1352102 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於爲了冷卻電子部品而於產熱性電子部品 與散熱片或金屬筐體等散熱部品之間裝入導熱性材料’特 別是於電子部品運轉溫度範圍內黏度降低、軟化、或融解 而提升對熱交界面的密著性，可改善自產熱性電子部品向 散熱部品的熱傳導者，而且本發明以聚矽氧樹脂爲基質， 耐熱性及難燃性優於以往的製品。 【先前技術】 電視、錄放影機、電腦、醫療儀器、事務機器、通信 裝置等近年來的電子機器的電路設計複雜性增加，故需要 製造能裝入相當於數十萬個數量的三極體之積體電路。伴 隨著電子機器小型化、高性能化，在更加縮小的面積內要 組裝的電子部品個數增加，故電子部品本身的形狀接著小 型化，也因此’各電子部品產生的熱增加，因爲此熱會造 成故障或機能不全，故有效果的散發熱的實裝技術變得很 重要。 爲了去除伴隨個人電腦、DVD光碟機、行動電話等 電子機器所使用的CPU、驅動1C、記憶體等電子部品中 積體度的提升所產生的熱’提議了很多的散熱方法及使用 於此的散熱構件β 以往爲了抑制電子機器等之電子部品溫度上昇，採取 直接傳熱至使用鋁、銅、黃銅等導熱率高的金屬之散熱 -5- (2) (2)1352102 片，此散熱片爲傳導由電子部品產生的熱，利用此熱與外 面氣體的溫度差由表面散發出去，爲了有效率的傳導電子 部品所產生的熱，散熱片與電子部品必須沒有空隙的密 合’故於電子部品與散熱片之間裝入具有柔軟性的低硬度 導熱性散薄片或導熱性潤滑脂。 【發明內容】 〔發明所欲解決之課題〕 但是雖然低硬度導熱性薄片操作性優，要使厚度變薄 卻很難’又，無法避免電子部品及散熱片表面的微細凹凸 而使接觸熱抵抗變大，產生無法有效率的傳導熱的問題。 另一方面，因爲導熱性潤滑脂的厚度能夠做得很薄， 可縮小與散熱片之間的距離，而且可塡平表面的微細凹 凸，故能大幅降低熱抵抗，但是有導熱性潤滑脂的操作性 差而污染周圍1因熱循環使油分離（抽離/pumping out) 而降低熱特性等問題。 近年，很多人提案使用於室溫下操作性佳的固體狀， 藉由電子部品所產生的熱而軟化或熔融之熱軟化性材料做 爲具有低硬度導熱性薄片的操作性及導熱性潤滑脂的低熱 抵抗力之雙方特性的導熱性構件》 特表2000-5 092 09號公報中，提案丙烯酸系感壓黏合 劑及α鏈烯烴系熱可塑劑及導熱性塡充劑所成之導熱性材 料、或鏈烷烴系蠟及導熱性塡充劑所成之導熱性材料（專 利文獻])。 •6- (3) (3)1352102 特開2 000-3 3 62 7號公報中，提案由熱可塑性樹脂、 爐' 導熱性塡充物所成之導熱性組成物（專利文獻2)。 特開200 1 - 8975 6號公報中提案丙烯酸等聚合物及， 碳數12〜16之醇、石油蠟等之熔點成份及，導熱性塡充劑 所成熱仲介材料（專利文獻3 )。 特開200 2- 121332號公報中，由聚烯烴及導熱性塡充 劑所成之熱軟化性散熱薄片（專利文獻4 )。 但是此等中之任一項皆以有機物爲基質，並非屬於難 燃性材料’又，汽車中組裝此等構件時，會擔心因爲高溫 而劣化。 另一方面，聚矽氧爲大家所熟知的耐熱性、耐候性、 難燃性優異的材料，也有多數提案同樣以聚矽氧爲基質的 熱軟化性材料。 特開2000-3279 1 7號公報中，提案熱可塑性聚矽氧樹 脂及蠟狀變性聚矽氧樹脂及導熱性塡充物所成之組成物 (專利文獻5 )。 特開200 1 -2 9 1 807號公報中，提案聚矽氧凝膠等黏合 劑樹脂及蠟及導熱性塡充材料所成之導熱性薄片（專利文 獻6 )。 特開2002-234952號公報中，提案聚矽氧等高分子凝 膠及變性聚矽氧、蠟等加熱後變成液體之化合物及導熱性 塡充物所成之熱軟化散熱薄片（專利文獻7)。 但是此等因爲除了聚矽氧以外，還使用蠟等有機物及 聚矽氧變性之蠟’故有難燃性、耐熱性比聚矽氧單品差的 (4) (4)1352102 缺點。 在此’本發明者等於WO 〇2/9 1465Α1中，提案由熱 可塑性聚砂氧樹脂及導熱性塡充材料所成的散熱構件做爲 難燃性、耐熱性優異的材料（專利文獻8)。 〔專利文獻1〕特表2000-509209號公報 〔專利文獻2〕特開2000-336279號公報 〔專利文獻3〕特開2001-89756號公報 〔專利文獻4〕特開2002-121332號公報 〔專利文獻5〕特開2000-327917號公報 〔專利文獻6〕特開2001-291807號公報 〔專利文獻7〕特開2002-234952號公報 〔專利文獻 8〕WO 02/9 1 465 A 1 〔用以解決課題之手段〕 本發明者等鑑於上述問題精心檢討的結果，找到一種 在常溫下可形成固體狀薄片等所希望的形狀，易裝、卸於 電子部品及散熱片，藉由電子部品運轉時所產生的熱軟化 後降低接觸熱抵抗，故傳熱性能優異，同時難燃性、耐熱 性、耐候性也很優異之熱軟化性導熱性材料。 即，室溫下爲固體，從耐熱性優異的聚矽氧樹脂選出 於一定的溫度範圍內熱軟化、低黏度化或熔融之成份，做 爲導熱性塡充劑，與鋁粉末及氧化鋅組合後塡充、形成薄 片狀之導熱性構件放置於電子部品及散熱部品之間，藉此 達成去除熱的期望，而且此導熱性構件與以往產品比較， -8- (5) (5)1352102 其傳熱性、操作性優異。 本發明’於被配置於產熱性電子部品及散熱部品之 間’電子部品運轉前的溫度下不具流動性，藉由電子部品 運轉時所產生40〜1〇〇 °C溫度的熱，經由低黏度化、軟 化 '或熔融而塡充於電子部品及散熱部品的交界之熱軟化 性導熱性構件中，提供〜（5)之熱軟化性導熱性構 件。 (1 ) 此熱軟化性導熱性構件其特徵爲由下述（A)〜（C) 成份所成的組成物形成薄片狀。 (A) 熱可塑性聚矽氧樹脂i〇〇質量份 (B) 平均粒徑i〜5 0 μ m的鋁粉末 (C) 平均粒徑0.1〜5μηι的氧化鋅粉末 (Β)成份及（C)成份的合計爲4〇〇〜12〇〇質量份 (Β)成份及（C)成份的質量比爲，（Β)成份/ ^ (C)成份=1〜ίο的範圍。 此熱軟化性導熱性構件其特徵爲（Α)成份的熱可塑 性聚砂氧樹脂爲由I^SiO3/2單元（Τ單元）及R〗2Si〇2/2 單兀（D卓兀）（式中R爲碳數1〜1〇非取代或取代之— 價烴）所成。 (6) (6)1352102 此熱軟化性導熱性構件其特徵爲由25 °C下黏度 〇.2Pa · s以上的聚矽氧油或聚矽氧生橡膠〇~45質量份， 取代（A)成份之熱可塑性樹脂的一部份。 (4) 此熱軟化性導熱性構件其特徵爲上述（A) ~(C)成 份所成的組成物中，更含有一般式（1)之烷氧基矽烷， R2aR3bSi ( OR4 ) 4-a-b - ( 1 ) 0 〜20 質量份 (式中R2爲碳數6〜15之烷基，R3爲碳數1〜8之一價烴 基，R4爲碳數1~6之烷基，a爲1〜3的整數，b爲0〜2的 整數，a + b爲1〜3的整數）。 (5 ) 此熱軟化性導熱性構件其特徵爲，熱軟化性導熱性構 件的厚度爲〇.〇1〜2mm的薄片，對此薄片的剝離力需滿足 下述關係之連續帶狀的分離薄膜1及剪成一定大小形狀的 分離薄膜2之間，連續放置剪成與分離薄膜2同樣形狀的 狀態的薄片，將黏貼於分離薄膜2之拉片（pull tab)膠 帶往上提，薄片從分離薄膜1剝離往分離薄膜2移動，更 將薄片面黏貼於發熱性電子部品或散熱部品後再將拉片膠 帶往上提使分離薄膜2剝離，藉此使薄片放置於所定的部 -10- (7) (7)1352102 位。 分離薄片1的剝離力<分離薄片2的剝離力 〔發明之效果〕 本發明之熱軟化性導熱性構件因爲導熱性佳、與產熱 性電子部品及散熱部品的密合性佳，藉由將其置於兩者之 間，將產熱性電子部品所產生的熱有效率的散發至散熱部 品’可大幅改善產熱生電子部品及使用其之電子機器等的 壽命。 〔實施發明的最佳形態〕 以下針對本發明做更詳細的發明。 做爲本發明之熱軟化性導熱性構件的介質（matrix ) 之熱可塑性聚矽氧樹脂，只要所形成的導熱性部材於室溫 下實質上爲固體（非流動性），較佳爲40 °C以上，產熱 性電子部品所產生的熱所能達到最高溫度以下，具體而言 爲4 0~ 100 °C程度的溫度範圍內中，爲熱軟化、低黏度化 或熔融之流動化者即可，此介質爲引起熱軟化的因素之 一 ’也擔任賦予具導熱性之導熱性塡充劑加工性及作業性 之黏合劑的任務。 上述的熱漱化、低黏度化或熔融的溫度爲做爲導熱性 構件的溫度範圍，聚矽氧樹脂本身可爲具有未滿40 °C的 熔點者’引起熱軟化的介質，雖然只要選自如上述聚矽氧 樹脂’任何一種皆可’但是爲了於室溫下維持非流動性， -11 - (8) (8)1352102 可舉例如含有R1 Si〇3/2單元（以下簡稱爲τ單元）及/或 Si〇2 (以下簡稱爲Q)之共聚物、及此等與R、si〇2/2單 兀（以下簡稱爲D單元）的共聚物，另外，也可添加由D 單兀所成之聚砂氧油及聚砂氧生橡膠，此等中以含T單元 及D單兀之聚矽氧樹脂、及含τ單元之聚矽氧樹脂與 於25t下黏度爲〇.2Pa.s以上之聚矽氧油或聚矽氧生橡 膠的組合爲佳，聚矽氧樹脂亦可爲末端被Rl3Si〇i/2單元 (Μ單元）封鏈者。 上述R1爲碳數1~10、較佳爲1〜6非取代或取代之— 價烴基。如此的R1的具體例爲甲基、乙基、丙基、異丙 基'丁基 '異丁基' tert-丁基、戊基 '新成基 '己基、環 己基、辛基、壬基、癸基等烷基，苯基、甲苯基' 二甲苯 基 '萘基等芳基，苄基 '苯乙基、苯丙基等芳烷基，乙烯 基、烯丙基' 丙烯基、異丙烯基、丁烯基' 己烯基、環己 烯基'辛烯基等鏈烯基及’此等基的一部分或全部的氫原 子被氟、溴、氯等鹵素原子、氰基等取代者，可舉例如如 氯甲基、氯丙基、溴乙基、三氟丙基、氰乙基等，此等中 特別以甲基、苯基及乙烯基爲佳。 關於聚矽氧樹脂更具體的說明，本發明所使用的聚矽 氧樹脂爲含T單元及/或Q單元者，其爲Μ單元及T單 元、或Μ單位及Q單元之設計，特別是爲了具有改善固 形時的脆度，且可防止操作時破損等之優異的強靭性時， 導入Τ單元爲有效的方法，再加上使用D單元則更佳， 在此Τ單元的取代基（R1)以甲基及苯基爲佳，D單元的 -12- (9) (9)!3521〇2 取代基以甲基、苯基及乙烯基爲佳，又，上述Τ單元及D 單元的比例以10:90〜90:10爲佳，特別是以20:8 0〜80:20 舄佳。 再者’既使由一般常用的Μ單元及T單元 '或Μ單 元及Q單元所合成之聚矽氧樹脂，以此爲主成份，藉由 混合由D單元形成、末端爲Μ單元之黏度〇.2Pa· s以上 之聚矽氧油或聚矽氧生橡膠來改善脆度。因此，熱軟化之 聚矽氧樹脂含T單元、不含D單元時，如果添加以D單 元爲主成份之聚矽氧油或聚矽氧生橡膠等可得到操作性優 異的材料。此時，聚矽氧油或聚矽氧生橡膠的添加量爲 1〇〇質量份的聚矽氧樹脂內，取代〇〜4 5質量份的量，特 別是取代5〜4 0質量份的量爲佳，未添加則操作性變差， 超過4 5質量份時’則有室溫下也出現流動性而使本成份 自組成物分離的疑慮。 如同上述’熱軟化性聚矽氧樹脂於軟化時黏度若能降 低至某程度爲佳’又若能形成塡充劑之黏合劑爲佳，此聚 矽氧樹脂的分子量爲500〜2000爲佳，特別是以 1000〜10000 爲佳 。 聚矽氧樹脂的分子量未達5 00時，熱軟化時的黏度過 低而有因爲熱循環而有抽離的疑慮，超過20000則相反的 黏度會過高而有降低與電子部品及散熱部品的密合性的疑 慮。 再者’本發明所使用的聚矽氧樹脂，適合使用可賦予 本發明之導熱性構件柔軟性及打褶性（tuck )，此時可使 -13- (10) (10)1352102 用單一分子量聚合物，也可以使用混合2種以上分子量不 同之聚合物等。 [導熱性塡充劑] 導熱性塡充劑爲鋁粉末及氧化鋅粉末所組合而成，添 加聚矽氧樹脂，賦予本發明之導熱性者。 (B) 成份之鋁粉末的平均粒徑爲1~50μιυ的範圍， 較佳爲1〜30μηι的範圍，粒徑小於Ιμιη時，對聚矽氧樹脂 的高塡充變難而無法提升導熱性，同時熱軟化時的材料的 流動性變不足；另一方面粒徑超過50μπ!時所製得的材料 變得不均勻，熱軟化時既使加壓也無法使厚度變薄，故導 熱性變差。 (C) 成份的氧化鋅粉末的平均粒徑爲Ο.Ι~5μιη的範 圍，較佳爲〇.2~4μιη的範圍，粒徑小於Ο.ΐμχη時則熱軟 化時材料的流動性變不足，大於5μηΐ時與鋁粉末的組合 之塡充效率變差，總之鋁粉末及氧化鋅粉末的平均粒徑比 (B)/(C)爲3以上，較佳爲10以上，可提升塡充效 率。 又鋁粉末及氧化鋅的形狀可爲球狀、不固定形狀之任 一，但是主成份之鋁粉末的形狀爲愈接近球狀者，愈可能 成爲高塡充且提升熱軟化時的流動性。 鋁粉末、氧化鋅粉末的導熱率各爲約23 7W/mK、約 2 0 W/m K，因爲僅有鋁粉末較利於得到高的導熱性，但是 僅有鋁粉末所製得之組成物的操作性稍微降低，而且接觸 -14- (11) (11)1352102 熱抵抗變大》經過種種的檢討結果，發現倂用氧化鋅可解 決此問題，其添加比例若質量比之鋁粉末/氧化鋅粉末小 於1所製得之組成物的導熱率會變不足，大於1 0則無法 解決前述的問題，故以1〜10的範圍、較佳爲2~8的範 圍。此等鋁粉末及氧化鋅粉末的合計添加量爲40 0〜]200 質量份，較佳爲500〜1 100質量份的範圍，添加量低於 400質量份時所得到之組成物的導熱性變不足，大於1200 質量份則操作性變低、熱軟化時的流動性變差。 [其他添加劑] 本組成份中做爲提導熱性填充劑及熱軟化性聚矽氧樹 脂的濕潤性的成份，使用下述一般式（1 ) R2aR3bSiO ( OR4 ) 4-a-b ( 1 ) 所示院氧基砂院則效果更好，一般式（1)中之R2爲 碳數6~15的烷基，具體例可列舉己基、辛基、壬基、癸 基、十二烷基 '十四烷基等，碳數小於6則導熱性塡充劑 及濕潤性不充份，大於1 5則常溫下成固化故操作不便， 且組成物的耐熱性及難燃性會降低。a爲1、2或3，但特 別以1爲佳’又’ R3爲碳數1〜8的飽和或不飽和的一價 烴基’具體例可列舉甲基、乙基、丙基、己基、辛基等烷 基’環戊基、環己基等的環烷基，乙烯基、烯丙基等鏈烯 基，苯基、甲苯基等芳基’ 2-苯乙基、2-甲基-2-苯乙基等 -15- (12) 1352102 芳烷基，3,3,3-三氟丙基、2-(九氟丁基）乙基、2-(十 七氟辛基）乙基、P-氯苯基等鹵化烴基等，特別以甲基、 乙基爲佳。R4爲碳數1〜6的烷基，可列舉甲基、乙基、 丙基、丁基、戊基、己基等，特別以甲基、乙基爲佳。 前述一般式所示烷氧基矽烷的具體例可列舉下述者。 〔化1〕1352102 (1) EMBODIMENT OF THE INVENTION [Technical Fields of the Invention] The present invention relates to the provision of a thermally conductive material between a heat-generating electronic component and a heat-dissipating member such as a heat sink or a metal casing for cooling an electronic component. In the operating temperature range of the electronic component, the viscosity is lowered, softened, or melted to improve the adhesion to the heat interface, and the heat conduction of the heat-generating electronic component to the heat-dissipating component can be improved, and the present invention uses the polyoxyn resin as a matrix to resist heat. Sexual and flame retardant is superior to previous products. [Prior Art] In recent years, the circuit design complexity of electronic devices such as televisions, video recorders, computers, medical instruments, transaction machines, and communication devices has increased, so it is necessary to manufacture a triode equivalent to hundreds of thousands. The integrated circuit. With the miniaturization and high performance of the electronic equipment, the number of electronic components to be assembled in a much smaller area is increased. Therefore, the shape of the electronic component itself is further reduced in size, so that the heat generated by each electronic component increases because of the heat. It will cause malfunction or incomplete function, so the effect of the heat-dissipating mounting technology becomes very important. In order to remove the heat generated by the increase in the physical fitness of the CPU, the drive unit 1C, and other electronic components used in electronic devices such as personal computers, DVD players, and mobile phones, many heat dissipation methods have been proposed and used. Heat-dissipating member β In the past, in order to suppress the temperature rise of electronic components such as electronic equipment, direct heat transfer was performed to heat-dissipating -5 - (2) (2) 1352102 sheets of metals with high thermal conductivity such as aluminum, copper, and brass. In order to conduct heat generated by the electronic component, the temperature difference between the heat and the outside air is dissipated from the surface. In order to efficiently conduct heat generated by the electronic component, the heat sink and the electronic component must have no gaps in close contact. A soft, low-hardness thermal conductive sheet or thermal grease is placed between the part and the heat sink. [Problem to be Solved by the Invention] However, although the low-hardness thermal conductive sheet is excellent in handleability, it is difficult to make the thickness thin, and it is difficult to avoid the fine unevenness of the surface of the electronic component and the heat sink to make contact heat resistance. It becomes larger, creating the problem of inefficient heat conduction. On the other hand, since the thickness of the thermally conductive grease can be made thin, the distance from the heat sink can be reduced, and the fine unevenness of the surface can be flattened, so that the heat resistance can be greatly reduced, but the thermal grease is provided. Poor operability and contamination of the surrounding 1 due to thermal cycling to separate the oil (pumping out) and reduce thermal characteristics and the like. In recent years, many people have proposed to use a soft-softening material which is softened or melted by heat generated by electronic components as a operative and heat-conductive grease having a low-hardness thermal conductive sheet. A thermally conductive member having both characteristics of low heat resistance. In Japanese Patent Publication No. 2000-5092 09, a thermally conductive material composed of an acrylic pressure sensitive adhesive, an alpha olefin thermoplastic resin, and a thermal conductive agent is proposed. Or a thermally conductive material made of a paraffin wax and a thermal conductive agent (Patent Document). (6) (3) (3) 1352, and the heat conductive composition of the thermoplastic