TWI330570B - Polishing apparatus - Google Patents

Polishing apparatus Download PDF

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Publication number
TWI330570B
TWI330570B TW093130978A TW93130978A TWI330570B TW I330570 B TWI330570 B TW I330570B TW 093130978 A TW093130978 A TW 093130978A TW 93130978 A TW93130978 A TW 93130978A TW I330570 B TWI330570 B TW I330570B
Authority
TW
Taiwan
Prior art keywords
substrate
semiconductor wafer
holding device
substrate holding
fluid
Prior art date
Application number
TW093130978A
Other languages
English (en)
Chinese (zh)
Other versions
TW200528234A (en
Inventor
Hiroomi Torii
Takuji Hayama
Tetsuya Yashima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200528234A publication Critical patent/TW200528234A/zh
Application granted granted Critical
Publication of TWI330570B publication Critical patent/TWI330570B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093130978A 2003-10-17 2004-10-13 Polishing apparatus TWI330570B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003358593A JP2005123485A (ja) 2003-10-17 2003-10-17 研磨装置

Publications (2)

Publication Number Publication Date
TW200528234A TW200528234A (en) 2005-09-01
TWI330570B true TWI330570B (en) 2010-09-21

Family

ID=34463311

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130978A TWI330570B (en) 2003-10-17 2004-10-13 Polishing apparatus

Country Status (7)

Country Link
US (2) US7445543B2 (enrdf_load_stackoverflow)
EP (1) EP1673201B1 (enrdf_load_stackoverflow)
JP (1) JP2005123485A (enrdf_load_stackoverflow)
KR (1) KR101088784B1 (enrdf_load_stackoverflow)
CN (2) CN100563926C (enrdf_load_stackoverflow)
TW (1) TWI330570B (enrdf_load_stackoverflow)
WO (1) WO2005037488A1 (enrdf_load_stackoverflow)

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JP2007234882A (ja) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板取り扱い方法
JP4927634B2 (ja) * 2007-04-18 2012-05-09 株式会社ディスコ 移送装置
JP5248127B2 (ja) 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
KR101036605B1 (ko) * 2008-06-30 2011-05-24 세메스 주식회사 기판 지지 유닛 및 이를 이용한 매엽식 기판 연마 장치
JP5390807B2 (ja) 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5254832B2 (ja) * 2009-02-04 2013-08-07 株式会社ディスコ ウェーハ保持機構
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8524035B2 (en) * 2009-11-30 2013-09-03 Corning Incorporated Method and apparatus for conformable polishing
US8148266B2 (en) * 2009-11-30 2012-04-03 Corning Incorporated Method and apparatus for conformable polishing
WO2012016477A1 (zh) 2010-08-05 2012-02-09 清华大学 化学机械抛光机及具有它的化学机械抛光设备
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
JP5875950B2 (ja) 2012-06-29 2016-03-02 株式会社荏原製作所 基板保持装置および研磨装置
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
JP5856546B2 (ja) * 2012-07-11 2016-02-09 株式会社荏原製作所 研磨装置および研磨方法
DE102012212249B4 (de) * 2012-07-12 2016-02-25 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes und eines Halbleitermoduls
US9199354B2 (en) * 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
JP6027454B2 (ja) * 2013-02-05 2016-11-16 株式会社荏原製作所 研磨装置
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9355882B2 (en) * 2013-12-04 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Transfer module for bowed wafers
CN103730401A (zh) * 2013-12-24 2014-04-16 苏州市奥普斯等离子体科技有限公司 一种改进型芯片夹持装置
CN104907922A (zh) * 2014-03-11 2015-09-16 上海华虹宏力半导体制造有限公司 基座及其中防止硅片出现x型缺陷的去离子水控制装置
JP6032234B2 (ja) 2014-03-19 2016-11-24 信越半導体株式会社 ワーク保持装置
JP2016043442A (ja) * 2014-08-21 2016-04-04 株式会社荏原製作所 研磨装置
US9539699B2 (en) 2014-08-28 2017-01-10 Ebara Corporation Polishing method
JP6225088B2 (ja) 2014-09-12 2017-11-01 株式会社荏原製作所 研磨方法および研磨装置
KR101580102B1 (ko) * 2015-02-10 2015-12-28 장경덕 수압을 이용한 웨이퍼 이면 연마장치
US10464185B2 (en) * 2016-03-15 2019-11-05 Ebara Corporation Substrate polishing method, top ring, and substrate polishing apparatus
JP6427131B2 (ja) * 2016-03-18 2018-11-21 株式会社荏原製作所 研磨装置および研磨方法
KR102331075B1 (ko) * 2017-03-17 2021-11-25 주식회사 케이씨텍 기판 처리 장치
JP6990980B2 (ja) 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
CN107671714B (zh) * 2017-09-27 2024-01-30 宜华生活科技股份有限公司 一种板件自动上料装置
KR102385573B1 (ko) * 2017-12-13 2022-04-12 삼성전자주식회사 로드 컵 및 이를 포함하는 화학기계적 연마 장치
JP7074607B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 研磨装置用の治具
CN109249309B (zh) * 2018-11-10 2024-03-08 宇晶机器（长沙）有限公司 连续式多工位抛光机真空管路自清洗控制系统
CN109048662B (zh) * 2018-11-10 2024-03-15 宇晶机器（长沙）有限公司 连续式多工位抛光机真空吸附管路系统
JP7529544B2 (ja) * 2020-11-20 2024-08-06 株式会社東京精密 プローバの故障検知方法及びその故障検知装置
JP7715464B2 (ja) * 2021-09-02 2025-07-30 東京エレクトロン株式会社 基板処理装置
JP7682126B2 (ja) * 2022-04-22 2025-05-23 三菱電機株式会社 半導体装置の製造方法及び成型プレス機
CN116207009B (zh) * 2022-12-30 2023-10-27 江苏福旭科技有限公司 一种单晶硅片刻蚀抛光设备
CN117161950B (zh) * 2023-11-02 2023-12-26 南通海鹰机电集团有限公司 一种用于压力容器制造的抛光装置
CN120228607B (zh) * 2025-06-03 2025-08-19 北京特思迪半导体设备有限公司 用于方形基板抛光的压板、囊膜、抛光压头、设备及方法

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US6358128B1 (en) 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
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Also Published As

Publication number Publication date
CN1867424A (zh) 2006-11-22
US20060292967A1 (en) 2006-12-28
EP1673201A1 (en) 2006-06-28
CN101670547A (zh) 2010-03-17
CN101670547B (zh) 2012-07-25
US20090068935A1 (en) 2009-03-12
KR101088784B1 (ko) 2011-12-01
JP2005123485A (ja) 2005-05-12
WO2005037488A1 (en) 2005-04-28
KR20070017973A (ko) 2007-02-13
TW200528234A (en) 2005-09-01
EP1673201B1 (en) 2014-07-02
US7942725B2 (en) 2011-05-17
CN100563926C (zh) 2009-12-02
US7445543B2 (en) 2008-11-04

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