KR101064023B1 - Thermal Softening Thermally Conductive Member - Google Patents

Abstract

The present invention relates to a heat generating electronic component in a heat conductive member used for heat dissipation of an integrated circuit element such as a LSI and a CPU of a thermal conductive sheet used in a general power supply, an electronic device, and an electronic device such as a personal computer or a digital video disk drive. Heat generated from the heat dissipated to the heat dissipation component with good efficiency, and greatly improves the lifespan of the heat generating electronic component, the electronic apparatus using the same, and the like.

In addition,

(A) 100 parts by weight of a thermoplastic silicone resin,

(B) an aluminum powder having an average particle diameter of 1 to 50 µm,

(C) zinc oxide powder having an average particle diameter of 0.1 to 5 ㎛,

The sum total of (B) component and (C) component is 400-1200 weight part, and the weight ratio of (B) component and (C) component is sheet composition of the composition whose (B) component / (C) component = 1-10. Provided is a thermosoftening thermal conductive member, which is formed by molding.

Thermal softening thermal conductive member, heat generating electronic component, heat dissipation plate

Description

Thermosoftening, Thermally Conductive Member {Thermal-Softened, Thermal-Conductive Member}

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the product form of the thermosoftening thermal conductive member of this invention.

<Explanation of symbols for the main parts of the drawings>

1: Separation film slightly easy to peel

2: separation film slightly difficult to peel

3: thermosoftening thermal conductive member

4: pull tab tape

The present invention relates to a heat transfer material interposed between a heat generating electronic component and a heat dissipating component such as a heat sink or a metal case for cooling the electronic component. In particular, viscosity decreases, softens, or melts at a temperature within the operating temperature range of the electronic component, thereby improving adhesion to the thermal interface and improving heat transfer from the heat generating electronic component to the heat radiating component. Moreover, this invention is based on silicone resin, and is excellent in heat resistance and flame retardance compared with the conventional product.

In recent years, the circuit design of electronic devices such as televisions, videos, computers, medical devices, office machines, communication devices, etc. has increased in complexity, and integrated circuits containing hundreds of thousands of transistors have been manufactured. As the number and size of these electronic components assembled into smaller and smaller areas are increasing with the miniaturization and high performance of electronic equipment, the shape of the electronic components themselves continues to be miniaturized. For this reason, the heat which generate | occur | produces from each electronic component increases, and since the failure or malfunction occurs by this heat, the mounting technique which dissipates heat effectively becomes important.

Many heat dissipation methods and heat dissipation members used in electronic components such as CPUs, driver ICs, and memory used in electronic devices such as personal computers, digital video discs, mobile phones, etc. Is proposed.

Conventionally, in order to suppress the temperature rise of an electronic component in an electronic device etc., the method of directly heat-transferring to the heat-dissipating plate using metal with high thermal conductivity, such as aluminum, copper, brass, is taken. The heat dissipation plate conducts heat generated from the electronic component and emits the heat from the surface by the temperature difference with the outside air. In order to transfer the heat generated from the electronic component to the heat dissipation plate with good efficiency, the heat dissipation plate and the electronic component need to be closely adhered to each other without voids, and the flexible low hardness thermal conductive sheet or the thermal conductive grease is used to It is interposed between the diverging plates.

However, the low hardness thermally conductive sheet has excellent handling workability, but it is difficult to reduce the thickness, and because it cannot follow the minute unevenness on the surface of the electronic component or the heat dissipation plate, the contact thermal resistance is increased, so that the heat is efficiently conducted. There is a problem that you can not.

On the other hand, since the thermal grease can be made thin, the distance between the electronic component and the heat dissipation plate can be reduced, and the thermal resistance can be greatly reduced by embedding minute unevenness on the surface. However, thermally conductive greases have a problem in that they are poor in handling and contaminate the surroundings, or oil components are separated (pumped out) by thermal cycles, thereby degrading thermal characteristics.

A thermally conductive member having two characteristics of recent low hardness thermally conductive sheets and low thermal resistance of thermally conductive greases, which is a solid phase having good handleability at room temperature and softened or melted by heat generated from electronic components. Many have been proposed.

Japanese Unexamined Patent Publication No. 2000-509209 proposes a thermally conductive material composed of an acrylic pressure-sensitive adhesive, an α-olefin-based thermoplastic and a thermally conductive filler, or a thermally conductive material composed of a paraffin wax and a thermally conductive filler.