resin and the furnace's thermal conductive material is proposed (Patent Document 2). JP-A No. 200 1 - 8975 discloses a polymer such as acrylic acid, a melting point component such as an alcohol having 12 to 16 carbon atoms, a petroleum wax, and a thermal intercalation material formed by a thermal conductive agent (Patent Document 3). JP-A-2002-121332 discloses a thermosoftening heat-dissipating sheet made of a polyolefin and a thermally conductive enthalpy (Patent Document 4). However, any of these materials is based on organic matter and is not a non-flammable material. In addition, when assembling such components in automobiles, there is a fear of deterioration due to high temperatures. On the other hand, polyfluorene is a well-known material which is excellent in heat resistance, weather resistance, and flame retardancy, and many thermosetting materials which are also based on polyoxane. Japanese Laid-Open Patent Publication No. 2000-3279 No. 7 proposes a composition of a thermoplastic polysulfide resin, a waxy denatured polysiloxane resin, and a thermally conductive filler (Patent Document 5). Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. 2002-234952 proposes a heat-softening heat-dissipating sheet made of a polymer gel such as polyfluorene oxide, a compound which is heated to become a liquid such as denatured polyfluorene or a wax, and a thermal conductive filler (Patent Document 7) . However, in addition to the polyfluorene oxide, an organic substance such as wax and a polyfluorene-denatured wax are used, so that the flame retardancy and heat resistance are inferior to those of the polyoxyl oxide product (4) (4) 1352102. In the present invention, the heat dissipating member made of a thermoplastic polysilicate resin and a thermally conductive entangled material is proposed as a material having excellent flame retardancy and heat resistance (Patent Document 8). [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. 2000-336237 (Patent Document No. JP-A No. 2000- 336. [Patent Document 6] JP-A-2001-291807 (Patent Document 7) JP-A-2002-234952 (Patent Document 8) WO 02/9 1 465 A 1 Means for Solving the Problem The inventors of the present invention have found a desired shape in which a solid sheet or the like can be formed at a normal temperature, and are easily attached and detached to an electronic component and a heat sink, and are operated by an electronic component. A heat-softenable thermally conductive material which is excellent in heat-transfer performance and excellent in flame retardancy, heat resistance, and weather resistance, after the heat is softened and the contact heat resistance is lowered. That is, it is a solid at room temperature, and is selected from a polyoxynitride resin having excellent heat resistance in a temperature range of heat softening, low viscosity or melting, and is used as a thermal conductive chelating agent in combination with aluminum powder and zinc oxide. The heat-conductive member that is filled and formed into a sheet is placed between the electronic component and the heat-dissipating component, thereby achieving the desire to remove heat, and the thermally conductive member is compared with the conventional product, -8-(5) (5) 1352102 Excellent heat and workability. The present invention is disposed between the heat-generating electronic component and the heat-dissipating component, and has no fluidity at a temperature before the operation of the electronic component, and generates heat at a temperature of 40 to 1 〇〇 ° C when the electronic component is operated, and passes through the low viscosity. A thermosoftening thermally conductive member of the above-mentioned (5) is provided in a thermosoftening thermally conductive member which is melted and softened or melted at the junction of the electronic component and the heat dissipating component. (1) The thermosoftening thermally conductive member is characterized in that a composition composed of the following components (A) to (C) is formed into a sheet shape. (A) Thermoplastic polyoxyl resin i〇〇 parts by mass (B) Aluminum powder with an average particle diameter of i~5 0 μm (C) Zinc oxide powder (Β) composition with an average particle diameter of 0.1 to 5 μηι and (C) The total amount of the components is 4 〇〇 12 12 parts by mass (Β) and the mass ratio of the (C) component is (Β) component / ^ (C) component = 1 to ίο. The thermosoftening thermally conductive member is characterized in that the thermoplastic composition of the (Α) component is composed of I^SiO3/2 unit (Τ unit) and R 2 2〇 2/2 unit (D Zhuo). Where R is a carbon number of 1 to 1 〇 unsubstituted or substituted - a valence hydrocarbon). (6) (6) 1352102 The thermosoftening thermally conductive member is characterized in that it is composed of a polysiloxane oil or a polyoxyxylene rubber 〇~45 parts by weight at a viscosity of 〇2 Pa·s or more at 25 ° C, instead of (A) a part of the thermoplastic resin of the composition. (4) The thermosoftening thermally conductive member is characterized in that the composition of the above