TWI339996B - Substrate adhesion apparatus and method for sealing organic light emitting display using the same - Google Patents
Substrate adhesion apparatus and method for sealing organic light emitting display using the sameInfo
- Publication number
- TWI339996B TWI339996B TW095147856A TW95147856A TWI339996B TW I339996 B TWI339996 B TW I339996B TW 095147856 A TW095147856 A TW 095147856A TW 95147856 A TW95147856 A TW 95147856A TW I339996 B TWI339996 B TW I339996B
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- organic light
- same
- emitting display
- substrate adhesion
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060016446A KR100713987B1 (ko) | 2006-02-20 | 2006-02-20 | 기판 밀착장치 및 이를 이용한 유기전계발광 표시장치의밀봉방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200733787A TW200733787A (en) | 2007-09-01 |
TWI339996B true TWI339996B (en) | 2011-04-01 |
Family
ID=38269539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095147856A TWI339996B (en) | 2006-02-20 | 2006-12-20 | Substrate adhesion apparatus and method for sealing organic light emitting display using the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070197120A1 (zh) |
JP (1) | JP2007227343A (zh) |
KR (1) | KR100713987B1 (zh) |
TW (1) | TWI339996B (zh) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100673765B1 (ko) | 2006-01-20 | 2007-01-24 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
US8038495B2 (en) | 2006-01-20 | 2011-10-18 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display device and manufacturing method of the same |
KR100635514B1 (ko) | 2006-01-23 | 2006-10-18 | 삼성에스디아이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
JP4624309B2 (ja) * | 2006-01-24 | 2011-02-02 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
JP4456092B2 (ja) * | 2006-01-24 | 2010-04-28 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
KR100685853B1 (ko) * | 2006-01-25 | 2007-02-22 | 삼성에스디아이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
US8164257B2 (en) * | 2006-01-25 | 2012-04-24 | Samsung Mobile Display Co., Ltd. | Organic light emitting display and method of fabricating the same |
KR100671641B1 (ko) | 2006-01-25 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시장치 및 그 제조 방법 |
KR100688796B1 (ko) * | 2006-01-25 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 및 그의 제작 방법 |
KR100688795B1 (ko) * | 2006-01-25 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
KR100671647B1 (ko) * | 2006-01-26 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 |
JP4633674B2 (ja) | 2006-01-26 | 2011-02-16 | 三星モバイルディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
KR100671639B1 (ko) * | 2006-01-27 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시장치 및 그 제조 방법 |
KR100688790B1 (ko) * | 2006-01-27 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시장치 및 그 제조 방법 |
KR100732817B1 (ko) | 2006-03-29 | 2007-06-27 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
KR100837618B1 (ko) * | 2006-12-29 | 2008-06-13 | 주식회사 엘티에스 | 유리기판의 밀봉시스템 및 밀봉방법 |
US7883389B2 (en) | 2007-02-08 | 2011-02-08 | Copytele, Inc. | Apparatus and method for rapid sealing of a flat panel display |
US20090203283A1 (en) * | 2008-02-07 | 2009-08-13 | Margaret Helen Gentile | Method for sealing an electronic device |
KR100937864B1 (ko) * | 2008-03-14 | 2010-01-21 | 삼성모바일디스플레이주식회사 | 프릿 실링 시스템 |
JP5308717B2 (ja) | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
JP5308718B2 (ja) * | 2008-05-26 | 2013-10-09 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
US8839643B2 (en) | 2008-06-11 | 2014-09-23 | Hamamatsu Photonics K.K. | Fusion bonding process for glass |
KR101665727B1 (ko) | 2008-06-11 | 2016-10-12 | 하마마츠 포토닉스 가부시키가이샤 | 유리 용착 방법 |
WO2009157282A1 (ja) | 2008-06-23 | 2009-12-30 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
KR101045248B1 (ko) * | 2009-02-10 | 2011-06-30 | 엘아이지에이디피 주식회사 | 기판 분리장치, 기판 분리방법, 미세패턴 형성장치 및 미세패턴 형성방법 |
US8860305B2 (en) | 2009-07-09 | 2014-10-14 | Corning Incorporated | Methods for forming fritted cover sheets with masks and glass packages comprising the same |