Japanese Patent Laid-Open No. 2000-336279 proposes a thermally conductive composition composed of a thermoplastic resin, a wax, and a thermally conductive filler.

Japanese Laid-Open Patent Publication No. 2001-89756 proposes a thermal mediation material comprising a polymer such as acryl, a melting point component such as an alcohol having 12 to 16 carbon atoms, a petroleum wax, and a thermally conductive filler.

Japanese Laid-Open Patent Publication No. 2002-121332 proposes a thermosoftening heat dissipating sheet composed of a polyolefin and a thermally conductive filler.                         

However, these are all based on organic matter and are not materials aimed at flame retardancy. Moreover, when these members are assembled in an automobile etc., deterioration by high temperature is feared.

On the other hand, silicon is known as a material excellent in heat resistance, weather resistance, and flame retardancy, and many of the same thermosoftening materials based on silicon have been proposed.

Japanese Unexamined Patent Application Publication No. 2000-327917 proposes a composition comprising a thermoplastic silicone resin, a wax-like modified silicone resin and a thermally conductive filler.

Japanese Laid-Open Patent Publication No. 2001-291807 proposes a thermally conductive sheet composed of a binder resin such as silicone gel, a wax and a thermally conductive filler.

Japanese Laid-Open Patent Publication No. 2002-234952 proposes a thermal softening heat radiation sheet composed of a polymer gel such as silicone, a modified silicone, wax, or the like, which becomes a liquid upon heating, and a thermally conductive filler.

However, since these use organic substances, such as wax, and the wax which modified | denatured silicone other than silicone, there existed a fault that they are inferior to flame retardance and heat resistance than a silicone single piece.

Accordingly, the present inventors have proposed a heat dissipation member composed of a thermoplastic silicone resin and a thermally conductive filler in WO 02 / 91465A1 as a material having excellent flame resistance and heat resistance.

MEANS TO SOLVE THE PROBLEM As a result of earnestly researching in view of the said problem, it is possible to shape | mold to a desired shape, such as a sheet | seat, and then solid state at normal temperature, and it is easy to attach and detach to an electronic component or a heat dissipation board, and at the time of operation of an electronic component, By softening by the generated heat and reducing the contact heat resistance, a heat-softening heat conductive material having excellent heat transfer performance, excellent flame retardancy, heat resistance and weather resistance, and excellent handleability was found.

That is, at room temperature, a component that is thermally softened, lowered in viscosity, or melted at a constant temperature range is selected from a silicone resin having excellent heat resistance, and is filled with a combination of aluminum powder and zinc oxide powder as a thermally conductive filler, into a sheet form. By arranging the molded thermally conductive member between the electronic component and the heat dissipating component, desired heat removal is achieved, and the thermally conductive member has been found to be superior in heat transfer and handleability as compared with the conventional one.

The present invention is disposed between the heat generating electronic component and the heat dissipating component, and has no fluidity at the temperature before the electronic component is operated, and the electronic component is lowered, softened or melted at a temperature of 40 to 100 ° C. by the heat generated when the electronic component is operated. In the thermosoftening thermal conductive member which is substantially filled in the boundary of the heat dissipation component, the thermosoftening thermal conductive member of the following (1)-(5) is provided.

(1) (A) 100 parts by weight of a thermoplastic silicone resin,

(B) an aluminum powder having an average particle diameter of 1 to 50 µm,

(C) zinc oxide powder with an average particle diameter of 0.1-5 micrometers,

The sum total of (B) component and (C) component is 400-1200 weight part, and the weight ratio of (B) component and (C) component is sheet composition of the composition whose (B) component / (C) component = 1-10. A thermosoftening thermal conductive member, characterized in that formed by molding.

(2) The thermoplastic silicone resin as the component (A) comprises R ¹ SiO _3/2 units (T units) and R ¹ ₂ SiO _2/2 units (D units) (wherein R ¹ is unsubstituted having 1 to 10 carbon atoms) Or a substituted monovalent hydrocarbon).

(3) A thermosoftening thermal conductive member, wherein a part of the thermoplastic silicone resin as component (A) is substituted by 0 to 45 parts by weight of a silicone oil or silicone raw rubber having a viscosity of 0.2 Pa · s or more at 25 ° C.