components (A) to (C) further contains an alkoxydecane of the general formula (1), R2aR3bSi(OR4)4-ab- (1) 0 to 20 parts by mass (wherein R2 is an alkyl group having 6 to 15 carbon atoms, R3 is a hydrocarbon group having 1 to 8 carbon atoms, R4 is an alkyl group having 1 to 6 carbon atoms, and a is 1 to 3) An integer, b is an integer from 0 to 2, and a + b is an integer from 1 to 3. (5) The thermosoftening thermally conductive member is characterized in that the thickness of the thermosoftening thermally conductive member is 〇1 to 2 mm, and the peeling force of the sheet is required to satisfy the following relationship: a continuous strip-shaped separation film 1 and between the separation films 2 cut into a certain size, the sheet which is cut into the same shape as the separation film 2 is continuously placed, and the pull tab tape adhered to the separation film 2 is lifted up, and the sheet is separated. The film 1 is peeled off and moved toward the separation film 2, and the sheet surface is adhered to the heat-generating electronic component or the heat-dissipating component, and then the release tape is lifted upward to peel off the separation film 2, whereby the sheet is placed in the predetermined portion -10- ( 7) (7) 1352102 bits. Peeling force of the separation sheet 1 < Peeling force of the separation sheet 2 [Effect of the invention] The thermosoftening heat-conductive member of the present invention has good thermal conductivity and good adhesion to the heat-generating electronic component and the heat-dissipating member. This is placed between the two, and the heat generated by the heat-generating electronic components is efficiently dissipated to the heat-dissipating parts, which can greatly improve the life of the heat-generating electronic components and electronic devices using the same. [Best Mode for Carrying Out the Invention] Hereinafter, a more detailed invention will be made of the present invention. A thermoplastic polyoxymethylene resin which is a matrix of the thermosoftening thermally conductive member of the present invention, as long as the thermally conductive member formed is substantially solid (non-flowing) at room temperature, preferably 40 ° Above C, the heat generated by the heat-generating electronic parts can reach the maximum temperature or lower, specifically, in the temperature range of 40 to 100 °C, it can be a fluidization of heat softening, low viscosity or melting. This medium is one of the factors causing thermal softening, and it also serves as an adhesive for imparting thermal conductivity and thermal conductivity of the thermal conductive agent. The above-mentioned temperature of thermal denaturation, low viscosity or melting is a temperature range as a thermally conductive member, and the polyoxynoxy resin itself may be a medium having a melting point of less than 40 ° C, causing thermal softening, although as long as it is selected from The above-mentioned polyoxyxene resin may be 'any one', but in order to maintain frivolity at room temperature, -11 - (8) (8) 1352102 may, for example, contain R1 Si〇3/2 unit (hereinafter referred to as τ unit). And/or a copolymer of Si〇2 (hereinafter abbreviated as Q), and a copolymer of these and R, si〇2/2 monoterpene (hereinafter abbreviated as D unit), or may be added by D It is a poly-sand oxy-oil and a poly-sand-oxygen rubber. In this case, the polyoxyn resin containing T unit and D unit, and the polyoxyl resin containing τ unit and the viscosity at 25t are 〇.2Pa.s. The combination of the above polyoxygenated oil or polyoxynized raw rubber is preferred, and the polyoxyxene resin may also be a terminal blocked by a Rl3Si〇i/2 unit (Μ unit). The above R1 is an unsubstituted or substituted valent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms. Specific examples of such R1 are methyl, ethyl, propyl, isopropyl 'butyl' isobutyl tert-butyl, pentyl 'neoxyl' hexyl, cyclohexyl, octyl, decyl, An alkyl group such as a fluorenyl group, an aryl group such as a phenyl group or a tolyl 'xyphenylene naphthyl group, an aralkyl group such as a benzyl 'phenethyl group or a phenylpropyl group, a vinyl group, an allyl 'propenyl group or an isopropenyl group. An alkenyl group such as a butenyl-hexenyl group or a cyclohexenyl 'octenyl group, and a hydrogen atom of a part or all of such a group may be substituted by a halogen atom such as fluorine, bromine or chlorine, or a cyano group. For example, such as chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, cyanoethyl, etc., among these, methyl, phenyl and vinyl are particularly preferred. With regard to a more specific description of the polyoxyxene resin, the polyoxyxylene resin used in the present invention is a T unit and/or a Q unit, which is a design of a unit and a unit, or a unit and a unit, in particular In order to improve the brittleness at the time of solid form and to prevent excellent toughness such as breakage during handling, it is more effective to introduce a ruthenium unit, and it is more preferable to use a D unit. Here, the substituent of the