TWI328830B - - Google Patents

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Publication number
TWI328830B
TWI328830B TW095139220A TW95139220A TWI328830B TW I328830 B TWI328830 B TW I328830B TW 095139220 A TW095139220 A TW 095139220A TW 95139220 A TW95139220 A TW 95139220A TW I328830 B TWI328830 B TW I328830B
Authority
TW
Taiwan
Prior art keywords
solvent
coating
liquid
recovered
recovery system
Prior art date
Application number
TW095139220A
Other languages
English (en)
Chinese (zh)
Other versions
TW200723357A (en
Inventor
Yoshiaki Masu
Shinji Takase
Atsuo Kajima
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200723357A publication Critical patent/TW200723357A/zh
Application granted granted Critical
Publication of TWI328830B publication Critical patent/TWI328830B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW095139220A 2005-11-30 2006-10-24 Solvent recovery system TW200723357A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005346376A JP4901200B2 (ja) 2005-11-30 2005-11-30 溶剤回収システム

Publications (2)

Publication Number Publication Date
TW200723357A TW200723357A (en) 2007-06-16
TWI328830B true TWI328830B (ja) 2010-08-11

Family

ID=38124854

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139220A TW200723357A (en) 2005-11-30 2006-10-24 Solvent recovery system

Country Status (4)

Country Link
JP (1) JP4901200B2 (ja)
KR (1) KR100826772B1 (ja)
CN (1) CN1974459B (ja)
TW (1) TW200723357A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4982306B2 (ja) * 2007-09-05 2012-07-25 大日本スクリーン製造株式会社 塗布装置および塗布方法
CN102181070B (zh) * 2011-03-25 2012-10-10 泰安赛露纤维素醚科技有限公司 纤维素醚生产溶剂循环蒸发工艺
JP5293790B2 (ja) * 2011-09-22 2013-09-18 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5871646B2 (ja) * 2012-02-13 2016-03-01 東レエンジニアリング株式会社 減圧乾燥装置および減圧乾燥方法
CN103406233B (zh) * 2013-08-26 2015-11-25 深圳市华星光电技术有限公司 一种面板涂胶装置
CN108692526B (zh) * 2018-05-22 2019-09-24 深圳市华星光电半导体显示技术有限公司 真空干燥及溶剂回收装置
CN110843354A (zh) * 2019-10-21 2020-02-28 深圳市华星光电技术有限公司 真空干燥装置
CN116392830B (zh) * 2023-04-11 2024-01-05 常州市范群干燥设备有限公司 一种干燥设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3408895B2 (ja) * 1995-06-16 2003-05-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2002038272A (ja) * 2000-07-25 2002-02-06 Hitachi Kokusai Electric Inc 基板処理装置
EP1293589A3 (en) * 2001-09-17 2004-10-13 Nissan Motor Company, Limited Apparatus for pretreatment prior to painting
KR20030062143A (ko) * 2002-01-16 2003-07-23 삼성전자주식회사 피처리물의 처리 방법 및 장치
JP3859211B2 (ja) * 2002-05-28 2006-12-20 東京エレクトロン株式会社 捕集装置、捕集方法及び減圧処理装置
JP3877719B2 (ja) * 2002-11-07 2007-02-07 東京応化工業株式会社 スリットコータの予備吐出装置

Also Published As

Publication number Publication date
KR100826772B1 (ko) 2008-04-30
TW200723357A (en) 2007-06-16
KR20070056939A (ko) 2007-06-04
CN1974459A (zh) 2007-06-06
CN1974459B (zh) 2011-01-19
JP2007152146A (ja) 2007-06-21
JP4901200B2 (ja) 2012-03-21

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