(4) 0 to 20 parts by weight of the alkoxysilane represented by the following formula (1) is further included in the composition comprising the components (A) to (C).

R ² _a R ³ _b Si (OR ⁴ ) _4-ab

In the formula, R ² is an alkyl group having 6 to 15 carbon atoms, R ³ is a monovalent hydrocarbon group having 1 to 8 carbon atoms, R ⁴ is an alkyl group having 1 to 6 carbon atoms, a is an integer of 1 to 3, b is It is an integer of 0-2, and a + b is an integer of 1-3.

(5) The thermosoftening thermally conductive member is a sheet having a thickness of 0.01 to 2 mm, and the sheet is cut into a continuous tape-like separator film (1) having a peeling force that satisfies the following formula (1) and the size of a certain shape. Between one separator film 2, the sheet is continuously arranged in a state cut into the same shape as the separator film 2, and the sheet is separated by pulling the pull tab tape adhered to the separator film 2 The sheet is peeled off from (1) and shifted to the separation film (2) side, and the sheet surface is adhered to the heat generating electronic component or the heat dissipating component, and then the pull tab tape is pulled to release the separation film (2). A thermosoftening thermal conductive member characterized in that it can be installed in.

Best Mode for Carrying Out the Invention

Hereinafter, the present invention will be described in more detail.

As the thermoplastic silicone resin to be a medium (matrix) of the thermosoftening thermally conductive member of the present invention, the thermally conductive member is substantially solid (non-flowable) at room temperature, preferably 40 ° C. or higher, and is used for heat generation of the heat generating electronic component. Below the maximum attained temperature, specifically, it may be any one as long as it is fluidized by heat softening, low viscosity or melting in a temperature range of about 40 to 100 ° C. This medium is a factor that causes thermal softening, but also serves as a binder for providing processability and workability to a thermally conductive filler that imparts thermal conductivity.

The temperature at which the softening, low viscosity or melting is performed is a thermally conductive member, and the silicone resin itself may have a melting point at less than 40 ° C. The medium that causes thermal softening may be any if selected from silicone resins as described above, but in order to maintain non-flowability at room temperature, R ¹ SiO _3/2 units (hereinafter referred to as T units) and / or SiO ₂ Polymers including units (hereinafter referred to as Q units), copolymers of these with R ¹ ₂ SiO _2/2 units (hereinafter referred to as D units), and the like. Alternatively, silicone oil or silicone raw rubber containing D units may be added. Among these, the combination of the silicone resin containing T unit and D unit, the silicone resin containing T unit, and the silicone oil or silicone raw rubber whose viscosity in 25 degreeC is 0.2 Pa.s or more is preferable. The silicone resin may be blocked in R ¹ ₃ SiO _1/2 units (M units).

Here, R ¹ is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms. Specific examples of such R ¹ include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, de Aralkyl groups such as alkyl groups such as alkyl groups, phenyl groups, tolyl groups, xylyl groups, naphthyl groups, benzyl groups, phenylethyl groups, and phenylpropyl groups such as aralkyl groups, vinyl groups, allyl groups, propenyl groups, isopropenyl groups, and butenyl groups , Alkenyl groups such as hexenyl group, cyclohexynyl group, octenyl group, and a part or all of the hydrogen atoms of these groups substituted with halogen atoms such as fluorine, bromine, chlorine, cyano group, etc., for example, chloro Methyl group, chloropropyl group, bromoethyl group, trifluoropropyl group, cyanoethyl group, etc. are mentioned. Among these, a methyl group, a phenyl group, and a vinyl group are especially preferable.

More specifically, the silicone resin used in the present invention includes a T unit and / or a Q unit, and is designed in M units and T units, or M units and Q units. In particular, it is effective to introduce a T unit to improve the fragility at the time of solidification and to make it excellent in toughness that can prevent breakage during handling, and it is preferable to further use the D unit. Here, the substituent of T units (R ¹⁾ Examples of the methyl group and phenyl group are preferred, and a methyl group as the substituent of D units, preferably a phenyl group and a vinyl group. Moreover, it is preferable that the ratio of said T unit and D unit is 10: 90-90: 10, and it is especially preferable to set it as 20: 80-80: 20.