unit (R1) is used. The methyl group and the phenyl group are preferred, and the -12-(9)(9)!3521〇2 substituent of the D unit is preferably a methyl group, a phenyl group or a vinyl group. Further, the ratio of the above-mentioned fluorene unit to the D unit is 10:90~90:10 is better, especially 20:8 0~80:20. Furthermore, 'even the polyfluorene resin synthesized from the commonly used unit and T unit' or the unit and the Q unit is used as the main component, and the viscosity of the unit formed by the D unit and the end is the unit is mixed by mixing .2Pa·s or more of polyoxygenated oil or polyoxynized raw rubber to improve brittleness. Therefore, when the thermo-softening polyoxyxene resin contains a T unit and does not contain a D unit, a material having excellent handleability can be obtained by adding a polysiloxane or a polyoxyn rubber having a D unit as a main component. In this case, the amount of the polyoxygenated oil or the polyoxynized raw rubber added is 1 part by mass of the polyfluorene oxide resin, and the amount of the cerium to 4 5 parts by mass is substituted, in particular, the amount of 5 to 40 parts by mass is substituted. Preferably, the operability is deteriorated when it is not added, and when it exceeds 45 parts by mass, there is a concern that fluidity also occurs at room temperature to separate the component from the composition. As the above-mentioned 'heat-softening polyoxyl resin can be reduced to a certain degree when the softening is good, and if a binder is formed as a filler, the molecular weight of the polyoxyl resin is preferably 500 to 2,000. Especially 1000~10000 is preferred. When the molecular weight of the polyoxyxene resin is less than 500, the viscosity at the time of thermal softening is too low, and there is a concern that the heat is circulated, and if the viscosity exceeds 20,000, the opposite viscosity is too high, and the electronic component and the heat-dissipating component are lowered. Adhesive concerns. Further, the polyoxyxylene resin used in the present invention is suitably used for imparting flexibility and pleating property to the thermally conductive member of the present invention, and in this case, a single molecular weight of -13-(10)(10)1352102 can be used. The polymer may be a mixture of two or more polymers having different molecular weights. [Thermal Conductive Agent] The thermal conductive agent is a combination of an aluminum powder and a zinc oxide powder, and a polyoxyxylene resin is added to impart thermal conductivity to the present invention. (B) The aluminum powder of the composition has an average particle diameter of 1 to 50 μm, preferably 1 to 30 μm, and when the particle diameter is smaller than Ιμιη, it is difficult to increase the thermal conductivity of the polyfluorene resin, and the thermal conductivity is not improved. At the same time, the fluidity of the material at the time of thermal softening becomes insufficient; on the other hand, the material obtained when the particle diameter exceeds 50 μπ! becomes non-uniform, and when the heat is softened, even if the pressure is not thinned, the thermal conductivity is deteriorated. . (C) The average particle diameter of the zinc oxide powder of the composition is in the range of Ο.Ι~5μιη, preferably in the range of 〇.2~4μιη, and the particle size is less than Ο.ΐμχη, the fluidity of the material becomes insufficient at the time of thermal softening, When the amount is more than 5 μηΐ, the charging efficiency of the combination with the aluminum powder is deteriorated. In general, the average particle diameter ratio (B)/(C) of the aluminum powder and the zinc oxide powder is 3 or more, preferably 10 or more, and the charging efficiency can be improved. Further, the shape of the aluminum powder and the zinc oxide may be either spherical or unfixed, but the shape of the aluminum powder of the main component is closer to a spherical shape, and the more likely it is to become highly entangled and to improve the fluidity at the time of thermal softening. The thermal conductivity of the aluminum powder and the zinc oxide powder are each about 23 7 W/mK and about 20 W/m K because only the aluminum powder is advantageous for obtaining high thermal conductivity, but only the composition of the aluminum powder is obtained. The operability is slightly lowered, and the contact with -14-(11) (11) 1352102 heat resistance becomes large. After various reviews, it is found that the use of zinc oxide can solve this problem, and if the ratio is higher than that of aluminum powder/zinc oxide The thermal conductivity of the composition obtained by the powder of less than 1 is insufficient, and if it is more than 10, the above problem cannot be solved, so it is in the range of 1 to 10, preferably 2 to 8. The total addition amount of the aluminum powder and the zinc oxide powder is 40 to 200 parts by mass, preferably 500 to 1 100 parts by mass, and the thermal conductivity of the composition obtained when the amount is less than 400 parts by mass is changed. When the amount is more than 