US9555516B2 (en) | 2009-07-24 | 2017-01-31 | Corning Incorporated | Method for processing an edge of a glass plate |
JP5481167B2 (ja) | 2009-11-12 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法 |
JP5535590B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5535588B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5535589B2 (ja) | 2009-11-25 | 2014-07-02 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5466929B2 (ja) | 2009-11-25 | 2014-04-09 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5481173B2 (ja) | 2009-11-25 | 2014-04-23 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
JP5567319B2 (ja) | 2009-11-25 | 2014-08-06 | 浜松ホトニクス株式会社 | ガラス溶着方法及びガラス層定着方法 |
TWI497466B (zh) * | 2010-03-19 | 2015-08-21 | Asahi Glass Co Ltd | Electronic device and manufacturing method thereof |
JP2012121315A (ja) * | 2010-12-07 | 2012-06-28 | Apro System Co Ltd | エアープレッシングによるラミネーティング装置及びそのラミネーティング方法 |
KR20120070762A (ko) * | 2010-12-22 | 2012-07-02 | 아프로시스템 주식회사 | 기포제거용 가압장치 및 방법 |
JPWO2012117978A1 (ja) * | 2011-02-28 | 2014-07-07 | 旭硝子株式会社 | 気密部材とその製造方法 |
KR102145887B1 (ko) * | 2013-08-09 | 2020-08-20 | 삼성디스플레이 주식회사 | 프릿 실링 시스템 |
CN104037196B (zh) * | 2014-05-29 | 2017-06-27 | 京东方科技集团股份有限公司 | 一种发光显示面板及其制作方法 |
KR102132435B1 (ko) * | 2018-12-26 | 2020-07-09 | 주식회사 에스에프에이 | 오엘이디(oled) 기판용 봉지장치 |
KR20200082504A (ko) * | 2018-12-28 | 2020-07-08 | 엘지디스플레이 주식회사 | 조명 장치 |
CN117729795B (zh) * | 2024-02-07 | 2024-05-03 | 惠科股份有限公司 | 封装排水汽装置、显示面板的封装方法以及显示装置 |
CN117729794B (zh) * | 2024-02-07 | 2024-05-03 | 惠科股份有限公司 | 封装排水汽装置、显示面板的封装方法以及显示装置 |
CN117729793B (zh) * | 2024-02-07 | 2024-05-03 | 惠科股份有限公司 | 封装排水汽装置、显示面板的封装方法以及显示装置 |
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US4238704A (en) * | 1979-02-12 | 1980-12-09 | Corning Glass Works | Sealed beam lamp of borosilicate glass with a sealing glass of zinc silicoborate and a mill addition of cordierite |
JPS60216333A (ja) * | 1984-04-12 | 1985-10-29 | Asahi Glass Co Ltd | エレクトロクロミツク表示素子 |
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JPH04147217A (ja) * | 1990-10-11 | 1992-05-20 | Hitachi Ltd | 液晶表示素子セルの加圧装置 |
JPH0634983A (ja) * | 1992-07-17 | 1994-02-10 | Sharp Corp | 貼合わせ装置 |
JPH06337429A (ja) * | 1993-05-27 | 1994-12-06 | M B K Maikurotetsuku:Kk | 液晶セル用のプレスおよびアラインメント装置 |
JP3120669B2 (ja) * | 1994-11-16 | 2000-12-25 | ウシオ電機株式会社 | 液晶パネルの貼り合わせ方法 |
JPH08146436A (ja) * | 1994-11-16 | 1996-06-07 | Ushio Inc | 液晶パネルの貼り合わせ方法および装置 |
JP3169864B2 (ja) * | 1997-09-18 | 2001-05-28 | 日本電気株式会社 | 液晶パネル製造装置 |
JP3024609B2 (ja) * | 1997-10-09 | 2000-03-21 | 日本電気株式会社 | 液晶表示素子セルの封孔装置 |
KR100480146B1 (ko) * | 1999-10-30 | 2005-04-06 | 엘지.필립스 엘시디 주식회사 | 액정표시소자의 제조장치 및 방법 |
US6555025B1 (en) * | 2000-01-31 | 2003-04-29 | Candescent Technologies Corporation | Tuned sealing material for sealing of a flat panel display |
JP2002169135A (ja) * | 2000-09-07 | 2002-06-14 | Seiko Epson Corp | セルギャップ調整装置、加圧封止装置及び液晶表示装置の製造方法 |
KR100720414B1 (ko) * | 2002-02-27 | 2007-05-22 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치의 제조 방법 |
JP2004151656A (ja) * | 2002-11-01 | 2004-05-27 | Seiko Epson Corp | 電気光学装置の製造方法および製造装置、並びに電気機器 |
JP4299021B2 (ja) * | 2003-02-19 | 2009-07-22 | ヤマト電子株式会社 | 封着加工材及び封着加工用ペースト |
US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
US7371143B2 (en) * | 2004-10-20 | 2008-05-13 | Corning Incorporated | Optimization of parameters for sealing organic emitting light diode (OLED) displays |
KR20060058503A (ko) * | 2004-11-25 | 2006-05-30 | 엘지전자 주식회사 | 캡 부착 장치 |
-
2006
- 2006-02-20 KR KR1020060016446A patent/KR100713987B1/ko active IP Right Grant
- 2006-08-16 JP JP2006222065A patent/JP2007227343A/ja active Pending
- 2006-09-29 US US11/529,883 patent/US20070197120A1/en not_active Abandoned
- 2006-12-20 TW TW095147856A patent/TWI339996B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2007227343A (ja) | 2007-09-06 |
TW200733787A (en) | 2007-09-01 |
US20070197120A1 (en) | 2007-08-23 |
KR100713987B1 (ko) | 2007-05-04 |
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