In addition, in the silicone resin synthesized in M unit and T unit or M unit and Q unit, which is usually used, silicone oil or silicone raw rubber having a viscosity of 0.2 Pa · s or more, which is mainly composed of D unit and whose terminal is M unit, is mixed. The vulnerability is thereby improved. Therefore, when the silicone resin to be softened contains T units and does not contain D units, addition of silicone oil, silicone raw rubber or the like having D units as a main component may result in excellent materials for handling. In this case, the amount of the silicone oil or the silicone raw rubber added is preferably an amount of replacing 0 to 45 parts by weight, particularly an amount of 5 to 40 parts by weight in 100 parts by weight of the silicone resin. In the absence of additives, the handleability deteriorates, and when it exceeds 45 parts by weight, fluidity occurs even at room temperature, and the present component may be separated from the composition.

As described above, the thermosoftening silicone resin may lower the viscosity to some extent upon softening, and may also be a binder of the filler. It is preferable that the molecular weight of this silicone resin is 500-20000, and it is especially preferable that it is 1000-10000.

If the molecular weight of the silicone resin is less than 500, the viscosity at the time of thermal softening may be too low to be pumped out by a thermal cycle, and if it exceeds 20000, on the contrary, the viscosity at the time of thermal softening may be too high and the adhesiveness with an electronic component or a heat dissipation component will fall. There is a concern.

Moreover, it is preferable that the silicone resin used by this invention gives flexibility and adhesiveness to the heat conductive member of this invention. In this case, although a polymer having a single molecular weight may be used, two or more kinds of polymers having different molecular weights and the like may be mixed and used.

[Thermally conductive filler]

A thermally conductive filler combines aluminum powder and zinc oxide powder, and mix | blends with a silicone resin, and gives thermal conductivity to this invention.

The average particle diameter of the aluminum powder which is (B) component is the range of 1-50 micrometers, Preferably it is the range of 1-30 micrometers. When the particle diameter is smaller than 1 m, high filling to the silicone resin becomes difficult, and thermal conductivity cannot be improved, and the fluidity of the material during thermal softening is insufficient. On the other hand, when the particle size is larger than 50 µm, the material obtained becomes nonuniform, and even if it is pressurized during thermal softening, the thickness does not become thin, so that the heat transfer property is lowered.

The average particle diameter of zinc oxide powder which is (C) component is the range of 0.1-5 micrometers, Preferably it is the range of 0.2-4 micrometers. If the particle diameter is smaller than 0.1 mu m, the fluidity of the material during thermal softening will be insufficient, and if larger than 5 mu m, the filling efficiency in combination with aluminum powder will be worse. That is, when the ratio (B) / (C) of the average particle diameter of aluminum powder and zinc oxide powder is 3 or more, Preferably it is 10 or more, filling efficiency improves.

In addition, although the shape of aluminum powder and a zinc oxide powder may be either spherical or indefinite, the shape of the aluminum powder which is a main component is so close to spherical that high filling becomes possible, and the fluidity | liquidity at the time of thermosoftening improves.

The thermal conductivity of the aluminum powder and the zinc oxide powder is about 237 W / mK and about 20 W / mK, respectively, and the aluminum powder alone is advantageous for obtaining high thermal conductivity. , The contact heat resistance becomes larger. Various studies have found that this problem can be solved by using zinc oxide in combination. Its blending ratio is in the range of 1 to 10, preferably 2 to 8, since the thermal conductivity of the resulting composition is insufficient when the aluminum powder / zinc oxide powder is smaller than 1 by weight ratio, and when the ratio is larger than 10, the above problems cannot be solved. . The compounding quantity of the sum total of these aluminum powder and zinc oxide powder is 400-1200 weight part, Preferably it is the range of 500-1100 weight part. When the blending amount is less than 400 parts by weight, the thermal conductivity of the composition to be obtained is insufficient, and when larger than 1200 parts by weight, the handleability is lowered and the fluidity at the time of softening becomes worse.

[Other additives]

It is more effective to use the alkoxysilane represented by following formula (1) as a component which improves the wettability of a heat conductive filler and a thermosoftening silicone resin for this composition.                     