1200 parts by mass, the workability is lowered, and the fluidity at the time of thermal softening is deteriorated. [Other Additives] As a component for improving the wettability of the thermally conductive filler and the thermosoftening polyoxyxene resin, the following general formula (1) R2aR3bSiO(OR4) 4-ab ( 1 ) The oxygen sand chamber is more effective. R2 in the general formula (1) is an alkyl group having 6 to 15 carbon atoms, and specific examples thereof include a hexyl group, an octyl group, a decyl group, a decyl group, and a dodecyl 'tetradecane group. When the carbon number is less than 6, the thermal conductive agent and the wettability are insufficient, and if it is more than 15, it is cured at normal temperature, which is inconvenient to handle, and the heat resistance and flame retardancy of the composition are lowered. a is 1, 2 or 3, but in particular, 1 is preferably 'and' R3 is a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms. Specific examples thereof include methyl group, ethyl group, propyl group, hexyl group and octyl group. a cycloalkyl group such as a cyclopentyl group such as a cyclopentyl group or a cyclohexyl group; an alkenyl group such as a vinyl group or an allyl group; an aryl '2-phenethyl group such as a phenyl group or a tolyl group; Benzylethyl, etc. -15-(12) 1352102 aralkyl, 3,3,3-trifluoropropyl, 2-(nonafluorobutyl)ethyl, 2-(heptadecafluorooctyl)ethyl, P A halogenated hydrocarbon group such as a chlorophenyl group, etc., particularly preferably a methyl group or an ethyl group. R4 is an alkyl group having 1 to 6 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group. Particularly, a methyl group or an ethyl group is preferred. Specific examples of the alkoxydecane represented by the above general formula include the following. 〔1
C6H13Si ( OCH3 ) 3C6H13Si ( OCH3 ) 3
C】〇H21Si ( OCH3 ) 3 〔化3〕 C12H25Si ( OCH3 ) 3C]〇H21Si ( OCH3 ) 3 [Chemical 3] C12H25Si ( OCH3 ) 3
C12H25Si ( OC2H5 ) 3 〔化5〕 C,〇H21Si ( CH3 ) ( 〇CH3 ) 2C12H25Si ( OC2H5 ) 3 [Chemical 5] C, 〇H21Si ( CH3 ) ( 〇CH3 ) 2
C,〇H2)Si ( C6H5 ) ( 〇CH3 ) 2 -16- (13) (13)1352102 〔化7〕 C 丨 〇H2,Si ( CH3 ) ( OC2H5 ) 2 〔化8〕 C,〇H2iSi ( CH = CH2 ) ( OCH3 ) 2 〔化9〕C,〇H2)Si(C6H5)(〇CH3) 2 -16- (13) (13)1352102 [Chemical 7] C 丨〇H2,Si(CH3)( OC2H5 ) 2 〔化8〕 C,〇H2iSi ( CH = CH2 ) ( OCH3 ) 2 [Chemical 9]
Ci〇H2iSi ( CH2CH2CF3 ) ( OCH3 ) 2 其添加量相對於熱可塑性聚矽氧樹脂100質量份爲 0.01〜2 0質量份的範圍，較佳爲0.1〜10質量份的範圍，此 有機矽烷的添加量未達0· 1質量份則導熱性塡充劑的濕潤 性不足而降低作業性，多於2 0質量份則不僅無法增加效 果反而對成本不利。 本發明的熱軟化性導熱性構件中，在無損本發明目的 下可再使用一般合成橡膠所使用的添加劑或塡充劑之任意 成份，具體而言，也可添加離型劑之氟素變性聚矽氧界面 活性劑，著色劑之碳黑、二氧化鈦、氧化.鐵紅，難燃性賦 予劑之鉑觸媒、氧化鐵、氧化鈦、氧化铈等金屬氧化物、 或金屬氫氧化物，加工性提升劑之操作油劑、反應性矽烷 或矽氧烷等，而且可任意添加沈濺性二氧化矽或燒成二氧 化矽等之二氧化矽粉末、觸變提升劑等做爲高溫時的分離 防止劑。 本發明的熱軟化性導熱性構件，藉由使用揉混合機 -17- (14) (14)1352102 (needer)、低速擅样機（gate mixer)、行星式混合機 (planetary mixer)等混合機將上述各成份於熱可塑性聚 矽氧樹脂的軟化溫度以上的溫度下調配混練可很容易製 造。 本發明物爲使用於一般薄片狀的成形，薄片狀的成形 方法爲藉由將熱軟性導熱性材料押出成形、壓延輥軋成 形 '加壓成形、或溶解於有機溶劑之塗膜成形等而成形。 此薄片的厚度爲0.01〜2mm的範圍，特別是0.02~0.5mm 的範圍爲佳，0.01mm以下則無法塡平產熱性電子部品及 散熱部品的表面上微細凹凸，而使接觸抵抗力變大，超過 2mm則導熱性變差。 又’本發明可藉由使用如圖1的形態提升操作的作業 性，總之，連續帶狀之剝離力較小的分離薄膜1及剪成一 定大小形狀之剝離力較大的分離薄膜2之間，以連續放置 形態放入剪成與分離薄膜2同樣形狀之本發明的熱軟化性 導熱性構件3。其使用方法爲將黏貼於分離薄膜2之拉片 (pull tab)膠帶4往上提’此時熱軟化性導熱性構件從 分離薄膜1剝離往分離薄膜2移動，此時更將熱軟化性導 熱性構件面黏貼於發熱性電子部品或散熱部品後再將拉片 膠帶4往上提使分離薄膜2剝離，藉此可很容易的將熱軟 化性導熱性構件放置於所希望固定的部位。 【實施方式】 〔實施例〕 -18- (15) 1352102 [實施例1〜6及比較例卜5] 以下藉由實施例更詳述本發明，但本發明並不受限於 此。 首先，準備以下各成份，構成本發明的熱軟化性導熱 性構件》 (A)成份熱可塑性聚矽氧樹脂 A-1 : Ο25Τφ55ϋνΐ20(分子量 3,300、軟化點：40〜50 Α-2 ： Μ15ϋΙ20Φ : \ *τ> Φ 2 2 1 5 1 (分 子量 9,000 、 軟化點： 9 0 〜1 0 0 〇C ) 但是 D 爲 Me 2 S i 0 2 /2 、τ Φ爲 PhSi03/2 、Dvi 爲 ViMeSi02/2 Μ 爲 M e 3 S ϊ Ο 1 / 2 ' Σ>φ 2爲 P h 2 S i 0 2 / 2 *其中Me 爲甲基、Ph爲苯基、vi爲乙烯基，又其各自的比率爲莫 耳％ 。 (B) 成份鋁粉末 B_1 :平均粒徑7.〇μηι的鋁粉末 Β-2 :平均粒徑22μηι的鋁粉末 Β-3 :平均粒徑1.5μτΏ的鋁粉末 · Β-4 :平均粒徑75μπι的鋁粉末 . (C) 成份氧化鋅粉末 C-】：平均粒徑0·5μπΐ的氧化鋅粉末 -19- (16) (16)1352102 (D )成份其它添加劑 D-] ·· 25°C下的黏度爲〇.4Pa. s之含苯基聚矽氧油 1C F - 5 4 (商品名、信越化學工業株式會社製） D-2:其次的組成所示之烷氧基矽烷c1()H2|Si (OCH3) 3 KBM3103(商品名 '信越化學工業株式會社 製） 熱軟化性導熱性構件的製作方法 (A)成份的熱可塑聚矽氧樹脂與（D)成份的其它 添加劑與甲苯2 0質量份如表1的比例調配投入行星型混 合機，於室溫下攪拌20分鐘使其成均勻溶液，接著將 (B)成份中的鋁粉末與（C )成份的氧化鋅粉末依照表1 的比例投入，於室溫下攪拌1小時，所得到的組成物溶液 更使用甲本250質量份稀釋後，使用點狀塗佈機（cornma co at er)塗膜於己塗佈剝離力較大的離型劑之pet (聚對 苯二甲酸乙二醇酯）製的分離薄膜2，接著通過溫度80 °C 的乾燥爐5分鐘以揮發除去甲苯後，用90 °C的熱輥軋於 其上壓著貼合塗佈了剝離力較小的離型劑之PET製的分 離薄膜1，使完成的熱軟化性導熱性構件的厚度爲 1 0 0 μ m 〇 藉由上述步驟所製得之兩面挾持於剝離力較小的分離 薄膜〗及剝離較大的分離薄膜2間之熱軟化性導熱性構件 3，經寬25mm的縫隙加工製成帶狀後，剝離力較大的分 -20- (17) (17)1352102 離薄膜2貼上拉片（pull tab )膠帶，同時於長度25mm 的位置剪裁拉片膠帶、分離薄膜2及熱軟化性導熱性構 件’剝離力較小的分離薄膜1保留帶狀原狀，形成如圖1 製品的形態。 評價方法 (Ο厚度及熱抵抗 二枚的標準鋁板中挾持上述之熱軟化性導熱性構件， 加壓約〇.14Mpa的同時’以100°C加熱10分鐘，接著測 定二枚標準的鋁板，藉由減去已知道的標準鋁片的厚度來 測定實質的薄片厚度，但厚度的測定使用測微計（股分有 限公司三豐製、型式：M820-25VA )，又，使用激光 (m i c r 〇 f 1 a s h )測定機（N E T Z S C Η社製）潮定熱軟化性導 熱性構件的熱抵抗。 (2 )軟化點 使用JI S Κ 7 206韋氏軟化溫度試驗方法測定。 (3 )操作性 圖1的製品形態裝置於散熱片時藉由人工作業來進行 評價。 ◎:非常好 〇：好 △:略好 X :不佳 此等的評價結果列示於表1° -21 - (18)1352102 表1 實施例 (質量份） 實施 實施 實施 實施 實施 實施 例1 例2 例3 例4 例5 例6 A-1 100 100 100 100 (A)成分 A-2 80 65 B-1 400 640 800 (B)成分 B-2 440 440 400 B-3 200 200 180 (C)成分 C-1 100 160 160 300 1 60 140 D-1 20 35 (D)成分 D-2 5 5 7 5 5 軟化點uc 約50 約50 約50 約50 約80 約70 厚度 μ m 20 2 5 42 30 63 5 5 熱抵抗°C cm 2/w 0.25 0.14 0.23 0.12 0.35 0.34 Δ Δ 操作性 黏著 ◎ ◎. 