TWI224131B - Heat-removing interfacial agent - Google Patents

Abstract

A heat-removing interfacial agent consists of micron-graded and nanon-graded diamond powder, which forms the major composition of the agent, highly heat-conducting substances, and bonding agent. The nanon-graded diamond powder is filled in the spaces between the particles of the micron-graded diamond powder to reduce the clearances between the particles of the heat-removing interfacial agent and thereby increase the thermal conductivity of the agent. Since the diamond powder has a thermal conductivity four times as high as that of silver powder and is electrically non-conductive, the heat-removing interfacial agent consisting of diamond powder may have a thermal conductivity as high as 10-15 W/mK and is electrically non-conductive, and can quickly transfer the high amount of heat produced by, for example, an electronic microprocessor to radiating fins to provide an excellent heat-removing effect.

Description

1224131 V. Description of the invention (1) [Background of the invention] The present invention relates to a heat dissipation interface agent, which is used between a heat sink and a heat sink, and can quickly conduct the heat of the heat sink to the heat sink to reduce the heat sink. The temperature of the heat sink prevents the heat sink from malfunctioning due to overheating. According to the electrical products such as computers and electronics, when performing their intended functions, the electronic components installed in them will consume due power. For example, the same is true of computer products, and the most power-consuming ones are electronic microprocessors (I / 0 Processor Unit, CPU, GPU ...). The electronic microprocessor will generate extremely high temperature and heat during operation. The high heat must be effectively dissipated, otherwise the electronic microprocessor may easily crash or burn out. The high heat generated by the electronic microprocessor described above will be concentrated in its die (Die). Generally, the heat dissipation method of the electronic microprocessor is to coat or paste a heat-dissipating interface agent on the surface of the Die. Then, the heat sink is clamped on the heat sink with a fastener, and a heat sink fan is further provided. According to this, the high heat generated by the electronic microprocessor will be conducted to the heat sink through the heat dissipating agent, and then the high heat belt will be blown away by the heat dissipating fan to achieve heat dissipation. Therefore, the factors that affect the heat dissipation effect of the electronic microprocessor are nothing more than a cooling fan, a buckle, a heat sink, and a heat sink. In the past, the improvement of the heat dissipation effect of electronic microprocessors in the industry mostly focused on the improvement of cooling fans and fasteners, among which there were few innovations and improvements on heat dissipation interface agents. However, the heat-dissipating interface agent is the first-line factor that affects the heat-dissipating effect of the electronic microprocessor. If the heat-dissipating effect of the heat-dissipating interface agent is not good, then the heat-dissipating effect of the heat sink and the cooling fan cannot be exerted.

1224131 V. Description of the invention (2), the importance of the effect of the thermal interface agent on the thermal effect of the electronic microprocessor. At present, the general heat-dissipating interface agent contains a high proportion (above 50 Vo 1%) of a thermally conductive binding agent (such as epoxy resin, acid resin, stone rubber, etc.). The thermal conductivity of this bonding agent is generally lW / mK In the following, its thermal conductivity is not good, and it can not exert high-efficiency heat dissipation effect for electronic microprocessors. In view of this, some thermal interface agents are added with high thermal conductivity materials such as silver, copper, etc. Although the thermal conductivity of this thermal interface agent can be increased to 6-10 W / mK, but due to the conductivity of metals such as silver and copper It will affect the short circuit of the electronic microprocessor Die, so it is not a good thermal interface agent. [Overview of Invention]

The present invention is based on the above-mentioned defects of the general heat-dissipating interface agent, and is improved, and provides an innovative composition of the heat-dissipating interface agent, which includes diamond powder, high thermal conductivity material, and a binding agent. The diamond powder is the main component. The nano-sized diamond powder is filled in the micron-sized diamond powder to reduce the gap between the particles of the heat-dissipating interface agent and increase the thermal conductivity of the heat-dissipating interface agent. It is more than 4 times of silver powder and is non-conductive, so the thermal conductivity of the heat-dissipating interface agent of the present invention can reach 1 0-1 5W / mK and is non-conductive, which can quickly transfer the high heat generated by the electronic microprocessor to the heat sink, which has extremely Excellent heat dissipation effect. [Detailed description of the invention]

The composition and effects of the present invention are described in more detail with reference to the following examples. The heat-dissipating interface agent of the present invention comprises diamond powder, a highly thermally conductive material, and

Page 8 1224131 V. Description of the invention (3)-and binding agent. The diamond powder is micron- and nano-sized diamond powder particles with a content of 30-9 0 V ο 1%; the high thermal conductivity material is at least one of graphite, carbon black, soot powder, etc., and the content is 0. -20 Vol%; The above binding agent is at least one of glycerin, olive oil, stone oil, stearic acid, etc., and the content is 10-50 Vo 1%. The diamond powder, high thermal conductivity material, and binding agent are mixed in the most densely packed ratio, and then pressed into a patch shape or > directly pressed into a paste or printed without pressure, such as used in electronic micro Between the processor Die and its heat sink. -The main component of the heat-dissipating interface agent of the present invention is diamond powder. The diamond powder is micron- and nano-level diamond powder. The nano-level diamond powder φ can be filled in the space of the micron-level diamond powder to reduce the heat-dissipating interface. The gap between the particles of the agent can increase the thermal conductivity of the heat-dissipating interface agent. Since the thermal conductivity of the diamond powder is more than 4 times that of the conventional general heat-dissipating agent silver powder and is non-conductive, the thermal conductivity of the heat-dissipating interface agent of the present invention can reach 10 -15W / mK and non-conductive, therefore, the high heat generated by the electronic microprocessor Die can be quickly conducted to the heat sink, which has an excellent heat dissipation effect to maintain the normal operation of the electronic microprocessor and the electronic microprocessing Normal service life. In summary, the composition of the heat-dissipating interface agent of the present invention is extremely innovative, and has excellent thermal conductivity, which can quickly transfer the high heat generated by the heat-dissipating material to its heat sink, so that it can quickly dissipate heat. The composition of the heat-dissipating interface agent of the present invention is not found in conventional heat-dissipating interface agents, and has industrial applicability. It meets the requirements of the invention patent. Please grant the invention patent protection.

Page 9 1224131 Schematic description Page 10

Claims (1)

1224131 1. A thermal interface agent comprising: diamond powder, the diamond powder is micron and nano diamond powder particles, the diamond powder content is 30-9 0 Vo 1 ° / 〇; South thermal conductivity material, the South thermal conductivity The material is at least one of graphite, obstructing black, sooty powder, etc., the high thermal conductivity material content is 0-2OVol%; and a binding agent, the binding agent is at least one of glycerin, olive oil, paraffin oil, stearic acid, etc. One, the binder content is 10-50 Vo 1%. 2. The thermal interface agent according to item 1 or item 2 of the scope of the patent application, wherein the diamond powder, the highly thermally conductive material, and the bonding agent are mixed at the densest packing ratio, and then pressed into a paste. Clothlike person. 3. The heat-dissipating interface agent according to item 1 or item 2 of the scope of the patent application, wherein the diamond powder, the highly thermally conductive material, and the bonding agent are mixed at the most densely packed ratio and directly formed without pressure. Pasty. 4. The thermal interface agent according to item 1 or item 2 of the scope of the patent application, wherein the diamond powder, the highly thermally conductive material, and the bonding agent are mixed in the densest packing ratio and directly supplied for printing. user.