<Formula 1>

R ² _a R ³ _b Si (OR ⁴ ) _4-ab

R ² in the general formula (1) is an alkyl group having 6 to 15 carbon atoms, and specific examples thereof include a hexyl group, an octyl group, a nonyl group, a decyl group, a dodecyl group, and a tetradecyl group. When carbon number is less than 6, wettability with a thermally conductive filler is not enough, and when it is larger than 15, since it solidifies at normal temperature, handling is inconvenient and heat resistance and flame retardance of a composition fall. a is 1, 2 or 3, but it is preferable that it is especially 1. R ³ is a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, specific examples include cycloalkyl groups such as alkyl groups such as methyl group, ethyl group, propyl group, hexyl group and octyl group, cyclopentyl group and cyclohexyl group, Alkenyl groups such as vinyl groups and allyl groups, aryl groups such as phenyl groups and tolyl groups, aralkyl groups such as 2-phenylethyl groups and 2-methyl-2-phenylethyl groups, 3,3,3-trifluoropropyl groups, 2 Halogenated hydrocarbon groups, such as-(nanofluorobutyl) ethyl group, 2- (heptadecafluorooctyl) ethyl group, and p-chlorophenyl group, are mentioned, Especially a methyl group and an ethyl group are preferable. R <^4> is a C1-C6 alkyl group, A methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, hexyl group, etc. are mentioned, A methyl group and an ethyl group are especially preferable.

The following are mentioned as a specific example of the alkoxysilane represented by the said chemical formula.

C ₆ H ₁₃ Si (OCH ₃ ) ₃

C ₁₀ H ₂₁ Si (OCH ₃ ) ₃

C ₁₂ H ₂₅ Si (OCH ₃ ) ₃

C ₁₂ H ₂₅ Si (OC ₂ H ₅ ) ₃

C ₁₀ H ₂₁ Si (CH ₃ ) (OCH ₃ ) ₂

C ₁₀ H ₂₁ Si (C ₆ H ₅ ) (OCH ₃ ) ₂

C ₁₀ H ₂₁ Si (CH ₃ ) (OC ₂ H ₅ ) ₂

C ₁₀ H ₂₁ Si (CH = CH ₂ ) (OCH ₃ ) ₂

C ₁₀ H ₂₁ Si (CH ₂ CH ₂ CF ₃ ) (OCH ₃ ) ₂

 The addition amount is the range of 0.01-20 weight part with respect to 100 weight part of thermoplastic silicone resins, More preferably, it is the range of 0.1-10 weight part. If the organosilane is added in an amount of less than 0.1 part by weight, the wettability of the thermally conductive filler will be insufficient, and workability will be lowered.

As an optional component, the additive or filler normally used for a synthetic rubber can be further used for the thermosoftening thermally conductive member of this invention in the range which does not impair the objective of this invention. Specifically, a fluorine-modified silicone surfactant as a releasing agent, carbon black, titanium dioxide, iron red oxide, etc., as a colorant, a metal oxide such as platinum catalyst, iron oxide, titanium oxide, cerium oxide, or a metal hydroxide as a flame retardant, or a metal hydroxide, as a workability improving agent. Essential oils, reactive silanes, siloxanes and the like may also be added. In addition, a fine silica powder such as precipitated silica or calcined silica, a thixotropic improving agent, or the like may be optionally added as a separation inhibitor at high temperature.

The thermosoftening thermally conductive member of the present invention can be easily manufactured by compounding and kneading each of the above components at a temperature higher than the softening temperature of the thermoplastic silicone resin using a mixer such as a dough mixer, a gate mixer, a planetary mixer, or the like. Can be.

The present invention is usually used by molding into a sheet. As a method of shape | molding in a sheet form, a thermosoftenable heat conductive material can be shape | molded by extrusion molding, calender roll shaping | molding, crimping | molding, or coating shaping | molding of the material melt | dissolved in the organic solvent. The thickness of this sheet is preferably in the range of 0.01 to 2 mm, in particular in the range of 0.02 to 0.5 mm. If it is 0.01 mm or less, minute unevenness | corrugation of the surface of a heat generating electronic component or a heat dissipation component cannot be buried, contact heat resistance becomes large, and when it exceeds 2 mm, heat transfer property worsens.