〇 黏著 〇 稍強 稍弱The amount of the organic decane added is in the range of 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the thermoplastic polyacrylic resin. When the amount is less than 0.1 part by mass, the wettability of the thermal conductive agent is insufficient to lower the workability, and more than 20 parts by mass not only cannot increase the effect but is disadvantageous to the cost. In the thermosoftening heat-conductive member of the present invention, any component of the additive or the chelating agent used in the general synthetic rubber may be reused without detriment to the object of the present invention, and specifically, the fluorinated polycondensation of the releasing agent may be added. Oxide surfactant, carbon black of coloring agent, titanium dioxide, oxidation, iron red, platinum catalyst for flame retardant imparting agent, metal oxide such as iron oxide, titanium oxide, cerium oxide, or metal hydroxide, processability A working oil agent, a reactive decane or a decane, etc. of a lifting agent, and optionally a cerium oxide powder such as a splashing cerium oxide or a cerium oxide, a thixotropic enhancer, or the like may be added as a separation at a high temperature. Preventive agent. The thermosoftening thermally conductive member of the present invention is produced by using a mixer such as a helium mixer -17-(14) (14) 1352102 (needer), a low-speed gate mixer, a planetary mixer, or the like. The above components can be easily produced by blending and kneading at a temperature equal to or higher than the softening temperature of the thermoplastic polyfluorene resin. The present invention is formed into a general sheet-like molding method, and the sheet-like molding method is formed by extrusion molding of a hot flexible heat conductive material, rolling forming, press molding, or coating of an organic solvent. . The thickness of the sheet is in the range of 0.01 to 2 mm, particularly preferably in the range of 0.02 to 0.5 mm, and in the case of 0.01 mm or less, the fine unevenness on the surface of the heat-generating electronic component and the heat-dissipating member cannot be flattened, and the contact resistance is increased. When the thickness exceeds 2 mm, the thermal conductivity is deteriorated. Further, the present invention can be improved by the use of the form as shown in Fig. 1. In summary, the separation film 1 having a small peeling force of a continuous strip shape and the separation film 2 having a large peeling force cut into a certain size are interposed. The thermosoftening thermally conductive member 3 of the present invention cut into the same shape as the separation film 2 is placed in a continuous placement. The method is as follows: the pull tab tape 4 adhered to the separation film 2 is lifted up. At this time, the thermosoftening heat conductive member is peeled off from the separation film 1 and moved to the separation film 2, and at this time, the heat softening heat conduction is further performed. After the surface of the member is adhered to the heat-generating electronic component or the heat-dissipating member, the tab tape 4 is lifted upward to peel the separation film 2, whereby the thermosoftening thermally conductive member can be easily placed in a desired fixed portion. [Embodiment] [Embodiment] -18-(15) 1352102 [Examples 1 to 6 and Comparative Example 5] Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited thereto. First, the following components are prepared to constitute the thermosoftening thermally conductive member of the present invention. (A) Thermoplastic polyoxyl resin A-1: Ο25Τφ55ϋνΐ20 (molecular weight 3,300, softening point: 40 to 50 Α-2: Μ15ϋΙ20Φ: \ *τ> Φ 2 2 1 5 1 (molecular weight 9,000, softening point: 9 0 to 1 0 0 〇C ) However, D is Me 2 S i 0 2 /2 , τ Φ is PhSi03/2 , and Dvi is ViMeSi02/2 Μ Is M e 3 S ϊ Ο 1 / 2 ' Σ > φ 2 is P h 2 S i 0 2 / 2 * where Me is methyl, Ph is phenyl, vi is vinyl, and their respective ratios are Mohr (B) Ingredient aluminum powder B_1: Aluminum powder of average particle size 7. 〇μηι Β-2: Aluminum powder of average particle size 22μηι Β-3: Aluminum powder of average particle size 1.5μτΏ · Β-4: average grain Aluminum powder with a diameter of 75 μm. (C) Ingredient zinc oxide powder C-]: Zinc oxide powder with an average particle size of 0·5μπΐ-19- (16) (16) 1352102 (D) Other additives D-] ·· 25° The phenyl phenyl sulfonium oleate 1C F - 5 4 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) D-2: the alkoxy decane c1 (the composition of the next) )H2 |Si (OCH3) 3 KBM3103 (product name: Shin-Etsu Chemical Co., Ltd.) Preparation method of thermosoftening heat-conductive member (A) Thermoplastic poly-oxygen resin of component (D) and other additives of (D) component and toluene 2 0 The mass parts are blended into the planetary mixer according to the ratio of Table 1, and stirred at room temperature for 20 minutes to form a homogeneous solution. Then, the aluminum powder in the component (B) and the zinc oxide powder in the component (C) are in accordance with Table 1. The