 2 5 42 30 63 5 5 Thermal resistance °C cm 2/w 0.25 0.14 0.23 0.12 0.35 0.34 Δ Δ Operational adhesion ◎ ◎. 〇 Adhesive 〇 slightly stronger and weaker

Comparative Example The thermosoftening thermally conductive member was produced in the same manner as in Examples 1 to 6 by using the respective components of Table 2, and the same evaluation as in Example 6 was carried out. The results are shown in Table 2. -22 - (19) 1352102 Table 2

The actual S case (mass parts) comparison comparison comparison comparison example 1 case 2 case 3 case 4 case 5 case 6 A- 1 100 100 100 100 100 (A) component A-2 50 B-1 800 300 1000 300 B -2 440 (B) Ingredient B-3 200 B-4 640 (C) Ingredient C-1 50 300 160 1 60 400 D-1 5 0 (D) Ingredient D-2 5 5 5 5 5 About 50 About 50 Approx. 50 at room temperature about 50 about 50 softening point °c with fluidity thickness μηι 28 20 80 46 95 50 thermal resistance °C c m2/W 0.18 0.3 8 0.3 5 0.26 0.53 0.7 1 Δ XXXX Adhesive adhesion Adhesion Δ The adhesion is slightly stronger, the weaker, the stronger, the weaker, the scattered, the operative adhesive, the thin film, the hot film, the thin film, the weaker heat, the peeling, the sticky, the peeling, the sticky NG NG NG NG -23- (20) (20) 1352102 The results of 1 and 2 confirmed that the thermosoftening thermally conductive member of the present invention is excellent in thermal conductivity and workability. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a product form of a thermosoftening thermally conductive member of the present invention. [Description of main component symbols] 1 Separation film 2 having a small peeling force 2 Separating film 3 having a large peeling force is thermally softened Thermally conductive member 4 pull tab tape-24-

Claims (1)

1352102 曰 曰 替换 替换 · · 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 A product for placing a thermally conductive member, comprising: a continuous strip-shaped separation film (1), a separation film (2) cut into a certain size, and the separation film (1) and the separation film (2) A sheet-shaped thermosoftening heat-conductive member (3) having a thickness of 0.01 to 2 mm cut into a shape similar to that of the separation film (2) is continuously placed, and a pull-tab adhered to the separation film (2) (pull tab) tape (4); the sheet-like thermosoftening heat-conductive member (3) is composed of the following composition: (A) thermoplastic polyoxyl resin, (B) average particle diameter of 1 to 50 μm Aluminum powder, and (C) zinc oxide powder having an average particle diameter of 0.1 to 5 μm, (only, for every 100 parts by mass of the (Α) component, the total of (Β) component and (C) component is 400 to 1 200 parts by mass' (Β) Component and (C) component mass ratio: (Β) ingredients / (C) The composition of the composition = 1 to 10), which is non-flowable at room temperature, has a low viscosity, softening, or melting property at a temperature of 40 to 1 ° C, and is disposed in a heat-generating electronic component. And the heat-conductive member used between the heat-dissipating parts: The peeling force of the two types of separation films (1) and (2) with respect to the sheet-like thermosoftening heat-conductive member (3)' satisfy the following relationship: 1352102 1 Year 曰 correction replacement page||{> 剥离 separation film (1) peeling force < separation film (2) peeling force; therefore, the sheet is lifted by lifting the aforementioned tape (4) The heat-softening heat-conductive member (3) is peeled off from the separation film (1) to the side of the separation film (2), and the sheet-like thermosoftening heat-conductive member (3) is adhered to the heat-generating electronic component or the heat-dissipating component. Further, the tab tape is lifted upward, and the separation film (2) is peeled off from the sheet-like thermosoftening heat-conductive member, whereby the sheet-like thermosoftening heat-conductive member (3) is placed on a heat-generating electronic component or heat-dissipating. The desired part of the product. 2. The article for placing a sheet-like thermosoftening thermally conductive member according to the first aspect of the patent application, wherein the thermoplastic polyoxymethylene resin of the component (A) is a RiSiOw unit (T unit) and a R^SiO^ unit (D) Unit) (wherein R1 is a carbon number of 1 to 1 〇 an unsubstituted or substituted one-valent hydrocarbon). 3. If the flaky thermosoftening thermally conductive member of claim 1 or 2 is placed A product in which a part of the thermoplastic resin of the component (A) is replaced by a polyoxyphthalic acid or a polyoxyxene rubber having a viscosity of 0.2 Pa·s or more at 25 ° C of 0 to 4 parts by mass. 4. The article for placing a sheet-like thermosoftening thermally conductive member according to the first or second aspect of the patent application, wherein the composition of the above components (A) to (C) further comprises a general formula (1) Alkoxydecane, R2aR3bSi(OR4)4-ab (1) 0 to 20 parts by mass (wherein R2 is an alkyl group having 6 to 15 carbon atoms, and R3 is a hydrocarbon having 1 to 8 carbon atoms, R4 is an alkyl group having 1 to 6 carbon atoms, a is an integer of 1 to 3, b is an integer of 〇 2 and 2, and a + b is an integer of 1 to 3).