In addition, the present invention can improve the handling workability by using in the form as shown in FIG. That is, the heat-softening thermally conductive member 3 of the present invention separates the separation film 2 between the separation film 1 which is easy to peel off continuously on the continuous tape and the separation film 2 which is slightly difficult to cut to a certain shape. It is cut in the same shape as and continuously arranged. As a method of use, by pulling out the pull tab tape 4 adhered to the separating film 2, the thermosoftening thermal conductive member is peeled off from the separating film 1 to be transferred to the separating film 2 side, and this thermal softening thermal conductive By sticking the surface of the member to the heat generating electronic component or the heat dissipating component, the pull tab tape 4 is pulled out and the separation film 2 is peeled off, so that the thermosoftening thermal conductive member can be easily installed at a predetermined place.

<Examples>

[Examples 1 to 6 and Comparative Examples 1 to 5]

Hereinafter, although an Example demonstrates this invention still in detail, this invention is not limited by this.

First, the following components which comprise the thermosoftening thermally conductive member of this invention were prepared.

(A) component thermoplastic silicone resin

A-1: D ₂₅ T ^Φ ₅₅ D ^Vi ₂₀ (molecular weight 3,300, softening point: 40 to 50 ° C.)

_{A-2: M 15 D 12} D Φ2 22 T Φ 51 ( molecular weight 9000, softening point: 90 to 100 ℃)

However, D is Me ₂ SiO _2/2, T ^Φ is PhSiO _3/2, D ^Vi is ViMeSiO _2/2, M are Me ₃ SiO _1/2, D ^Φ2 is Ph ₂ SiO _2/2, Me is a methyl group And Ph represent a phenyl group and Vi represents a vinyl group, respectively. In addition, each ratio is mol%.

(B) Component Aluminum Powder

B-1: aluminum powder with an average particle diameter of 7.0 μm

B-2: aluminum powder with an average particle diameter of 22 µm

B-3: aluminum powder with an average particle diameter of 1.5 µm

B-4: aluminum powder with an average particle diameter of 75 µm                     

(C) component zinc oxide powder

C-1: Zinc oxide powder with an average particle diameter of 0.5 micrometer

(D) Component Other Additives

D-1: Phenyl group-containing silicone oil KF-54 having a viscosity of 0.4 Pa · s at 25 ° C (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)

D-2: Alkoxysilane C ₁₀ H ₂₁ Si (OCH ₃ ) ₃ KBM3103 represented by the following composition (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.)

<Method for Manufacturing Thermosoftening Thermally Conductive Member>

20 parts by weight of the thermoplastic silicone resin as the component (A), the other additive as the component (D) and toluene were added to a planetary mixer in the formulation of Table 1 below, and stirred and mixed at room temperature for 20 minutes to obtain a uniform solution. Next, the aluminum powder which is (B) component, and the zinc oxide powder which is (C) component were put into the compound of Table 1, and it stirred and mixed at room temperature for 1 hour. The obtained composition solution was also diluted to 250 parts by weight of toluene and then coated on a separating film (2) made of PET (polyethylene terephthalate) to which a release agent slightly difficult to peel was applied using a comma coater. Next, the toluene was volatilized off by passing through a drying furnace at a temperature of 80 ° C. for 5 minutes, and then the PET separation film 1 coated with a release agent, which was slightly easy to peel off, was pressed and adhered with a heat roll at a temperature of 90 ° C. . The thickness of the completed thermosoftening thermally conductive member was 100 µm.

The both sides obtained by the above process were slitted to a tape shape by slitting the thermosoftening thermally conductive member 3 sandwiched between the separating film 1 that was slightly easy to peel and the separating film 2 that was slightly peeled to a width of 25 mm. While sticking the pull tab tape 4 to the separation film 2 which is slightly difficult to peel off, the pull tab tape, the separation film 2 and the thermosoftening thermally conductive member are cut at a position of 25 mm in length, and the peeling is slightly easy The film 1 was made into the product form of FIG. 1 by leaving it on tape.

<Evaluation method>

(1) thickness and heat resistance

The above-mentioned thermosoftening thermally conductive member was sandwiched between two standard aluminum plates, and heated at 100 ° C. for 10 minutes while applying a pressure of about 0.14 MPa. Next, the thickness was measured for every two standard aluminum plates, and the actual thickness of the sheet | seat was measured by subtracting the thickness of the standard aluminum plate which knows thickness previously. In addition, the micrometer (Mitsutoyo Corporation make, model: M820-25VA) was used for the thickness measurement. In addition, the heat resistance of the thermosoftening thermally conductive member was measured using a microflash measuring instrument (manufactured by Netgege Leytebau Co.).