mixture was stirred at room temperature for 1 hour, and the obtained composition solution was further diluted with 250 parts by mass of a nail, and then coated with a dot coater (cornma co at er) to coat the coating with a large peeling force. The separating film 2 of the release agent pet (polyethylene terephthalate) was passed through a drying oven at a temperature of 80 ° C for 5 minutes to remove toluene by evaporation, and then rolled thereon by hot rolling at 90 ° C. The PET separation film 1 coated with a release agent having a small peeling force is applied by press-fitting, and the thickness of the completed thermosoftening heat-conductive member is 100 μm, and the two sides obtained by the above steps are obtained. Separation of the separation film with less peeling force and separation of the larger separation film 2 The heat-softening heat-conductive member 3 is processed into a strip shape by a slit having a width of 25 mm, and the peeling force is large. -20-(17) (17) 1352102 is attached to the film 2 with a pull tab tape. At the same time, the pull-tab tape, the separation film 2, and the thermosoftening thermally conductive member are cut at a position of 25 mm in length. The separation film 1 having a small peeling force retains the band shape, and forms a form as shown in Fig. 1. Evaluation method (The above-mentioned thermosoftening thermally conductive member was held in a standard aluminum plate having two thicknesses and heat resistance, and the pressure was about 1414 Mpa while being heated at 100 ° C for 10 minutes, and then two standard aluminum plates were measured. The thickness of the actual sheet was measured by subtracting the thickness of the known standard aluminum sheet, but the thickness was measured using a micrometer (Mitutoyo Co., Ltd., M820-25VA), and laser (micr 〇f) 1 ash ) The thermal resistance of the moisture-hardening thermal conductive member of the measuring machine (manufactured by NETZSC Co., Ltd.) (2) The softening point was measured by the JI S Κ 7 206 Wechsler softening temperature test method. (3) The operability of Figure 1 When the product form is mounted on the heat sink, it is evaluated by manual work. ◎: Very good 〇: Good △: Slightly good X: Poor The evaluation results are shown in Table 1 ° -21 - (18) 1352102 Table 1 EXAMPLES (mass parts) Examples of the implementation Examples 1 Examples 3 Examples 5 Examples 6 A-1 100 100 100 100 (A) Ingredient A-2 80 65 B-1 400 640 800 (B) Ingredients B-2 440 440 400 B-3 200 200 180 (C) Component C- 1 100 160 160 300 1 60 140 D-1 20 35 (D) Component D-2 5 5 7 5 5 Softening point uc About 50 About 50 About 50 About 50 About 80 About 70 Thickness μ m 20 2 5 42 30 63 5 5 Thermal resistance °C cm 2/w 0.25 0.14 0.23 0.12 0.35 0.34 Δ Δ Operational adhesion ◎ ◎. 〇 Adhesive 〇 slightly stronger and weaker
比較例 使用表2的各成份取代表]各成份，使用實施例1〜6 同樣的方法製作熱軟化性導熱性構件，此等進行與實施例 卜6同樣的評價，結果列示於表2。 -22 - (19) 1352102 表2Comparative Example The thermosoftening thermally conductive member was produced in the same manner as in Examples 1 to 6 by using the respective components of Table 2, and the same evaluation as in Example 6 was carried out. The results are shown in Table 2. -22 - (19) 1352102 Table 2
實商 S例 (質量份） 比較 比較 比較 比較 比較 比較 例1 例2 例3 例4 例5 例6 A- 1 100 100 100 100 100 (A)成分 A-2 50 B-1 800 300 1000 300 B-2 440 (B)成分 B-3 200 B-4 640 (C)成分 C-1 50 300 160 1 60 400 D-1 5 0 (D)成分 D-2 5 5 5 5 5 約50 約50 約50 室溫下 約50 約50 軟化點°c 具有流 動性 厚度μηι 28 20 80 46 95 50 熱抵抗°C c m2/W 0.18 0.3 8 0.3 5 0.26 0.53 0.7 1 Δ X X X X 黏著 黏著力 黏著力 黏著力 Δ 黏著力 稍強 強的分 弱的散 強的分 弱的散 操作性 黏著 離薄膜 熱片沾 離薄膜 稍弱 熱片沾 剝離 黏 剝離 黏 NG NG NG NG -23- (20) (20)1352102 表1及表2的結果証實本發明的熱軟化性導熱性構件 的導熱性及操作性優異。 【圖式簡單說明】 〔圖1〕爲表示本發明的熱軟化性導熱性構件的製品 形態. 【主要元件符號說明】 1剝離力較小之分離薄膜 2剝離力較大之分離薄膜 3熱軟化性導熱性構件 4拉片（pull tab)膠帶 -24-The actual S case (mass parts) comparison comparison comparison comparison example 1 case 2 case 3 case 4 case 5 case 6 A- 1 100 100 100 100 100 (A) component A-2 50 B-1 800 300 1000 300 B -2 440 (B) Ingredient B-3 200 B-4 640 (C) Ingredient C-1 50 300 160 1 60 400 D-1 5 0 (D) Ingredient D-2 5 5 5 5 5 About 50 About 50 Approx. 50 at room temperature about 50 about 50 softening point °c with fluidity thickness μηι 28 20 80 46 95 50 thermal resistance °C c m2/W 0.18 0.3 8 0.3 5 0.26 0.53 0.7 1 Δ XXXX Adhesive adhesion Adhesion Δ The adhesion is slightly stronger, the weaker, the stronger, the weaker, the scattered, the operative adhesive, the thin film, the hot film, the thin film, the weaker heat, the peeling, the sticky, the peeling, the sticky NG NG NG NG -23- (20) (20) 1352102 The results of 1 and 2 confirmed that the thermosoftening thermally conductive member of the present invention is excellent in thermal conductivity and workability. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a product form of a thermosoftening thermally conductive member of the present invention. [Description of main component symbols] 1 Separation film 2 having a small peeling force 2 Separating film 3 having a large peeling force is thermally softened Thermally conductive member 4 pull tab tape-24-