(2) softening point

It was measured by JIS K 7206 vicat softening temperature test method.

(3) handleability

The mountability to the heat dissipation plate in the form of the product of Figure 1 was manually evaluated.

◎: Very good ○: Good Δ: Almost good ×: Poor

These evaluation results are shown in Table 1 below.                     

Comparative Example

A thermosoftening thermally conductive member was manufactured in the same manner as in Examples 1 to 6, using each component of Table 2 instead of each component of Table 1. The results of evaluating these in the same manner as in Examples 1 to 6 are shown in Table 2.                     

 The result of Table 1 and Table 2 demonstrates that the thermosoftening thermal conductive member of this invention is excellent in heat transfer property and handleability.

Since the thermal softening thermally conductive member of the present invention has good thermal conductivity and good adhesion between the heat generating electronic component and the heat dissipating component, the heat softening thermal conductive member is interposed between the two components to dissipate heat generated from the heat generating electronic component with good efficiency. By dissipating into parts, it is possible to greatly improve the lifespan of a heat generating electronic part and an electronic device using the same.

Claims (5)

Separating film on continuous tape (1), Separation film (2) cut to size of a certain shape, A sheet-like thermosoftening thermally conductive member (3) having a thickness of 0.01 to 2 mm disposed continuously between the separation film (1) and the separation film (2) in a state cut into the same shape as the separation film (2). , And Pull tab tape (4) adhered to the separation film (2) And, The sheet-like thermosoftening thermally conductive member 3 is (A) thermoplastic silicone resin, (B) an aluminum powder having an average particle diameter of 1 to 50 µm, and (C) Zinc oxide powder with an average particle diameter of 0.1-5 micrometers (However, the sum total of (B) component and (C) component is 400-1200 weight part with respect to 100 mass parts of (A) component, and (B) component and ( The weight ratio of component C) is in the range of component (B) / component (C) = 1 to 10) Comprising a composition containing It is not fluid at room temperature, has a property of low viscosity, softens or melts at a temperature of 40 to 100 ° C., and is a thermally conductive member disposed between a heat generating electronic component and a heat dissipating component, Moreover, when the peeling force with respect to the said sheet-like thermosoftening thermally conductive member 3 of the said 2 types of separation films 1 and 2 satisfy | fills following formula (1), By pulling the pull tab tape 4, the sheet-like thermosoftening thermally conductive member 3 is peeled off from the separating film 1 and shifted to the separating film 2 side, and the sheet-like thermosoftening thermally conductive member By adhering (3) to the heat generating electronic component or the heat dissipating component, the pull film tape 4 is pulled out, and the separation film 2 is peeled from the sheet-like thermosoftening thermally conductive member 3 to thereby release the sheet-like thermosetting. A product for installing a sheet-like thermosoftening thermally conductive member, wherein the thermally conductive member 3 can be installed at a predetermined place of a heat generating electronic component or a heat dissipating component. &Quot; (1) &quot;

The thermoplastic silicone resin as the component (A) according to claim 1, wherein the thermoplastic silicone resin as component (A) comprises R ¹ SiO _3/2 units (T units) and R ¹ ₂ SiO _2/2 units (D units) (wherein R ¹ has 1 to 10 carbon atoms). It is an unsubstituted or substituted monovalent hydrocarbon.) The product for installing a sheet-like thermosoftening conductive member. The sheet form according to claim 1 or 2, wherein a part of the thermoplastic silicone resin as the component (A) is substituted with 0 to 45 parts by weight of a silicone oil or silicone raw rubber having a viscosity of 0.2 Pa.s or more at 25 ° C. Products for installing thermosoftening thermally conductive members. The sheet-forming thermosoftening member for mounting a sheet according to claim 1 or 2, further comprising 0 to 20 parts by weight of the alkoxysilane represented by the following formula (1) in the composition comprising the components (A) to (C). product. <Formula 1> R ² _a R ³ _b Si (OR ⁴ ) _4-ab In the formula, R ² is an alkyl group having 6 to 15 carbon atoms, R ³ is a monovalent hydrocarbon group having 1 to 8 carbon atoms, R ⁴ is an alkyl group having 1 to 6 carbon atoms, a is an integer of 1 to 3, b is It is an integer of 0-2, and a + b is an integer of 1-3. delete

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